Toshiba enhances silicon carbide trench MOSFETs and Schottky barrier diodes for power conversion efficiency
Toshiba's new technology reduces on-resistance, improves UIS ruggedness, and boosts power devices in EVs and renewable energy
According to a press release on June 9, Toshiba Electronic Devices & Storage Corp. has developed new technology that enhances silicon carbide (SiC) trench metal-oxide-semiconductor field-effect transistor (MOSFETs) and SiC semisuper junction (SJ) Schottky barrier diodes (SBDs) by reducing on-resistance and improving UIS ruggedness.
Thank you for visiting S&P Global AutoTechInsight.
*A subscription to News & Analysis includes four S&P Global-selected sector-specific analytical pieces per month. Access to all analytic pieces across all domains comes with a subscription to All Domains. Please click here to subscribe.
To get access to the AutoTechInsight full suite of services, please contact a sales representative by clicking here.
Already a subscriber? Please log in here