TSMC to open new design facility in Munich for automotive chip innovations

News
Investments
ATI News Team

The Munich facility will focus on optimizing chip designs, expanding expertise in RRAM and MRAM, and supporting TSMC's German wafer fab

Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) announced plans to establish a new facility in Munich, which will focus on optimizing chip designs for automotive and other industries, newelectronics reported May 28.

Thank you for visiting S&P Global AutoTechInsight.

*A subscription to News & Analysis includes four S&P Global-selected sector-specific analytical pieces per month. Access to all analytic pieces across all domains comes with a subscription to All Domains. Please click here to subscribe.

To get access to the AutoTechInsight full suite of services, please contact a sales representative by clicking here.

Already a subscriber? Please log in here

preload preload preload preload preload preload