Infineon-managed ESiP project develops highly integrated system-in-package solutions
Miniaturised SiPs could be used in EVs
Researchers of the Infineon-managed Efficient Silicon Multi-Chip System-in-Package Integration (ESiP) project in Europe have developed a highly integrated system-in-package solution that offers miniaturisation of microelectronic systems, says a press release. A team of 40 research partners —microelectronics companies and research institutions
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