Harman, a global leader in connected vehicle solutions, has launched the Harman Ready Connect 5G Telematics Control Unit (TCU), in collaboration with Qualcomm Technologies Inc. The new product leverages state-of-the-art Snapdragon Digital Chassis connected car technologies to offer unparalleled connectivity performance while maximizing upgradability, scalability and usability. The Harman Ready Connect 5G TCU is designed to meet the needs of automakers simply and effectively, expediting time to market and reducing development costs.
According to Pascal Peguret, senior vice president of Connectivity for Harman Automotive, the collaboration between Harman and Qualcomm Technologies is aimed at redefining the future of automotive connectivity. The Ready Connect 5G TCU product is a testament to this shared vision, disrupting the traditional TCU approach as an off-the-shelf TCU product.
Jeff Arnold, vice president of Product Management, Qualcomm Technologies Inc., said that the company is pleased to further strengthen its longstanding relationship with Harman to help bring the Ready Connect 5G TCU to the industry. The product exemplifies Qualcomm Technologies' dedication to driving connectivity innovation in the automotive industry, delivering a seamless combination of performance, reliability and cutting-edge features through the utilization of the Snapdragon Modem-RF Gen 2 system.
The Harman Ready Connect 5G TCU is currently available and will be showcased at the Mobile World Congress (MWC) 2024. The product represents a significant advancement in automotive connectivity, offering rich in-cabin experiences for consumers while reducing time to market and engineering efforts for original equipment manufacturers.
