Infineon, Stellantis signs MoU on multiyear delivery of SiC chips
Infineon has planned to reserve manufacturing capacity and supply CoolSiC “bare die” chips in the second half of the decade to the direct tier-1 suppliers of Stellantis
Infineon Technologies and the global automaker Stellantis have signed a non-binding Memorandum of Understanding (MoU) as a first step towards a potential multiyear supply cooperation for silicon carbide (SiC) semiconductors, according to a press release by Infineon on 14 November 2022.
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