Valeo and Calyos collaborate to develop passive chip-cooling systems for mobility and data centers
The partners will combine LHP technology and thermal-engineering capabilities to create compact, plug-and-play two-phase cooling for mobility and computing applications
Valeo and Calyos have signed a memorandum of understanding (MOU) to jointly develop and industrialize high-performance, stand-alone chip-cooling systems for mobility and computing applications, as electrification and AI increase heat-management demands.
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