Bosch to set up new semiconductor fab in Germany
Plant is expected to begin operations by end of 2021
Bosch will invest around EUR1 billion (USD1.12 billion) in a new semiconductor fabrication plant (fab) in Dresden, eastern Germany, the company said in a press release today (19 June). The new plant will produce chips based on 12-inch wafers for Internet of Things (IOT) and mobility applications. The company expects the construction of the proposed plant to be completed by 2019. The plant is expected to begin operations by the end of 2021. The investment is expected to result in 700 new jobs in Dresden.
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