Applied Materials and CEA-Leti expand collaboration on specialty semiconductor innovation

News
Technology Trends
ATI News Team

The partnership focuses on developing solutions for infrastructure challenges in AI data centers and ICAPS markets

In a press release on June 16, Applied Materials and CEA-Leti announced an expanded phase of their collaboration, following a memorandum of understanding (MOU), aimed at accelerating innovation in specialty semiconductors.

Thank you for visiting S&P Global AutoTechInsight.

*A subscription to News & Analysis includes four S&P Global-selected sector-specific analytical pieces per month. Access to all analytic pieces across all domains comes with a subscription to All Domains. Please click here to subscribe.

To get access to the AutoTechInsight full suite of services, please contact a sales representative by clicking here.

Already a subscriber? Please log in here

preload preload preload preload preload preload