Xperi, Tower Semiconductor announce license for 3D semiconductor interconnect technologies
New technology license will support manufacturing of time of flight and advanced sensors for autonomous vehicles and other applications
Xperi Holding Corp and Tower Semiconductor have announced license of Invensas ZiBond and DBI 3D semiconductor interconnect technologies, a press release dated 10 June read.
Thank you for visiting S&P Global AutoTechInsight.
*A subscription to News & Analysis includes four S&P Global-selected sector-specific analytical pieces per month. Access to all analytic pieces across all domains comes with a subscription to All Domains. Please click here to subscribe.
To get access to the AutoTechInsight full suite of services, please contact a sales representative by clicking here.
Already a subscriber? Please log in here
