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    FISITA World Mobility Conference 2025: Key themes and concerns for the automotive industry
    One thing is abundantly clear after the FISITA World Mobility Conference (WMC) last week. Megatrends impact everything. No longer can chassis development, braking, safety validation and so forth stand alone without impact from the broader drive towards electrification, the AI revolution or SDVs, to name a few.  The event’s sessions gave the impression that electrification is already baked into the industry, particularly in Europe where the debate on (regulation-pushed) direction is ...
    Beyond horsepower: Compute becomes the new competitive edge for OEMs
    Automotive compute power is becoming a defining metric of vehicle capability — not just for autonomy, but across cockpit systems, connectivity and life-cycle software deployment. As vehicles transition toward centralized electrical/electronic (E/E) architectures and software-defined platforms, silicon performance is now a core determinant of what a vehicle can do — and how long it will remain competitive in the field. Two metrics have emerged as industry standards for measuring this compu...
    BMW taps Momenta to develop China-specific ADAS solutions
    BMW Group is deepening its commitment to China’s digital innovation ecosystem through a new strategic partnership with Chinese advanced driver assistance system technology leader Momenta. The collaboration will focus exclusively on co-developing ADAS tailored for the Chinese market. The joint development will begin with BMW’s upcoming Neue Klasse platform, with the aim of delivering intelligent, intuitive and locally optimized driving experiences. The partnership leverages BMW’s core dr...
    Indie introduces low-noise LXM-U lasers for automotive application
    Indie, an automotive solutions supplier, has unveiled its latest LXM-U lasers, utilized in next-generation Quantum applications, offering significant frequency stability and integration flexibility, as reported in a press release on July 14. Indie's Photonics Business Unit was formed earlier in 2025 by combining its Canada photonics team, formerly TeraXion, which specializes in laser and optical components, with its recently acquired Swiss team, Exalos, known for its super luminescent diodes (SL...
    SK keyfoundry and LB Semicon complete testing of Direct RDL in South Korea
    SK keyfoundry, a South Korea-based company specializing in analog and mixed-signal foundry services for semiconductor companies, has announced the successful co-development and completion of the reliability testing of the Direct RDL (Redistribution Layer) in collaboration with LB Semicon. This milestone marks a key step in advancing next-generation semiconductor packaging technologies and enhancing the competitiveness of automotive semiconductor products. ...
    Tata Elxsi partners with Synopsys to develop automotive virtualization solutions
    As reported in a press release on July 11, Tata Elxsi and Synopsys have announced a memorandum of understanding (MOU) to jointly develop advanced automotive virtualization solutions. The agreement was signed during the SNUG India 2025 event in Bengaluru by senior leaders from both organizations. This collaboration aims to provide customers with preverified, integrated solutions and services for designing and deploying virtual electronic control units (vECUs), which are crucial for efficient soft...
    Ecarx expands technology partnership with Samsung for automotive intelligence, robotics and AI
    Mobility technology provider Ecarx Holdings announced a new global strategic partnership with Samsung Group, marking a significant advancement in their collaboration. The partnership aims to accelerate the commercialization of advanced automotive intelligence technologies, focusing on integrating Samsung's next-generation displays, high-speed memory and flash storage solutions into Ecarx's product offerings. This collaboration will extend beyond automotive intelligence to include the develo...
    NEVC and MeriTech sign agreement to enhance automotive chip innovation
    Mainland China's National New Energy Vehicle Technology Innovation Center (NEVC) and MeriTech Integrated Circuits (MeriTech) have signed a strategic cooperation agreement in Beijing. NEVC has established a 4+2 business framework in its automotive chip division, focusing on standard research, testing and evaluation, product certification, and automotive-grade management, along with two technical service systems for application verification and quality management for automotive-grade chips. These ...
    MediaTek expands automotive sector focus in India with advanced AI and connectivity solutions
    MediaTek is focusing on expanding its footprint in the automotive sector in India, with projections that the country will contribute 20% of its global automotive deployments over the next five years, according to a report published by Autocar Professional on July 9. “From an automotive standpoint, India is expected to account for 20% of the total number of deployments in the segment in the next five years,” said Rita Wu, director of Product Marketing, Automotive Platform, at MediaT...
    Cadence expands partnership with Samsung Foundry through new multiyear instrument panel agreement
    On July 8, Cadence announced on its WeChat account that it has expanded its collaboration with Samsung Foundry through a new multiyear intellectual property (IP) agreement. This agreement aims to extend the deployment of Cadence memory and interface IP solutions on Samsung Foundry's advanced SF4X, SF5A and SF2P process nodes. These solutions are designed to support high-performance, low-power applications in areas such as AI datacenters, automotive systems and next-generation radio-frequency con...
    LG Group expands automotive software ventures with global carmakers
    Chief executives from LG Group's key units, including LG Electronics, will hold closed-door meetings with global carmakers to expand in the software industry. LG Innotek, a major South Korean electronics parts developer, has entered the automotive application processor market, which is expected to grow at 22% annually over the next five years. LG Electronics, a leading global home appliance maker, announced plans to invest more than 1 trillion South Korean won ($762 million) in its ven...
    Phlux Technology raises £9 million to expand infrared sensor technology in communications and sensing
    Phlux Technology, a UK startup specializing in infrared sensor technology, has raised £9 million in a Series A funding round led by BGF, with participation from existing investors including Octopus Ventures, Northern Gritstone and Foresight. This funding will facilitate Phlux's expansion into the optical communications and sensing industries, utilizing its unique antimonide-based semiconductor technology to create faster and more energy-efficient systems. The investment will support the scaling...
    Innoviz Technologies begins high-volume production of InnovizTwo Lidar units with Fabrinet
    In a press release on July 8, Innoviz Technologies announced the shipment of the first InnovizTwo Lidar units from a high-volume production line managed by Fabrinet. This milestone represents a significant step forward in the mass production of Innoviz's InnovizTwo Lidar technology, aimed at the autonomous vehicle industry.  The successful assembly of the first units signifies Innoviz's progress toward high-volume production while maintaining quality processes to meet customer requiremen...
    NXP intensifies China localization strategy, collaborates with local foundry
    According to a report published by TrendForce on July 4, NXP has intensified its focus on its China localization strategy amid growing US export controls and potential tariff risks. The company announced plans to collaborate with a local Chinese foundry to manufacture its chips entirely within China. Although NXP operates a significant packaging and testing facility in Tianjin, the majority of its wafer fabrication occurs in the US and Singapore. This move aligns with broader trends among semico...
    Microchip introduces first ASA-ML camera platform with partners for Japanese automotive market
    According to a press release on July 2, Microchip Technology has collaborated with camera module supplier Nippon Chemi-Con Corp. and video-testing solutions provider NetVision to facilitate the adoption of Automotive Serdes Alliance Motion Link (ASA-ML) in advanced driver assistance systems. They have introduced the first ASA-ML camera-development platform for the Japanese automotive market, featuring scalable high-speed asymmetric data rates and hardware-based link-layer security to comply with...
    Nota AI and Renesas collaborate to optimize driver monitoring system on RA8P1 microcontroller unit
    According to a press release dated July 2, Nota AI announced a collaboration with Renesas Electronics to optimize a driver monitoring system (DMS) on Renesas' new RA8P1 microcontroller unit (MCU). This collaboration focuses on integrating AI efficiently into compact processors, enabling scalable, real-time driver behavior analysis in embedded systems, which enhances safety features in automotive environments where space and power are limited. The RA8P1 incorporates Arm Cortex-M85 and Cor...
    KD integrates 10GBASE-AU transceiver with Leopard Imaging's optical automotive camera
    According to a press release dated June 25, KD, a fabless semiconductor company, announced the integration of its 10GBASE-AU KD7251 optical transceiver into Leopard Imaging's optical automotive multigigabit camera, the LI-VENUS-ISX031-BASE-AU. Leopard Imaging specializes in embedded vision and AI camera technology. Corning Inc. contributed by designing a hybrid cable and connector system using its automotive-grade materials. The new system upgrades the existing camera interface from the ...
    QNX and Vector Informatik collaborate to launch foundational vehicle software platform
    BlackBerry division QNX and Vector have announced a memorandum of understanding (MOU) to jointly develop a foundational vehicle software platform aimed at speeding up the development of software-defined vehicles (SDVs) and simplifying automotive software integration. This collaboration merges Vector's middleware technology with QNX's safety-certified operating system. The platform, integrated with TTTech Auto, also includes MotionWise Schedule for enhanced component scheduling. The core objectiv...
    AEye's Apollo Lidar selected by major OEM for transportation safety systems
    In a press release on June 30, AEye, a company specializing in adaptive, high-performance Lidar solutions, announced that its Apollo Lidar units have been chosen by a major transportation original equipment manufacturer. This selection represents a significant potential revenue opportunity of $30 million or more, expected over the next 24 to 36 months. AEye's Apollo was selected due to its superior capability to detect objects from up to 1 km away, facilitating quicker hazard identification and ...
    L&T Technology Services and thyssenkrupp Steering to jointly establish software hub in Pune
    L&T Technology Services (LTTS) and thyssenkrupp Steering have announced a strategic agreement to create a state-of-the-art software development center in Pune, India. The collaboration aims to enhance modern automotive software solutions, focusing on safety-critical software for advanced steering technologies. LTTS will establish and manage the software hub on behalf of thyssenkrupp Steering, reflecting its expertise in engineering intelligent and sustainable mobility. LTTS has been recog...
    Trimble partners with TDK for enhanced navigation solutions
    Trimble and InvenSense, a TDK group company, have announced a collaboration to deliver an advanced navigation solution aimed at enhancing accuracy and reliability in automotive and IoT applications, such as autonomous vehicles, drones and industrial machinery. This new solution combines the Trimble ProPoint Go engine and Trimble RTX correction service with TDK's SmartAutomotive Inertial Measurement Units (IMUs). The Trimble ProPoint Go engine provides high-accuracy position and orientation data ...
    Valeo provides VSS360 system for European premium OEM vehicle platform
    Valeo has been chosen to provide its Valeo Smart Safety 360 (VSS360) for a premium European original equipment manufacturer vehicle platform, the company reported June 25. The system combines Valeo's expertise in hardware, software development and system integration to enhance vehicle safety, reduce accidents and support the progression of autonomous vehicles. VSS360 offers optimized driver and parking assistance in a scalable advanced driver assistance system solution, allowing OEMs to ...
    Elektrobit partners with Foxconn to develop AI-centric software platform for EVs
    In a press release on June 25, Elektrobit announced a joint development agreement with Hon Hai Technology Group (Foxconn) to create EV.OS, an AI-centric software platform aimed at advancing software-defined electric vehicles. The collaboration aims to develop a smart EV platform, integrating both hardware and software, to introduce groundbreaking supply chain innovations. The goal is to develop automotive platform solutions that minimize complexity, reduce the total cost of ownership, scale prod...
    PlateSmart and LensLock team up to revolutionize vehicle intelligence for law enforcement
    PlateSmart Technologies, recognized for its collaborations with numerous law enforcement agencies to address crimes and enhance safety, has formed a strategic alliance with LensLock to expand its reach. This collaboration aims to deliver PlateSmart's advanced technology to a wider range of agencies. Kathleen Chigos, president of PlateSmart Technologies, highlighted LensLock's reputation as a reliable provider of high-quality video solutions, emphasizing that this partnership will equip agencies ...
    Kodiak Robotics partners with Roush Industries to scale autonomous truck upfitting by 2025
    In a press release on June 18, Kodiak Robotics, an AI-powered autonomous vehicle technology provider, announced a collaboration with Roush Industries Inc., a product development supplier in industries including mobility and defense, to scale the upfitting of autonomous trucks featuring the Kodiak Driver. Starting in the second half of 2025, Roush will conduct this upfitting at its facility in Livonia, Michigan. The first trucks to be upfitted by Roush will be for Atlas Energy Solutions, ...
    Innoviz collaborates with major automotive manufacturer for Level 3 automation Lidar integration
    According to a press release on June 17, Innoviz Technologies, a supplier of automotive-grade Lidar sensors and perception software, has entered into a Statement of Development Work (SoDW) agreement with a major passenger automotive manufacturer. As part of this agreement, Innoviz will provide advanced Lidar units for the manufacturer's Level 3 automated series-production program, which aims for a start of production in 2027. Starting in the second quarter of 2025, Innoviz will focu...
    Applied Materials and CEA-Leti expand collaboration on specialty semiconductor innovation
    In a press release on June 16, Applied Materials and CEA-Leti announced an expanded phase of their collaboration, following a memorandum of understanding (MOU), aimed at accelerating innovation in specialty semiconductors. The partnership is focused on developing materials engineering solutions to overcome infrastructure challenges in AI datacenters. The joint lab, which concentrates on device innovations for the ICAPS markets (Internet of Things, Communications, Automotive, Power and Sensors...
    NXP collaborates with Rimac Technology on advanced SDV centralized architectures
    NXP Semiconductors has announced a collaboration with Rimac Technology, an automotive industry supplier, to advance centralized architectures for software-defined vehicles (SDVs), according to a press release on June 12. This collaboration will focus on utilizing NXP's S32E2 processors, which form part of the S32 Automotive Processing Platform. The S32E2 processors are designed to meet the connectivity, security and safety challenges in modern automotive environments by providing high-performanc...
    Cadence expands collaboration with Samsung Foundry in multiyear intellectual property agreement for advanced process nodes
    In a press release on June 16, Cadence announced an expansion of its collaboration with Samsung Foundry through a new multiyear intellectual property (IP) agreement aimed at broadening Cadence's memory and interface IP solutions across Samsung Foundry's advanced process nodes, including SF4X, SF5A and SF2P. This partnership leverages Cadence's AI-driven design solutions alongside Samsung's advanced technology to deliver high-performance, low-power solutions tailored for AI datacenters, automo...
    Rimac Technology collaborates on Bugatti Tourbillon's hybrid hypercar set for 2026 delivery
    Rimac Technology, a tier 1 technology supplier in the automotive industry, has played a significant role in the engineering and design of the Bugatti Tourbillon hyper-sports car by integrating its advanced battery systems, e-axles and electronic control units into the vehicle. The Bugatti Tourbillon, which utilizes Rimac Technology's revolutionary hybrid system, is set for deliveries in 2026 with production limited to 250 units. The Tourbillon showcases Rimac Technology's expertise ...
    NIRA Dynamics partners with BANF for enhanced tire safety and predictive maintenance
    NIRA Dynamics AB, a Swedish automotive software company, has joined forces with South Korea's BANF Smart Tire System to advance vehicle safety and predictive maintenance. This partnership, marked by a memorandum of understanding, aims to integrate BANF's high-frequency tire sensors into NIRA's established software ecosystem to enhance real-time monitoring for commercial vehicles. With this collaboration, both companies are transforming tire pressure monitoring systems (TPMS) to better protect ti...
    VW to build future EVs on Rivian's new R2 platform
    As part of Volkswagen's joint venture with Rivian, VW will use Rivian's upcoming R2 platform for all its future electric vehicles, according to Rivian's Chief Software Officer Wassym Bensaid. Rivian plans for the R2 production to begin in the first half of 2026, with improvements over its predecessor, the R1, making the development process more efficient. The R2 offers a modular and scalable tech stack, allowing Volkswagen brands such as ŠKODA and Audi to inco...
    Oppo signs patents licensing deal with Volkswagen for connected vehicles
    Smart device company Oppo announced a global patent licensing agreement with Volkswagen. This agreement involves licensing Oppo's cellular standard-essential patents, including those for 5G technology, to Volkswagen. The collaboration aims to enhance the user experience of Volkswagen's connected vehicle products worldwide. Vincent Lin, head of Patent Licensing at Oppo, acknowledged Volkswagen's intellectual property team's efforts in recognizing the value of this partnership, marking a commitmen...
    Synopsys expands collaboration with Arm to accelerate development of software-defined vehicles
    According to Synopsys' blog post on June 4, Synopsys has expanded its long-standing collaboration with Arm to support the automotive industry’s rapid transition to software-defined vehicles (SDVs). The partnership focuses on addressing the growing demand for smarter, AI-powered in-car experiences while tackling the rising complexity, cost and development challenges faced by automakers. As vehicles become increasingly reliant on advanced computing capabilities, current architectures struggle...
    Samsung collaborates with Infineon and NXP for next-gen automotive semiconductor solutions
    Samsung Electronics has teamed up with Infineon and NXP to develop next-generation automotive semiconductor technology solutions, aiming to address the rising demand for high-performance computing chips in future smart vehicles, according to a report published by TrendForce on June 5. The evolution of autonomous driving technology has driven the need for increased computing power in automotive chips. Samsung is leveraging its expertise in memory and processor technologies to introduce advanced p...
    Minieye partners with Changan Automobile for ADAS domain controllers
    Minieye announced a partnership with Changan Automobile, securing a production program for main models under Changan's self-owned new-energy vehicle brand, according to a report published by SMM on June 6. As the designated supplier, Minieye will provide advanced driver-assistance domain controllers designed to support a comprehensive range of driving scenarios, enhancing safety and convenience for both drivers and passengers in various environments such as highways, urban areas and parking...
    Infineon partners with Typhoon HIL for integrated xEV powertrain development
    In a press release on June 5, Infineon Technologies AG announced a collaboration with Typhoon HIL to provide an integrated real-time development and testing environment for xEV powertrain systems. This collaboration enables automotive engineering teams to use Typhoon's hardware-in-the-loop (HIL) simulator with Infineon's AURIX TC3x/TC4x microcontrollers (MCUs) to achieve ultrahigh-fidelity motor drive, onboard charger, battery management system (BMS) and power electronics emulation. The sol...
    Cadence extends support for automotive solutions on Arm Zena Compute Subsystems
    In a press release on June 4, Cadence announced new intellectual property (IP), design solutions and expert design services for software and systems-on-chip (SoCs) based on Arm Zena Compute Subsystems (CSS), intended for the automotive sector. This initiative is the first major output of a collaboration with Arm, which began in 2024 to accelerate development in the automotive chiplet ecosystem. Through this collaboration, Cadence utilizes a combination of digital twins for software developm...
    Stradvision collaborates with Arm on Zena Compute Subsystems for AI-defined vehicles
    Stradvision is supporting Arm's announcement of the Arm Zena Compute Subsystems (CSS), a platform created to aid the development of AI-defined vehicles. As vehicles' software capabilities expand, automakers and tech partners are facing demands for scalable, high-performance and safety-enabled compute platforms. Zena CSS is designed to meet these needs, offering a comprehensive compute platform that supports advanced computing requirements across various domains in a vehicle, such as central comp...
    Japanese consortium proposes communication standard for automotive chips to UCIe Consortium
    A group of Japanese companies in the auto and semiconductor industries proposed a communication standard for automotive chips to an international body, aiming to advance technology essential for the growing electrification of vehicles, according to a report published by Nikkei Asia on June 2. The group, called Advanced SoC Research for Automotive (ASRA), comprises 14 companies, including Toyota Motor, Honda Motor, auto parts supplier DENSO and chipmaker Renesas Electronics. The establishment ...
    Pioneer India opens new automotive R&D center in Bengaluru
    Pioneer India, a subsidiary of Pioneer Corp., has established a new Research & Development Center in Bengaluru, India. This center will coordinate with Pioneer's global R&D and engineering networks to develop solutions in various areas, including automotive vision and sensing technologies, advanced driver assistance systems, and digital cockpit and human-machine interfaces. It will also focus on cloud-connected infotainment and telematics, AI and mobility data platforms, and connected so...
    Premium global automaker selects Valeo’s imaging radar system for automated driving
    As reported in a press release on May 28, Valeo has been chosen by a leading global automaker to provide a new radar system designed for its personal vehicles, which will feature an automated driving system that allows for hands-free and eyes-free operation. This initial production selection for the radar system will enhance the operational design domain of automated driving and improve the human-machine interaction when responding to road hazards at high speeds, among other additional features....
    Foretellix expands Foretify platform to train autonomous vehicle stacks
    Foretellix, a leader in data automation for AI-powered autonomy, announced an expansion of its Foretify platform to help autonomous vehicle developers reduce development time by half and save substantial financial resources. The platform addresses the challenges faced by autonomous vehicle developers in the realm of physical AI, offering solutions to train AI engines using real drive data augmented with hyper-realistic synthetic data. The necessity of validating autonomous vehicle systems for sa...
    Asahi Kasei Microdevices partners with Dirac for enhanced automotive audio DSPs
    As reported in a press release on May 19, Asahi Kasei Microdevices (AKM) and Swedish company Dirac have announced a partnership to integrate Dirac's AudioIQ software into AKM's automotive audio digital signal processors (DSPs), including the AK7709 model. The collaboration aims to enhance sound quality in vehicle interiors and reduce tuning time. The integration will bring precise audio capabilities to automotive amplifier systems, offering a natural and immersive sound experience with less n...
    FocalPoint partners with STMicroelectronics to boost GNSS accuracy for automotive applications
    FocalPoint, a UK-based software company specializing in next-generation positioning solutions for automotive, wearables and smartphones, announced a strategic collaboration with STMicroelectronics to improve global navigation satellite system (GNSS) accuracy in automotive applications. This collaboration involves integrating FocalPoint's S-GNSS Auto software, which utilizes Supercorrelation technology, into STMicroelectronics' Teseo chipsets. The combined solution aims to enhance ...
    Infineon to supply Rivian's R2 with power modules for traction inverters
    Infineon Technologies is set to supply Rivian's R2 platform with power modules specifically designed for traction inverters. The platform will incorporate Infineon's HybridPACK Drive G2 silicon carbide (SiC) and silicon (Si) modules, with the supply commencing in 2026, the company said in a press release on May 19. Beyond these modules, Infineon will also provide the platform with other components such as AURIX TC3x microcontrollers and power management integrated circuits (ICs). The HybridPA...
    Foxconn and Thales Group form partnership in semiconductors
    In a press release on May 19, Hon Hai Technology Group, also known as Foxconn, announced a strategic partnership with Thales Group from France in the area of semiconductors. This partnership aims to enhance Foxconn's industrial expertise and expand its presence in Europe. As part of this collaboration, Foxconn signed the first of two memoranda of understanding (MOUs), which could potentially attract more European industrial investors, leading to investments exceeding €250 million. This initiat...
    Cargill Bioindustrial and Arizona State University partner to research new semiconductor materials
    Cargill Bioindustrial and Arizona State University (ASU) have initiated a yearlong research partnership to explore advanced materials used in semiconductor technology, which underpin modern electronics, including smartphones and electric vehicles. This collaboration focuses on Cargill Priamine dimer diamine, a material derived from bio-based ingredients. With assistance from ASU's Biodesign Institute, scientists aim to understand the performance characteristics of Priamine and explore its potent...
    iMotion Automotive forms joint ventures with Delloyd Technology for ADAS production in Malaysia
    According to a report published by Telematics Wire on May 15, iMotion Automotive Technology (Singapore) Pte. Ltd., a subsidiary of iMotion Technology, formed two joint ventures with Delloyd Technology Berhad, a Malaysian automotive component manufacturer. The partnership will establish two entities in Malaysia—one focusing on production and the other on sales of advanced driver assistance systems. The collaboration, announced on iMotion's WeChat, aims to create a localized operational fra...
    FAW Group and Tsinghua Unigroup form strategic partnership in automotive semiconductor industry
    FAW Group and Tsinghua Unigroup have agreed on a strategic partnership in Beijing to enhance cooperation in China's automotive semiconductor industry. The agreement involves collaboration on domestic chip application, supply chain development, joint research and development initiatives, chip ecosystem construction, and market-driven collaboration. By combining their strengths, the two organizations aim to improve supply-demand alignment and industrial synergy. The partnership will focus on...
    Indian supplier Remsons Industries secures supply orders from Stellantis for control cables
    Remsons Industries Ltd. has secured a major business order worth over 3 billion rupees (about $35 million) from Stellantis North America for the supply of control cables, the company announced in a regulatory filing to the stock exchanges. The Mumbai-based company will provide components for Stellantis’ vehicle platforms, including the Jeep Wrangler and RAM.  The order is set to be delivered from financial year 2026/27 and will be completed over a seven-year period, with standard terms...
    Forvia Hella secures €1 billion order for advanced automotive control modules
    As reported in a press release on May 12, Forvia Hella has secured a significant customer order from a global premium manufacturer to develop and produce an advanced control module (ACM), with series production set to begin in 2028. Additionally, its intelligent power distribution module (iPDM) will start series production for another automotive manufacturer by midyear. The combined order volume for these projects exceeds €1 billion, with production based in Timisoara, Romania, and development...
    Innoviz expands collaboration with Volkswagen for ID. Buzz AD Lidar integration
    Innoviz Technologies announced an expansion of its collaboration with Volkswagen Autonomous Mobility to expedite the integration of InnovizTwo Lidar units into Volkswagen's ID. Buzz AD, a Level 4 autonomous shuttle, the company reported May 13. The integration supports MOIA's planned market expansion into various European and US cities starting in 2026. This initiative is further bolstered by Innoviz's recent partnership with Fabrinet for the mass production of the InnovizTwo Lidar ...
    Drive TLV partners with NXP to advance smart mobility solutions
    Drive TLV, an innovation hub focusing on smart and sustainable tech mobility in Tel-Aviv, Israel, announced a partnership with NXP Semiconductors to advance technology in areas such as autonomous driving, radar systems, autonomous mobile robots (AMRs) and AI applications in the automotive sector, among others, as reported in a press release on May 12. In this partnership, Drive TLV will help facilitate collaborations between NXP and various companies by identifying startups capable of ad...
    Asahi Kasei partners with Dirac to streamline vehicle sound system tuning
    Japan's Asahi Kasei will reduce the time required by automakers to fine-tune in-vehicle sound systems by 70% using its semiconductor devices. The company has teamed up with Swedish audio technology developer Dirac to simplify adjustments, including noise reduction. Asahi Kasei holds an estimated 20% share of the global market for audio-processing semiconductors for vehicles. By collaborating with other companies, Asahi Kasei intends to expedite vehicle development times and increase its sales. ...
    CISSOID and EDAG Group partner to develop SiC traction inverters for electric mobility
    CISSOID and EDAG Group have announced a strategic partnership to expedite the development of next-generation silicon carbide (SiC) traction inverters for electric mobility applications. The partnership aims to combine CISSOID's expertise in SiC power semiconductor modules and control solutions with EDAG's engineering capabilities in electric powertrain design, integration and validation. This will enable the two companies to provide electric mobility original equipment manufacturers and equipmen...
    Infineon and Visteon partner on next-generation EV powertrains with advanced semiconductor technology
    As reported in a press release on May 9, Infineon Technologies and Visteon Corp. signed a memorandum of understanding to collaborate on the development of next-generation EV powertrains. The partnership will involve integrating power conversion devices based on Infineon's semiconductor technology, focusing particularly on wideband gap device technologies. These technologies offer advantages over traditional silicon-based semiconductors, such as improved power density, efficiency and thermal perf...
    Novosense Microelectronics and Continental expand collaboration on system basis chips
    In a press release on April 24, NOVOSENSE Microelectronics, a semiconductor company offering analog and mixed-signal chips, announced an expansion of its strategic collaboration with Continental's automotive business area. The partnership will now include cooperation in the development of system basis chips (SBCs) and low-side switches, aimed at enhancing safety and efficiency in modern vehicle systems. Building on their previous successful collaboration in the development of sensor integrate...
    Cadence joins AVCC to enhance safety and performance in autonomous vehicle systems
    In a press release on May 8, Cadence joined as a member of the Autonomous Vehicle Computing Consortium (AVCC). By joining AVCC, Cadence aims to work with industry leaders to develop high-performance computing and safety solutions for next-generation autonomous vehicle systems. The collaboration reflects Cadence's focus on ensuring the safety, reliability and efficiency of autonomous driving technology by contributing to the creation of high-performance system architecture and safety standards...
    DENSO and ROHM to form strategic semiconductor partnership in automotive industry
    According to a press release on May 8, 2025, DENSO and ROHM have agreed to form a strategic partnership in the semiconductor sector following discussions that began in September 2024. This partnership reflects the growing importance of semiconductors in the electrification and intelligence of vehicles, driven by the push for carbon neutrality and the development of automated driving technologies. The collaboration expands the existing relationship between DENSO and ROHM in the automotive semi...
    AEye's Apollo Lidar sensors enter production phase at LITEON facility in Taiwan
    In a press release on May 7, AEye announced the successful production of its Apollo Lidar sensors from the LITEON manufacturing line in Taipei, Taiwan. This development marks a significant milestone in AEye's efforts to position Apollo for high-volume production. The Apollo Lidar sensors are engineered to detect objects at highway speeds, boasting an impressive range of 1 km, and are intended to set new benchmarks in automotive safety and autonomous mobility performance. LITEON has demonstrat...
    Auto Shanghai 2025: Zhuoyu showcases advanced vehicle intelligence solutions
    Shenzhen Zhuoyu Technology Co. Ltd. (Zhuoyu) showcased its latest automotive intelligence solutions at Auto Shanghai 2025, underscoring its commitment to the advancement of next-generation intelligent vehicle development in China. Zhuoyu introduced several technologies, including its flagship Vision-Language-Action (VLA) large model based on NVIDIA DRIVE Thor, an integrated cabin-driving solution powered by Qualcomm's SA8775P, and the proprietary JIMU2.0 sensor. The company also debuted systems ...
    Synaptics and Murata partner for automotive wireless Connectivity
    Synaptics Inc. and Murata Manufacturing announced a collaboration to develop a next-generation turnkey wireless connectivity module aimed at automotive tier 1 suppliers and original equipment manufacturers. The module will incorporate Synaptics' Veros Wi-Fi and Bluetooth combo systems-on-chips (SoCs), which are known for their highly integrated radio-frequency (RF) front-ends. These SoCs are designed to optimize performance while keeping system design costs and power consumption low, a...
    Hesai's AT series powers Cadillac's in-cabin Lidar integration in new VISTIQ SUV
    In a press release on April 25, Hesai announced that its long-range, automotive-grade AT series Lidar has been selected by SAIC-GM for inclusion in Cadillac's new all-electric VISTIQ sport utility vehicle. This announcement was made during the Shanghai Auto Show. The VISTIQ SUV will feature in-cabin Lidar deployment, positioned behind the windshield. The behind-the-windshield Lidar solution was co-developed by Hesai and Cadillac. It incorporates the AT series long-range Lidar within the VISTI...
    Stradvision and Axera collaborate on scalable ADAS and autonomous driving solutions
    In a press release on April 28, Stradvision and Axera announced a strategic cooperation to deliver scalable advanced driver assistance systems and autonomous driving solutions. The collaboration, unveiled at Auto Shanghai 2025, combines Stradvision's SVNet software-based perception solution with Axera's AI system-on-chip (SoC) platforms. The partnership aims to develop integrated solutions for advanced driver assistance and autonomous mobility, optimizing SVNet on Axera's platforms for vari...
    Horizon Robotics partners with DENSO for advanced driving solutions in China
    At the Auto Shanghai 2025, Horizon Robotics and DENSO announced a collaboration to develop advanced integrated driving assistance solutions specifically designed for China's road conditions. The partnership is focused on enhancing safety and security in mobility by improving critical functions such as acceleration, steering and braking. This ensures optimal assisted driving experiences in both urban and highway environments. A significant aspect of this collaboration is the combination of DENSO'...
    Auto Shanghai 2025: MediaTek unveils Dimensity automotive cockpit platform
    At the Auto Shanghai 2025, MediaTek introduced its new flagship platforms, the Dimensity Auto Cockpit Platform C-X1 and Dimensity Auto Connect MT2739. MediaTek, in collaboration with its ecosystem partners, is focusing on enhancing the future of intelligent driving with innovations in AI technology for autonomous vehicles. Mike Chang, corporate vice president at MediaTek, emphasized the significance of intelligent cockpits in differentiating vehicle designs in the software-defined vehicle era. T...
    Horizon Robotics and Bosch collaborate on smart driving solutions with Journey 6 series
    As reported in a press release on April 24, Horizon Robotics and Bosch have entered into a memorandum of understanding to deepen their collaborative efforts in smart driving solutions for passenger vehicles. Bosch will develop its upcoming multipurpose camera using Horizon Robotics' Journey 6B platform and its advanced driver assistance systems product line for the mid-segment market using Journey 6E/M, with a focus on improving driver and passenger safety, convenience, and comfort. Bosch's mult...
    Synopsys and TSMC enhance collaboration for AI chip design and 3D multidie innovations
    In a press release on April 23, Synopsys announced its continued collaboration with TSMC to provide advanced electronic design automation (EDA) and intellectual property (IP) solutions for TSMC's cutting-edge processes and packaging technologies. The partnership aims to accelerate the design and innovation of AI chips and 3D multidie designs. Notable advancements in their collaboration include the availability of certified digital and analog flows on TSMC's A16 and Node-to-Performance (N2P)&n...
    Valens Semiconductor partners with Eswin Computing for MIPI A-PHY solutions in China
    Valens Semiconductor and Eswin Computing have announced a partnership to introduce MIPI A-PHY solutions to the Chinese market, providing locally manufactured, production-ready chipsets for sensor and display connectivity to Chinese automakers, according to a press release on April 22. Eswin Computing plans to showcase these solutions at Auto Shanghai from April 23 to May 2. This collaboration leverages Valens' expertise in A-PHY technology and ESWIN Computing's technological capabilities and ...
    Auto Shanghai 2025: Nullmax showcases advanced MaxDrive solutions for autonomous driving
    The Shanghai International Automobile Industry Exhibition commenced on April 23, featuring Nullmax, an AI technology company focused on automated driving/advanced driver assistance system (ADAS) solutions for various scenarios. Nullmax presented its MaxDrive solutions, developed to cater to the diverse needs of different vehicle models and markets, including active safety features and autonomous driving in urban environments. The MaxDrive solutions are adaptable to multiple chip platforms and se...
    Auto Shanghai 2025: Bosch presents new software and hardware for assisted and automated driving
    At Auto Shanghai 2025, Bosch showcased its comprehensive array of solutions for assisted and automated driving and parking, highlighting a radar sensor developed entirely in-house. The sensor features Bosch's own computing chip, combining high computing power with a small footprint. This sensor is part of Bosch's advanced driver assistance systems product family, which offers a range of software, sensors and services adaptable for different vehicle segments. Bosch aims to enable global...
    Auto Shanghai 2025: Intel unveils second-generation, AI-enhanced system-on-chip
    At Auto Shanghai 2025, Intel introduced its second-generation, AI-enhanced software-defined vehicle (SDV) system-on-chip (SoC), marking its first appearance at the event. This new automotive chip features the industry's first multiprocess node chiplet architecture, aiming to meet the increasing demands for intelligent and connected vehicles by offering scalable performance, advanced AI capabilities and cost-efficiency for automakers. In tandem with this launch, Intel announced new strategic coll...
    Innoviz Technologies partners with Fabrinet for mass production of InnovizTwo Lidars
    According to a press release on April 22, Innoviz Technologies has partnered with Fabrinet to bring its InnovizTwo product platform to mass production. Fabrinet will act as the chosen manufacturing partner for the InnovizTwo Lidar product platform, encompassing both the InnovizTwo Long-Range and InnovizTwo Short- to Mid-Range Lidar solutions. The agreement with Fabrinet comes after Fabrinet's facility passed rigorous audits by several global leading automotive original equipment m...
    Volkswagen unveils AI-powered ADAS system in China
    As reported in a press release on April 17, the Volkswagen Group is enhancing its local technology capabilities in China as part of its "In China, for China" strategy. At Auto Shanghai, Volkswagen will unveil its first AI-powered, highly automated driving system specifically designed for China's traffic conditions. This system is self-learning and engineered for safety and seamless driving, featuring a system-on-chip (SoC) that offers high computing power for rapid response to various driving sc...
    Horizon Robotics unveils Horizon SuperDrive urban driving assistance system for mass production
    According to a press release on April 18, Horizon Robotics has introduced the Horizon SuperDrive (HSD) urban driving assistance system for mass production at its 2025 annual product launch event in Shanghai. The event also saw Horizon Robotics collaborating with Chery Automobile to announce that the HSD system will debut globally on Chery's EXEED vehicles in September. This system is based on Horizon's Journey 6 processing hardware and offers a humanlike driving experience. It includes...
    Microsar IO and Infineon collaborate on hardware abstraction layer for automotive microcontrollers
    The collaboration between Microsar IO and Infineon's PSOC4 HV controllers has led to the creation of a new hardware abstraction layer (HAL) specification. This specification is tailored for low memory footprint microcontrollers and provides standardized interfaces to facilitate easier integration and greater reusability of embedded software. The HAL was successfully implemented for the driver of Infineon's automotive microcontroller, the PSOC4 HV, utilizing Microsar IO, which is Vector's lightwe...
    Tata Elxsi secures €50 million engineering deal with European automotive OEM
    Tata Elxsi has announced a strategic multiyear agreement valued at €50 million with a European-headquartered automotive original equipment manufacturer. This agreement positions Tata Elxsi as a key engineering partner in developing platforms and applications across software-defined vehicles (SDVs), electrification, body and chassis domains. A significant part of this collaboration involves establishing a Global Engineering Centre to support the customer's software platform roadmap. This cen...
    Auto Shanghai 2025: Continental to unveil automated driving and light projection tech
    In a press release on April 15, Continental announced that it will highlight its innovations aimed at transforming future mobility through software-defined vehicle technologies, focusing on safety, autonomy and sustainability at Auto Shanghai 2025. During a press conference scheduled for April 23, Philipp von Hirschheydt, an executive board member responsible for the Group Sector Automotive, will reveal the name of an independent Automotive company that will emerge from Continental's planned spi...
    DeepRoute.ai and Qualcomm introduce intelligent driving solutions based on Snapdragon Ride Platforms
    DeepRoute.ai, an AI company, and Qualcomm Technologies Inc. have announced a collaboration to develop advanced intelligent driving solutions for advanced driver assistance systems and automated driving utilizing the Snapdragon Ride Platforms (SA8650), as reported in a press release on April 8. The partnership will leverage the Snapdragon Ride Platform to create intelligent driving solutions that encompass both Lidar and vision-only ADAS systems. These systems are designed to support a variety...
    Hyundai Mobis expands R&D center in Hyderabad to boost automotive software development
    Hyundai Mobis has announced the expansion of its Indian research and development center in Hyderabad, Telangana, striving to enhance its automotive software development capabilities. This move aims to consolidate two previously separate R&D centers into a singular, large-scale base, making it a strategic hub for software strategy with a focus on the growing importance of software in the automotive industry, particularly for electric vehicles and sport utility vehicles. The company seeks to s...
    Infineon acquires Marvell’s Automotive Ethernet business for $2.5 billion
    Infineon Technologies AG, based in Neubiberg, Germany, has announced its acquisition of Marvell Technology's Automotive Ethernet business for $2.5 billion in cash. This strategic move is aimed at enhancing Infineon's capabilities in the automotive sector, particularly in the area of software-defined vehicles, by integrating Marvell's automotive Ethernet technology with Infineon's existing portfolio of automotive microcontrollers. The acquisition is expected to generate revenue between $225 milli...
    US President Trump exempts semiconductors from new tariffs on Taiwan
    US President Donald Trump has imposed a 32% tariff on exports from Taiwan to the US, excluding semiconductors, according to an April 3 report by The New York Times. The move has raised concerns in Taiwan and other key semiconductor-producing nations, such as South Korea, about the potential for future tariffs on the chip sector. Taiwan, a major hub in the global semiconductor supply chain, has built a highly advanced network of chip production facilities over several decades. While semic...
    Intel and TSMC discuss forming JV for US factories
    Intel and Taiwan Semiconductor Manufacturing Co. (TSMC) are reportedly in preliminary discussions to form a joint venture for operating Intel's factories in the US, according to a report published by Reuters on April 5. This partnership would see TSMC acquiring a 20% stake in the new company.  Reuters reported in March that TSMC had proposed to NVIDIA, Advanced Micro Devices and Broadcom the idea of taking stakes in a JV that would manage Intel's manufacturing facilities. This suggestion...
    Imec and Baden-Württemberg launch Advanced Chip Design Accelerator
    At the Hannover Trade Fair 2025, Imec, a research and innovation hub in nanoelectronics and digital technologies, announced a collaboration with the state government of Baden-Württemberg, Germany, to launch the Advanced Chip Design Accelerator (ACDA) in Baden-Württemberg. This new competence center aims to enhance Imec's Automotive Chiplet Program by developing chiplets, packaging, system integration, sensing and AI technology, thereby supporting the automotive industry in the introductio...
    Alphawave Semi and Arm accelerate scalable computing with CSA-compliant chiplets
    As demand for high-performance computing (HPC), AI/machine learning and cloud infrastructure rises, traditional monolithic system-on-chip (SoC) designs are being replaced by modular architectures. The complexity and cost of legacy designs have prompted a shift toward chiplet-based system-in-package (SiP) solutions, which improve production efficiency and system integration. Arm's Chiplet System Architecture (CSA) is crucial for standardizing this transition, ensuring smooth integration...
    Mobileye partners with Valens for cutting-edge autonomous driving tech
    Mobileye has announced its decision to incorporate Valens' MIPI A-PHY-compliant VA7000 chipsets into the optical path of its automated and autonomous driving platforms for a specific customer program. Elchanan Rushinek, Mobileye's executive vice president of Engineering, praised the efficiency and robustness of the MIPI A-PHY standard for high-performance connectivity and expressed enthusiasm for broadening the technology's ecosystem alongside Valens. This decision came after thorough testing by...
    Valeo supplies Renault Grand Koleos with Valeo Smart Safety 360
    The Renault Grand Koleos model has been awarded First Grade (highest score of safety level) in the Korea-New Car Assessment Program (KNCAP) tests. This latest model is equipped with a Valeo Smart Safety 360 system including a smart front camera, radars, detection algorithms and advanced functionalities. The Renault Grand Koleos also received the best score on advanced driver assistance systems among all vehicles tested by KNCAP in 2024 in the D-sport utility vehicle category....
    Hesai Technology spearheads Apollo Go's expansion to Dubai with Lidar tech
    Hesai Technology announced March 31 that its Lidar solution will support Apollo Go’s expansion into Dubai, United Arab Emirates. This follows an exclusive agreement with Baidu Apollo in July 2024, which aims to deploy up to 1,000 vehicles. The expansion highlights Hesai’s Lidar technology in enabling Level 4 autonomous driving, as seen in Apollo Go’s RT6 robo-taxis in China, which have reduced operational costs by 60%. CEO and Co-founder of Hesai David Li emphasized the c...
    STMicroelectronics and Innoscience partner for gallium nitride technology development
    As reported in a press release on March 31, STMicroelectronics and Innoscience, a leading entity in 8-inch gallium nitride on silicon (GaN-on-Si) high-performance, low-cost manufacturing, have announced a collaborative agreement focusing on the development and manufacturing of gallium nitride (GaN) technology. The partnership aims to enhance GaN power solutions and fortify the supply chain resilience by leveraging each company's strengths. The initiative is set to advance GaN power techn...
    SEALSQ partners with IC’ALPS to advance automotive semiconductor technology
    SEALSQ Corp., a Nasdaq-listed company specializing in semiconductors, PKI and post-quantum technology, has announced a strategic collaboration with IC'ALPS, an application-specific integrated circuit (ASIC) design house known for its expertise in custom integrated circuits compliant with IATF16949 standards and functional safety for ISO 26262. This partnership comes on the heels of SEALSQ's announcement in February of entering into exclusive negotiations for acquiring IC'ALPS. The acquisiti...
    O9 signs SaaS agreement with Toyota Motor to drive supply chain transformation
    O9 Solutions, a company that has developed an AI software platform that is used for planning and decision-making, has entered into a software-as-a-service or SaaS agreement with Japan’s largest vehicle manufacturer Toyota Motor Corporation, o9 Solutions announced on March 31. As part of the agreement, Toyota will deploy o9’s advanced supply chain management platform, which is expected to help the vehicle manufacturer in optimizing its supply chain operations and drive greater efficiency i...
    Mazda and ROHM begin automotive component production using gallium nitride semiconductors
    Mazda Motor Corp. and ROHM Co. Ltd. have embarked on a collaborative endeavor to develop next-generation automotive components utilizing gallium nitride (GaN) power semiconductors. This partnership, which builds on their ongoing joint development project focused on inverters using silicon carbide (SiC) power semiconductors since 2022, aims to leverage GaN's properties for the advancement of electric vehicle components. GaN is recognized for its superior efficiency over traditional silicon (Si) p...
    Volkswagen Group cooperates with Valeo and Mobileye to enhance driver assistance in future MQB vehicles
    As reported in a press release on March 25, Volkswagen Group has announced a collaboration with Valeo and Mobileye to upgrade the advanced driver assistance systems to Level 2+ for its future vehicles built on the MQB platform. The enhancement aims to increase safety and driving comfort in high-volume vehicles, aligning with customer expectations and regulatory demands. According to Dirk Große-Loheide, a member of the management board of the Volkswagen brand responsible for procurement, this...
    Aeva partners with top 10 global OEM for next-gen vehicle platform
    As reported in a press release on March 11, Aeva announced that it has been selected by a global top 10 passenger original equipment manufacturer to participate in a development program for the OEM's next-generation global vehicle platform. This collaboration extends further, with Aeva receiving a letter of intent from the OEM for a potential large-scale, multiyear production program spanning 2025. This anticipated partnership aims to incorporate multiple vehicle models across the OEM's worldwid...
    Arteris collaborates with Nextchip to elevate automotive vision technology
    Arteris is collaborating with Nextchip to advance its vision technology solutions for automotive applications. K. Charles Janac, the president and CEO of Arteris, highlighted the company's role in supporting customers to develop cutting-edge technology, emphasizing the capabilities of FlexNoC 5. Nextchip specializes in developing semiconductor designs for advanced driver assistance systems and image signal processors (ISPs), empowering automotive designers to create high-quality viewing cam...
    Ecarx teams up with Volkswagen for global intelligent cockpit solutions
    Ecarx Technology, supported by Geely, has entered into a cooperation agreement with Volkswagen Group to deliver intelligent cockpit solutions for Volkswagen and ŠKODA brand vehicles across the globe, as reported by LatePost on March 7. This collaboration includes the provision of Ecarx's Antora 1000 computing platform and its Cloudpeak cross-domain software platform, targeting initial launches in Brazil and India before expanding to more markets. The Antora 1000 platform, which is Ecarx...
    Green Hills Software and NXP collaborate on mixed-criticality software-defined vehicle zonal architectures
    Green Hills Software, recognized for its expertise in embedded safety and security, has announced a partnership with NXP Semiconductors to launch a hardware and software solution aimed at the development and deployment of safety-focused, mixed-criticality software-defined vehicle (SDV) zonal architectures using NXP's new S32K5 microcontroller unit (MCU) family. This collaboration introduces a software solution combining the ASIL-D safety-certified µ-velOSity real-time operating system (RTO...
    NVIDIA launches full-stack comprehensive safety system for autonomous vehicles NVIDIA Halos
    At the NVIDIA GTC conference in San Jose, California, NVIDIA highlighted the use of its AI technologies in advancing the mobility industry, encompassing passenger vehicles, trucks and autonomous systems. The company unveiled Halos Safety for autonomous vehicles, emphasizing the collaboration with leading automakers such as General Motors and Volvo Cars. These automakers utilize NVIDIA's diverse platforms such as DGX for AI model training, Omniverse and Cosmos for simulation, and DRIVE AGX for in...
    General Motors and NVIDIA collaborate on AI for next-generation vehicle experience
    General Motors (GM) and NVIDIA have announced an expansion of their collaboration, focusing on developing next-generation vehicles, factories and robots through AI, simulation and accelerated computing. This partnership aims to utilize NVIDIA's accelerated compute platforms, including NVIDIA Omniverse with NVIDIA Cosmos, for building custom AI systems. These systems will enhance GM's factory planning, robotics and the optimization of manufacturing models. Moreover, GM plans to implement NVIDIA D...
    Hyundai Mobis to start mass production of in-house automotive semiconductors
    Hyundai Mobis has announced the completion of its in-house design of automotive semiconductors, a critical component for software-defined vehicles (SDVs), and is set to commence mass production, in a report published by Business Korea on March 18. The company aims to bolster its technological prowess and obtain automotive semiconductor technology by setting up a research base in Silicon Valley, US, by the end of 2025. On March 18, it revealed the completion of research and development, and th...
    Mercedes-Benz to use Hesai Lidar sensors in global markets
    Mercedes-Benz has decided to incorporate Hesai's Lidar sensors into its smart driving cars for global markets, marking the first instance where a foreign automaker will utilize Chinese-made technology in vehicles sold beyond China, according to a report published by Reuters on March 11. The choice of Hesai by Mercedes-Benz could be influenced by the company's cost-effectiveness and scalability. Hesai's CFO Andrew Fan told Reuters on March 11 in an interview after its quarterly earning...
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