On Aug. 23, BASiC Semiconductor, based in Shenzhen, China, signed a strategic cooperation agreement with China Automotive Chip (Shenzhen) Technology Co. Ltd. (CASTC) to progress automotive-grade semiconductor technology, according to a report published by World-Energy Media. The partnership aims to enhance the development and application of power semiconductors within the automotive industry. BASiC Semiconductor will utilize its expertise in silicon carbide (SiC) power device research and commer...

In a press release on July 24, Onsemi announced an expansion of its collaboration with Schaeffler through a new design agreement that utilizes Onsemi's latest EliteSiC silicon carbide metal-oxide-semiconductor field-effect transistors (MOSFETs). This collaboration will aid Schaeffler in powering a traction inverter for a major global automaker's new plug-in hybrid electric vehicle platform. The EliteSiC technology from Onsemi provides lower conduction losses and superior short-circuit robustness...

According to a press release on July 17, Tata Electronics and Robert Bosch GmbH have signed a memorandum of understanding (MOU) to collaborate in the electronics and semiconductor industries. The agreement was signed by Randhir Thakur, CEO and managing director of Tata Electronics, and Dirk Kress, executive vice president of Semiconductor Operations at Robert Bosch GmbH. The collaboration will focus on chip packaging and manufacturing at Tata Electronics' forthcoming assembly and test unit in...

According to Synopsys' blog post on June 4, Synopsys has expanded its long-standing collaboration with Arm to support the automotive industry’s rapid transition to software-defined vehicles (SDVs). The partnership focuses on addressing the growing demand for smarter, AI-powered in-car experiences while tackling the rising complexity, cost and development challenges faced by automakers. As vehicles become increasingly reliant on advanced computing capabilities, current architectures struggle...

Samsung Electronics has teamed up with Infineon and NXP to develop next-generation automotive semiconductor technology solutions, aiming to address the rising demand for high-performance computing chips in future smart vehicles, according to a report published by TrendForce on June 5. The evolution of autonomous driving technology has driven the need for increased computing power in automotive chips. Samsung is leveraging its expertise in memory and processor technologies to introduce advanced p...

A group of Japanese companies in the auto and semiconductor industries proposed a communication standard for automotive chips to an international body, aiming to advance technology essential for the growing electrification of vehicles, according to a report published by Nikkei Asia on June 2. The group, called Advanced SoC Research for Automotive (ASRA), comprises 14 companies, including Toyota Motor, Honda Motor, auto parts supplier DENSO and chipmaker Renesas Electronics. The establishment ...

Foretellix, a leader in data automation for AI-powered autonomy, announced an expansion of its Foretify platform to help autonomous vehicle developers reduce development time by half and save substantial financial resources. The platform addresses the challenges faced by autonomous vehicle developers in the realm of physical AI, offering solutions to train AI engines using real drive data augmented with hyper-realistic synthetic data. The necessity of validating autonomous vehicle systems for sa...

FAW Group and Tsinghua Unigroup have agreed on a strategic partnership in Beijing to enhance cooperation in China's automotive semiconductor industry. The agreement involves collaboration on domestic chip application, supply chain development, joint research and development initiatives, chip ecosystem construction, and market-driven collaboration. By combining their strengths, the two organizations aim to improve supply-demand alignment and industrial synergy. The partnership will focus on...

CISSOID and EDAG Group have announced a strategic partnership to expedite the development of next-generation silicon carbide (SiC) traction inverters for electric mobility applications. The partnership aims to combine CISSOID's expertise in SiC power semiconductor modules and control solutions with EDAG's engineering capabilities in electric powertrain design, integration and validation. This will enable the two companies to provide electric mobility original equipment manufacturers and equipmen...

As reported in a press release on May 9, Infineon Technologies and Visteon Corp. signed a memorandum of understanding to collaborate on the development of next-generation EV powertrains. The partnership will involve integrating power conversion devices based on Infineon's semiconductor technology, focusing particularly on wideband gap device technologies. These technologies offer advantages over traditional silicon-based semiconductors, such as improved power density, efficiency and thermal perf...

As reported in a press release on April 24, Horizon Robotics and Bosch have entered into a memorandum of understanding to deepen their collaborative efforts in smart driving solutions for passenger vehicles. Bosch will develop its upcoming multipurpose camera using Horizon Robotics' Journey 6B platform and its advanced driver assistance systems product line for the mid-segment market using Journey 6E/M, with a focus on improving driver and passenger safety, convenience, and comfort. Bosch's mult...

As reported in a press release on April 17, the Volkswagen Group is enhancing its local technology capabilities in China as part of its "In China, for China" strategy. At Auto Shanghai, Volkswagen will unveil its first AI-powered, highly automated driving system specifically designed for China's traffic conditions. This system is self-learning and engineered for safety and seamless driving, featuring a system-on-chip (SoC) that offers high computing power for rapid response to various driving sc...