Winbond issues statement on earthquake impact on operations in Taiwan
The seismic event triggered self-protection mechanisms in certain machinery at Winbond's CTSP Fab and Kaohsiung Fab facilities
In the wake of the powerful magnitude 7.2 earthquake that struck Taiwan's eastern region on April 3, Winbond, a major semiconductor manufacturer, has announced that its swift evacuation procedures ensured the safety of all personnel, avoiding any injuries, as reported in a press release on April 3.
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