Texas Instruments breaks ground on new 300-mm semiconductor wafer fabrication plant in Utah, US
TI announced its $11 billion investment in Utah, US in February
Texas Instruments (TI) has announced that the company broke ground on its new 300-mm semiconductor wafer fabrication plant in Lehi, Utah, US, according to a press release on Nov. 2. Joined by Utah Governor Spencer Cox, state and local elected officials as well as community leaders, TI celebrated the first steps toward the construction of the new fabrication plant, LFAB2, which will connect to the company's existing 300-mm wafer fabrication plant in Lehi. Once completed, TI's two Utah fabrication plants will manufacture tens of millions of analog and embedded processing chips every day at full production.
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