Nexperia and Semikron Danfoss sign MOU to evaluate SiC power module collaboration
The firms will assess jointly engineered SiC traction inverter modules for EVs, combining chip technology and packaging integration
Nexperia BV and Semikron Danfoss GmbH have signed a memorandum of understanding (MOU) to assess a potential strategic collaboration on silicon carbide (SiC)-based power modules designed for automotive traction inverter applications.
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