Toshiba completes new 300-millimeter wafer fabrication facility for power semiconductors in Ishikawa Prefecture, Japan
The new manufacturing building follows and will make a major contribution to Toshiba’s business continuity plan
In a press release announcement May 23, Toshiba Electronic Devices & Storage Corp. held a ceremony to mark the completion of a new 300-millimeter wafer fabrication facility for power semiconductors and an office building at Kaga Toshiba Electronics Corp. in Ishikawa Prefecture.
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