NXP unveils RoadLINK V2X evaluation kit 2.0
New kit provides full featured solution for the development of secure V2X OBUs
NXP Semiconductors has unveiled RoadLINK vehicle-to-everything (V2X) Evaluation kit 2.0, the Netherlands-based automotive electronics supplier said in a press release last week. According to the company, the new kit includes an integrated V2X development platform that addresses global market based on NXP’s SAF5400 single chip modem and optional SXF1800 secure element.
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