Toposens uses Infineon’s MEMS microphone in new ultrasonic 3D sensor
Toposens offers customers ECHO ONE DK for an easier and more flexible evaluation of the sensor in their products
Toposens has partnered with Infineon Technologies to realize 3D obstacle detection and collision avoidance in autonomous systems using Toposens's proprietary 3D ultrasound technology, according to an official press release dated 12 November.
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