Cicor selects SABIC’s LNP™ THERMOCOMP™ compounds to produce high-end 3D-MIDs
Molded interconnect devices have the potential to replace PCBs in automotive sensor-based applications
Swiss circuit boards and hybrid circuits manufacturer Cicor announced on the 2 September that it had selected Saudi chemical manufacturing company’s LNP™ THERMOCOMP™ compounds to produce its portfolio of high-end 3D molded interconnect devices (3D-MIDs).
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