FAW Group and Tsinghua Unigroup have agreed on a strategic partnership in Beijing to enhance cooperation in China's automotive semiconductor industry.

The agreement involves collaboration on domestic chip application, supply chain development, joint research and development initiatives, chip ecosystem construction, and market-driven collaboration. By combining their strengths, the two organizations aim to improve supply-demand alignment and industrial synergy.

The partnership will focus on developing a robust automotive-grade chip ecosystem, including chip design, wafer fabrication, packaging and testing, application selection, and integrated system solutions. Through joint projects, technological breakthroughs and capital cooperation, they aim to set a benchmark for collaboration between the chip and automotive industries.

This content may be AI-assisted and is composed, reviewed, edited and approved by S&P Global.