Tensor and Arm have announced a multiyear strategic collaboration to develop the foundational compute architecture for agentic AI personal Robocar. Tensor is utilizing the Arm compute platform, which integrates hardware, software, and ecosystem enablement to power AI workloads across the entire vehicle. This collaboration has resulted in the integration of over 400 Arm-based cores in each vehicle, representing the highest concentration of Arm technology in a consumer vehicle to date. As Tensor p...

Nio Inc. has signed a strategic partnership with Bosch Group during a visit by German Chancellor Friedrich Merz to mainland China. This collaboration illustrates the ongoing alignment of interests between mainland China and Germany in the automotive supply chain, particularly amid the EU's tariffs on Chinese electric vehicles. Nio announced that the agreement will encompass all three of its brands — Nio, Onvo and Firefly — and will involve deep collaboration in technologies vital to smart...

Renesas Electronics announced that its advanced driver assistance system automotive system-on-chip (SoC), R-Car V4H, has been chosen for the TSS(LSS) control unit in Toyota Motor Corp.'s new RAV4 model, which launched in December 2025. This control unit is supplied by DENSO Corp. The R-Car V4H is developed for ADAS applications and efficiently manages processing in the RAV4, including functions such as camera and radar sensor fusion, Driver Monitor, Advanced Park and panoramic views for enh...

Bharat Forge and VVDN Technologies have signed a memorandum of understanding (MOU) to explore strategic collaboration in various technology-driven sectors. The two companies plan to pursue opportunities in sectors such as automotive systems, defense applications, AI infrastructure and data center platforms.  The partnership leverages VVDN's expertise in electronics design, software development and system integration alongside Bharat Forge's capabilities in advanced manufacturing and prec...

GlobalFoundries (GF) and Renesas Electronics have announced an expanded strategic collaboration involving a multibillion-dollar manufacturing partnership. This collaboration enhances Renesas' access to GF technologies, including differentiated technology platforms, and aligns with US priorities to strengthen domestic semiconductor production for economic and national security. As vehicles become more intelligent and factories more automated, there is a critical need for a reliable semiconductor ...

Infineon Technologies is significantly contributing to the development of BMW Group's Neue Klasse, which is a platform aimed at individual mobility through electrification, digitalization and sustainability. This platform provides an integrated and future-ready electrical/electronic (E/E) architecture, laying the ground for improved and sustainable mobility solutions. Infineon's role includes delivering dependable computing, high-speed connectivity and efficient power management. At the Annual G...

The recently concluded Consumer Electronics Show (CES) 2026 (Jan. 6–9, 2026) marked a clear inflection point: software-defined vehicles (SDVs) have entered their industrialization phase. Original equipment manufacturers and suppliers shifted decisively away from exploratory demos and concepts toward scalable, production-ready SDV platforms, with most architectures, toolchains and compute strategies aligned to 2026–28 SOPs. The focus has clearly moved from what SDVs could do, to how they can ...

BorgWarner, located in Auburn Hills, Michigan, has announced an expansion of its series-production battery management system (BMS) program with a global original equipment manufacturer. BorgWarner has been supplying the BMS to this customer since 2023, and the expanded program will support additional B-segment and C-segment passenger cars and light commercial vehicles (LCVs) for battery-electric vehicle (BEV) and plug-in hybrid electric vehicle applications, starting in 2029. Stefan Demm...

Mahindra & Mahindra has selected Mobileye's SuperVision and Surround advanced driver assistance systems for six upcoming vehicle models, with production anticipated to start in 2027. The program will utilize Mobileye's EyeQ6 High system-on-chip and will include multiple Mahindra models set to launch in India and other markets, with Mobileye serving as a tier 1 supplier. Both ADAS solutions will integrate various functions, such as perception, Road Experience Management (REM) intelligence and...

Ouster, a company specializing in sensing and perception for physical AI, announced that it completed the acquisition of StereoLabs SAS on Feb. 4. StereoLabs, known for its AI vision and perception solutions, has provided 3D vision systems since 2010, shipping over 90,000 ZED cameras to a customer base exceeding 10,000, and is supported by a broad developer community. With this acquisition, Ouster introduces physical AI's first unified sensing and perception platform, integrating digital lidar, ...

Cox Automotive's vAuto has integrated with AI inspection specialist UVeye to enhance vehicle inspections within dealership workflows. This integration, operational at select dealerships such as Brickell Chrysler Dodge Jeep Ram in Miami, utilizes UVeye's high-speed scanners to quickly gather data on a vehicle's exterior, underbody and tire conditions. The data is then seamlessly integrated into vAuto's appraisal and inventory systems, allowing dealers to assess trade-ins more efficiently whi...

BlackBerry's QNX division and HaleyTek have partnered to introduce a fully software-defined audio (SDA) system in the upcoming Volvo EX60 electric sport utility vehicle. This initiative is part of Volvo Cars' Superset tech stack strategy, aimed at transitioning vehicle functions from hardware-centric to software-driven architectures, beginning with the EX60's SPA3 infotainment platform. Unlike traditional audio systems with dedicated digital signal processors in amplifiers, the new SDA system ce...

Heilind Electronics has announced the addition of the Molex High-Speed FAKRA-Mini (HFM) Interconnect System to its portfolio of automotive connectivity solutions. This system is designed to meet the growing demands of modern vehicle electronics by providing high-speed transmission of up to 28 Gbps and frequencies up to 20 GHz, all within a compact form factor well-suited to space-constrained automotive architectures. As vehicles increasingly integrate sensors, cameras and other electronic module...

Honda Motor has announced a collaboration with Mythic, a technology company based in Texas, US, to codevelop a system-on-a-chip (SoC) for Honda's software-defined vehicles (SDVs). Honda has invested in Mythic due to its original technologies and proven expertise in enhancing the computing performance and energy efficiency of AI used in automated driving and other vehicle features. Specifically, Honda R&D., the research and development subsidiary of Honda, will partner with Mythic in the deve...

Ford Motor and Geely Auto are in discussions about a potential partnership to share the costs of technology and manufacturing. Geely may use Ford's European factory to produce vehicles for the European market, according to a Reuters report. Additionally, the companies are considering a framework for sharing automotive technologies, including autonomous driving. Progress on the European manufacturing negotiations appears to be smoother, with Ford's plant in Valencia, Spain, likely being con...

Mobility technology provider Ecarx Holdings introduced a preproduction sample of its innovative Zenith computing platform at the Consumer Electronics Show (CES) 2026, held recently in Las Vegas. This new platform, designed in collaboration with Qualcomm Technologies, utilizes the Snapdragon Elite SA8797 platform for automotive and offers an integrated high-performance intelligent cockpit and advanced driver assistance system architecture. The platform supports Android 16, Google Automotive Servi...

BMW is partnering with BlackBerry to integrate QNX software into its next-generation vehicle platform. This agreement involves embedding BlackBerry's real-time operating system and AI capabilities into BMW's foundational vehicle architecture, enhancing BlackBerry's role in the automotive software sector and strengthening its relationship with a major automaker. This partnership underlines BlackBerry's shift from consumer hardware to a focus on safety-critical software for vehicles, leveraging fe...

In 2025, Hyundai Mobis won new business orders worth $9.17 billion from global automakers, excluding Hyundai Motor Group, which owns Hyundai Motor and Kia, surpassing its own target by 23%. This achievement was driven by substantial new orders for electrification components, an expanded supply of high-value-added electronic components, and proactive market entry into emerging economies such as mainland China and India. These results are notable given the revisions many global automakers hav...

NVIDIA will provide its DRIVE Hyperion architecture and full-stack DRIVE AV Level 4 software for the new Mercedes-Benz S-Class, specifically designed to support robo-taxi operations. These vehicles will be accessible to riders through Uber's mobility network, as part of NVIDIA's previously announced partnership with the ride-hailing company. The DRIVE Hyperion platform integrates diverse sensors, including cameras, radar and lidar, alongside redundant compute systems, with NVIDIA's Halos safety ...

Repairify's diagnostics brands, asTech and BlueDriver, along with Opus IVS, have announced their intention to combine efforts to accelerate innovation in the automotive diagnostics industry. This merger aims to integrate complementary technologies, extensive technical expertise and a talented workforce to help repairers efficiently service complex vehicles. With the evolution of automotive technology and the growing demand for accurate diagnostics and advanced driver assistance system calibratio...

Volkswagen Group China has delivered its China Electronic Architecture (CEA) on schedule, laying the foundation for the successful start of production of its first CEA-based model, the VW ID. UNYX 07. The product marks Volkswagen Group’s entry into full-cycle software-defined vehicle (SDV) production in China, for China. In 2026, the Group will present four additional models across all Volkswagen brand joint ventures in China, built on the new architecture. With the delivery of the CEA, Vol...

QCraft has commenced the year with QCraft Day 2026, showcasing its advancements and objectives in the autonomous driving sector to over 200 industry guests in Beijing on Jan. 23. During the event, the company highlighted its achievements in mass production, development and deployment, as well as its plans for further expansion. James Yu, co-founder, chairman and CEO of QCraft, delivered a keynote speech titled "Bringing Autonomous Driving into Real Life," describing 2026 as the start of a t...

Tenstorrent, a US-based company specializing in building computers for AI, has announced its participation in the CHASSIS program, a three-year international research initiative in the EU focused on software-defined mobility projects. The key members of the consortium include Arteris, Axelera AI, BMW Group, Bosch, Fraunhofer, Imec, Infineon, Menta, NXP, Renault/Ampere, Siemens, Stellantis-CRF and TTTech-Auto. Within the consortium, Tenstorrent will focus on developing chiplet-based hardware...

Samvardhana Motherson International Ltd., an India-based automotive supplier also known as Motherson Group, is expanding its operations in Hungary through several investments, including a research and development program and the establishment of a regional services center. The company’s €54 million R&D project focuses on AI-based sensors and advanced visual systems integrated into rearview mirrors. The investment is set to create 55 new jobs for automotive product development professi...

Toshiba Electronics Europe has collaborated with Mikroe to incorporate its SmartMCD technology for dual brushed DC motors into the SmartMCD TB9M001FTG board. This partnership aims to assist automotive system engineers in designing the TB9M001FTG smart motor control driver, which is applicable to automotive components such as electric sunroofs, windshield wipers, powered windows and adjustable seats, thereby simplifying the prototyping stage. The SmartMCD device adheres to AEC-Q100 (Grade...

Qualcomm Technologies and Google have expanded their decade-long collaboration in the automotive industry, aiming to revolutionize the sector with innovative, AI-driven solutions. This partnership integrates Qualcomm's Snapdragon Digital Chassis technology with Google's automotive software to create advanced vehicles capable of adapting to drivers' needs. The collaboration focuses on delivering scalable AI experiences to millions of vehicles, starting with the pioneering work in Snapdragon-power...

Silicon Storage Technology (SST), a subsidiary of Microchip Technology Inc., in collaboration with United Microelectronics Corp. (UMC), announced the completion of the full qualification and release of SST's embedded SuperFlash Gen 4 (ESF4) with automotive-grade 1 (AG1) capability on UMC's 28HPC+ foundry process platform. The partnership between SST and UMC focused on enhancing embedded non-volatile memory (eNVM) performance for automotive controllers, while reducing the number of additional mas...

Schaeffler is leading the ReDriveS research project, which is funded by the German Federal Ministry for Economic Affairs and Energy. This initiative aims to develop an industrial, automated, scalable and non-destructive recycling concept for electric-axle drives. The ReDriveS project seeks to provide a technological edge in complying with statutory recycling requirements while ensuring cost-effective access to high-value materials in the future. Collaborating with 25 partners from industry...

At the Consumer Electronics Show (CES) 2026, held earlier in January in Las Vegas, Autolink announced the world's first Deep Fusion Electronic/Electric Architecture (EEA), representing a significant advancement in the field of intelligent vehicle technology. The architecture is described as the automotive industry's first fully unified integration of central compute, zonal control and high-bandwidth in-vehicle optical communication. It serves as a platform for advanced driver intelligence, incor...

BMW and Qualcomm have collaborated to create an advanced driver assistance system known as Ride Pilot, which is now available for use by third-party automakers. Qualcomm Europe President Enrico Salvatori confirmed the existence of additional customers for the system during a discussion at the Consumer Electronics Show (CES) 2026, though specific details on these customers or a timeline for their announcement were not provided.  Qualcomm and BMW have been in talks with various automakers ...

Forvia Hella, an international automotive supplier, is collaborating with NXP Semiconductors to advance high-resolution radar technology. This collaboration was announced during the Consumer Electronics Show (CES) in Las Vegas. Their joint effort focuses on the latest generation of high-resolution radar sensors, known as ForWave7HD, which feature up to 32 transmission and receive channels each. These ForWave7HD radar sensors are crucial for automated driving at SAE Level 2+ and Level 3. ...

At the Consumer Electronics Show (CES) 2026 held in Las Vegas, Garmin announced the expansion of its collaboration on automotive technology by introducing the Nexus automotive-grade high-performance compute (HPC) platform. This platform, powered by Qualcomm's Snapdragon Elite Platform for automotive, is designed to integrate various vehicle domains, including in-vehicle infotainment, instrument clusters and advanced driver assistance systems into a cohesive system. Scheduled for programs star...

Autolink, a mainland China-based technology company specializing in next-generation automotive electronic/electrical (E/E) systems, announced a strategic partnership with ReinOCS at the Consumer Electronics Show (CES) 2026 held in Las Vegas. Through a long-term cooperation agreement, Autolink's Deep Fusion EEA — an optical-electrical integrated E/E architecture — will serve as the foundation for joint solutions in intelligent vehicles. Deep Fusion EEA integrates centralized computing, zonal ...

ZF and Qualcomm Technologies have announced a collaboration to create an advanced and scalable advanced driver assistance system solution, integrating Qualcomm's Snapdragon Ride system-on-chips (SoCs) with ZF's ProAI supercomputer. This partnership aims to provide a platform for automated driving, offering automakers the ability to deploy scalable ADAS solutions across various vehicle types and automation levels, up to Level 3. The Snapdragon Ride enables the ZF ProAI supercomputer to serve...

FIH, a subsidiary of Hon Hai Technology Group (Foxconn), participated in the Consumer Electronics Show (CES) 2026 under the theme Driving the Future of Smart Mobility. The company exhibited its core automotive electronics solutions, including high-performance computing (HPC) platforms, in-vehicle infotainment (IVI) systems, advanced driver assistance systems and telematics control units (TCUs). As part of its showcase, FIH introduced an interactive demo vehicle demonstrating the centralized...

Volkswagen Group and Qualcomm Technologies have announced a letter of intent (LOI) for a long-term supply agreement to deliver next-generation infotainment and connectivity capabilities powered by the latter's Snapdragon Digital Chassis solutions. Under the intended agreement, Qualcomm Technologies would become Volkswagen Group’s primary technology provider for infotainment system-on-chips (SoCs) supporting the Group’s zonal software-defined vehicle (SDV) architecture, developed fo...

Visteon Corp. has showcased the production specifications and original equipment manufacturer implementations of its High-Performance Compute (HPC) solution built on the Snapdragon Cockpit Elite platform. Building on the technology collaboration announced with Qualcomm Technologies at Auto Shanghai 2025, Visteon is now demonstrating the solution’s capabilities with leading automotive original equipment manufacturers worldwide. As the industry transitions toward centralized and zonal archite...

Infineon Technologies and HL Klemove have signed a memorandum of understanding to enhance their strategic collaboration in automotive technologies. The partnership is focused on combining Infineon's expertise in semiconductors with HL Klemove's advanced autonomous driving systems to innovate vehicle electronic architecture for the software-defined vehicle era and advance autonomous driving technologies. The partnership will focus on developing next-generation zonal control units, with Infineo...

Hyundai Mobis and Qualcomm Technologies Inc. have signed a comprehensive agreement at the Consumer Electronics Show (CES) 2026 to co-develop next-generation solutions for software-defined vehicles (SDVs) and advanced driver assistance systems. The memorandum of understanding (MOU) was signed Jan. 7 at the Hyundai Mobis booth, with key executives from both companies in attendance. This collaboration aims to enhance the performance, efficiency and stability of ADAS by utilizing Qualcomm's Sna...

Autolink, a provider of intelligent cockpit and scalable electrical/electronic (E/E) architecture solutions, has announced a strategic partnership with Tata Elxsi at the Consumer Electronics Show (CES) 2026 in Las Vegas. This partnership aims to reshape software-defined vehicle (SDV) development for global original equipment manufacturers by delivering faster, smarter and more cost-efficient solutions. With the automotive industry moving from distributed electronic control units to centralized c...

Hesai Technology has announced its selection by NVIDIA as a lidar partner for the NVIDIA DRIVE AGX Hyperion 10 platform, which is designed to enable Level 4-ready autonomous vehicles. This partnership positions Hesai among the latest companies to have their sensor suites qualified on the open, production-ready DRIVE Hyperion architecture. The DRIVE Hyperion ecosystem includes a range of sensor technologies, such as cameras, radar, lidar and ultrasonic sensors, aimed at optimizing perception...

At the Consumer Electronics Show (CES) 2026 in Las Vegas, Leapmotor and Qualcomm Technologies jointly unveiled what they claim is the world's first cross-domain integrated solution using Snapdragon Cockpit Elite and Snapdragon Ride Elite automotive platforms. Displayed at Qualcomm's booth, the controller showcased how a dual-chipset architecture can enhance compute performance, streamline vehicle electronics and enable advanced AI capabilities throughout a vehicle. This collaboration underlin...

Magna has announced the expansion of its strategic collaboration with NVIDIA to enhance original equipment manufacturer deployments on the NVIDIA DRIVE Hyperion platform. In this collaboration, Magna will provide OEMs with a comprehensive suite of services, including system integration, validation and vehicle launch for the NVIDIA DRIVE AV stack operating on DRIVE AGX Thor accelerated compute. This will include platform launch and execution services for various levels of autonomy syste...

Qualcomm Technologies has successfully expanded global adoption of its Snapdragon Digital Chassis solutions to more automakers at the Consumer Electronics Show (CES) 2026, while showcasing how agentic AI and high-performance compute are transforming vehicles in the software-defined era. Through new and expanded collaborations across its automotive portfolio, Qualcomm Technologies continues to strengthen its position as a trusted partner for automakers worldwide, enabling intelligent, immersive a...

Teradar, a US-based company specializing in terahertz (THz) vision technology, introduced its flagship sensor, Teradar Summit, at the Consumer Electronics Show (CES) 2026. The Teradar Summit is a long-range, high-resolution sensor designed to operate effectively in all weather conditions. This development addresses a crucial gap left by traditional radar and lidar sensors.  Teradar is engaged in eight development partnerships across the US and Germany and plans to start bidding on high-v...

Schaeffler will present its comprehensive motion technology portfolio at the Consumer Electronics Show 2026 (CES), which will be held in Las Vegas this week. The exhibition will feature intelligent motion components and systems addressing industry challenges in humanoid robotics, energy generation, industrial automation and vehicle technology. The German supplier will present technologies for software-defined vehicles (SDVs) that simplify vehicle architectures and enable real-time control. Th...

Canatu, a Finland-based company specialising in carbon nanotube (CNT) technology, has entered into a 17-month Joint Development Agreement (JDA) with DENSO Corp. to develop advanced manufacturing equipment to produce large-area CNT films specifically for automotive applications. According to the Finnish company, scaling the CNT film size is essential for enabling future applications, including full windshield heaters.   As part of the agreement, a large-scale CNT deposition chamber will b...

In a significant collaboration aimed at enhancing automotive cybersecurity, Blue Cloud Softech Solutions and ConnectM Technology Solutions have signed a memorandum of understanding valued at approximately $50 million. This partnership is focused on co-developing a cutting-edge semiconductor platform tailored for connected and electric vehicles. The collaboration will result in an EdgeAI system-on-chip (SoC) embedded with advanced security capabilities, including real-time threat detection, intru...

Samsung Electronics has announced it is supplying automotive semiconductors for BMW’s next-generation electric vehicle, the iX3, highlighting the South Korean technology group’s strategy to broaden its semiconductor business beyond memory into logic chips and foundry-related services. According to industry sources, Samsung’s Device Solutions division is providing its in-house automotive infotainment processor, the Exynos Auto V720, for BMW’s new iX3, which made its public debut at the IA...

Arbe Robotics has announced that a state-owned automaker in China has selected Hirain Technologies, along with Arbe's Ultra HD Radar, for its Level 4 autonomous vehicle program. The production of these vehicles is scheduled to commence in December 2026, aiming to enhance safety and autonomy in both urban and highway settings. The automaker's decision follows several years of collaborative development, resulting in the selection of Hirain's LRR610 Radar, which is powered by Arbe's advanced chi...

Leapmotor, a leading manufacturer of new-energy vehicles (NEVs), has secured a significant investment from China FAW Group, marking a notable instance of a mainland Chinese state-owned automaker investing in an NEV startup. According to a regulatory filing, Leapmotor has signed an agreement on Dec. 28 with FAW Equity Investment, a wholly owned subsidiary of China FAW, to issue 74,832,245 domestic shares at 50.03 yuan (about $7.13) per share, raising 3.74 billion yuan. The newly rais...

SiEngine, a mainland Chinese automotive research and development firm, has begun mass production of its new AI-capable chips for autonomous vehicles and advanced driver assistance systems. The AD1000 and AD800 system-on-chip (SoC) units are fabricated on a 7-nanometer (nm) process, providing improved thermal and power efficiency. These chips are aimed at car manufacturers interested in implementing Level 2 to Level 4 autonomous driving features, which include hands-free and attention-free drivin...

MediaTek has announced a collaboration with DENSO to develop a tailored automotive system-on-chip (SoC) solution for advanced driver assistance systems and cockpit systems. This partnership combines DENSO's expertise in automotive safety and integration with MediaTek's technology from its Dimensity AX development, focusing on creating a scalable and production-ready platform for next-generation driver assistance systems. The collaboration between MediaTek and DENSO is anchored on three fundam...

ROHM and Tata Electronics, a player in India's electronics and semiconductor sector, have announced a strategic partnership to manufacture semiconductors in India for both domestic and international markets. This collaboration aims to leverage the strengths and ecosystems of both companies, enhancing business opportunities and reinforcing the semiconductor industries' ties between Japan and India. Initially, the partnership will focus on power semiconductor manufacturing by integrating ROHM's...

Intellias, a global software engineering and digital consulting company, plans to showcase its AI-enabled Engineering Maturity Model, chip-to-cloud Automotive Technology Platform, and partner-driven solutions that aim to accelerate the future of intelligent mobility at Consumer Electronics Show (CES) 2026. Intellias will be located at Meeting Space #3377 in the LVCC West Hall, Vehicle Tech & Advanced Mobility Area, where it will present next-generation solutions for software-defined mobility...

Aeva is preparing to showcase advancements in sensing and perception systems at the Consumer Electronics Show (CES) 2026 in Las Vegas from Jan. 6 to 9, 2026. It plans to demonstrate a passenger original equipment manufacturer vehicle equipped with 4D lidar integrated into the windshield and introduce a new 4D lidar sensor designed for applications in robotics, automotive and smart infrastructure. This sensor marks an evolution of Aeva's lidar-on-chip platform, enhancing capabiliti...

Rivian plans to launch its Gen 3 Autonomy Platform in late 2026 on the R2 model, featuring a shift to in-house silicon designed for vision-centric physical AI. This platform will be powered by the first-generation Rivian Autonomy Processor (RAP1), a custom 5-nanometer (nm) processor integrating processing and memory into a multichip module. The Autonomy Compute Module 3 (ACM3) will utilize RAP1 and boasts notable specifications, including 1600 sparse INT8 tera operations per second (TOPS) utiliz...

Infineon Technologies and Lenovo are strengthening their collaboration to advance autonomous driving technologies. Lenovo's autonomous driving domain controller units, AD1 and AH1, will utilize Infineon's AURIX microcontrollers to enhance advanced driving assistance systems, energy efficiency and data exchange within vehicles. This partnership seeks to develop intelligent, high-performance automotive computing platforms that integrate AI in software-defined vehicles (SDVs). The goal is to c...

Rimac Technology, a division of the Croatian carmaker Rimac Group, is developing a solid-state battery for Bugatti, Autocar magazine reported Dec. 9, citing an interview with Nurdin Pitarevic, COO of the company. Pitarevic said that Rimac Technology is already well advanced in developing a new range of solid-state batteries. The company is collaborating with cell-maker ProLogium and Mitsubishi, aiming for market release late in the decade. Pitarevic anticipates the first application of these bat...

Wolfspeed announced that its automotive metal-oxide-semiconductor field-effect transistors (MOSFETs) will be used in the onboard charger systems for Toyota's battery-electric vehicles (BEVs). The integration of silicon carbide in these systems is part of a broader industry move toward clean energy vehicles, as it is becoming the standard semiconductor for high-voltage onboard power systems. Silicon carbide is known for enabling fast, efficient and high-power density electric vehicle powe...

Hyundai Mobis is set to present over 30 advanced automotive technologies at the Consumer Electronics Show (CES) 2026 event in Las Vegas, scheduled from Jan. 6 to 9, 2026. The leading automotive supplier from South Korea will operate its booth as a private exhibit for invited customers, focusing on meaningful business opportunities with key North American clients. Under the theme Layer of Progress, Hyundai Mobis aims to showcase how its technologies connect and evolve, highlighting innovations...

Quintauris has announced a technical partnership with Vector to integrate the MICROSAR Classic software stack into its RT-EUROPA real-time automotive platform. This collaboration aims to advance the development of software-defined systems for next-generation vehicles. Quintauris, specializing in RISC-V solutions, will combine Vector's widely adopted AUTOSAR Classic software with the RT-EUROPA platform. The RT-EUROPA platform is designed to accelerate development and ensure interoperability for a...

Hesai Technology, a global company specializing in lidar solutions, announced its participation in Consumer Electronics Show (CES) 2026, which will take place in Las Vegas from Jan. 6–9, 2026. In 2025, Hesai achieved a significant milestone by becoming the first lidar company to deliver more than 2 million cumulative lidar units, supporting large-scale applications in the automotive and robotics sectors in response to the growing global demand for advanced autonomy. The advanced driver a...

Aeva announced a significant partnership with a top European passenger original equipment manufacturer to become its exclusive lidar supplier for a global series-production vehicle platform aimed at enabling Level 3 automated driving. This decision comes after the successful completion of a joint development program with the OEM, which is ranked among the top-10 global passenger vehicle manufacturers. The agreement, spanning the next decade, will support various vehicle models across the OE...

Tier IV and Horiba Mira, a UK-based provider of engineering, research and test services, have announced a collaboration to advance autonomous driving technologies in the UK and Europe. This partnership will allow Tier IV to extend its autonomous driving platforms in the region, leveraging Horiba Mira's facilities and engineering expertise. In this collaboration, Tier IV will provide software and hardware solutions, including its Minibus 2.0 electric vehicle, sensor packages and operational su...

Point One Navigation, a US-based startup specializing in high-precision location technology, has announced the successful completion of a $35 million series-C funding round, led by Khosla Ventures, with participation from existing investors IA Ventures, UP Partners and Alumni Ventures. This capital will be used for infrastructure expansion, software innovation, integration with original equipment manufacturers, and growth in research and development, engineering, customer success, and inter...

Indian supplier Varroc Engineering Ltd. has secured a contract with an electric vehicle manufacturer to supply high-voltage electronics for electric powertrain (e-powertrain) components. The Pune, Maharashtra-based company will deliver a comprehensive suite of components, including power electronics units, inverters, onboard chargers, battery management systems (BMS) and DC-DC converters. These products will be manufactured at Varroc's facility in Romania. The supply agreement, which spans ...

Codasip, a provider of functional safety and cybersecurity RISC-V CPUs, has entered into a strategic licensing agreement with EnSilica, a provider of mixed-signal and digital application-specific integrated circuits (ASICs). The agreement involves Codasip's Capability Hardware Enhanced RISC Instructions (CHERI)-enabled embedded CPU IP product from its 700 family of cores, which EnSilica will integrate into its newly announced quantum-resilient commercial-off-the-shelf (COTS) processor device. Th...

Renault Korea has announced the release of the fourth over-the-air (OTA) software update for its Grand Koleos sport utility vehicle, highlighting a strategic shift toward post-purchase digital upgrades in the automotive industry. This update provides existing Grand Koleos owners with access to several features available in the 2026 model-year version, eliminating the need to visit a service center. It is noted as one of the most extensive cycles of OTA updates applied to an internal combust...

Siemens has announced that SAICEC is using its PAVE360 software to develop complex digital twins of automotive architectures. This allows for comprehensive verification of automotive components from system-level to chip-level, and aims to accelerate the adoption of advanced solutions for software-defined vehicle (SDV) development. The initiative assists original equipment manufacturers in identifying next-generation chip technologies and developing crucial systems at the required scale and ...

Mitsubishi Fuso Truck and Bus Corp. is collaborating with REE Automotive to accelerate its transition to software-defined trucks that are more intelligent, safer and can be upgraded over the air. The partnership involves Mitsubishi Fuso evaluating REE's software-defined vehicle (SDV) and x-by-wire (XBW) technologies as a potential supplier for future vehicle platforms. The joint project has initiated the integration of REE's SDV technology into a Mitsubishi Fuso eCanter electric truck. The co...

Joynext recently participated in the Tech Day event at Hyundai Motor's global headquarters in South Korea, where it showcased its cross-domain nCCU (central computing unit) series solution. This solution has gained significant recognition from Hyundai due to its technological strength and global delivery capabilities. In the future, the nCCU series solution is expected to be promoted for global mass production based on next-generation electrical/electronic (E/E) architecture, as indica...

Siemens announced that SAICEC, a provider of chip and system design services for the automotive industry, has initiated the construction of complex digital twins of automotive architectures using Siemens' PAVE360 software. This development aids in facilitating comprehensive verification of automotive components, ranging from system-level to chip-level. The initiative aims to expedite the adoption of advanced solutions, thus addressing the challenges associated with software-defined vehicle (SDV)...

German luxury-car maker Mercedes-Benz is investing €55 million in establishing its first research and development center in Hungary. Péter Szijjártó, minister of Foreign Affairs and Trade, government of Hungary, announced that Mercedes-Benz's investment in the city of Kecskemét will include early hardware and software development, with prototype testing to soon begin. The technologies developed at the newly opened R&D center will be used in new electric p...

BorgWarner is deepening its collaboration with Chinese automaker Great Wall Motor (GWM) in the field of electrified propulsion, expanding on two dual-inverter programs to include two additional projects. The company plans to begin mass production of its new dual inverters for GWM in 2026. Stefan Demmerle, vice president of BorgWarner Inc. and president and general manager of PowerDrive Systems, highlighted BorgWarner's technical expertise in electrification and dual-inverter products as ...

Schaeffler has secured an order from a vehicle manufacturer in North America to supply dual inverters for its new plug-in hybrid platform, which will debut in a new pickup truck. This advanced technology will control the electric drive for auxiliary units and serve as a traction inverter, powering an electric drive motor with an output exceeding 200 kW. The dual inverter is specifically designed for electrified pickup trucks, a popular vehicle type in North America. Consequently, this order m...

Foresight Autonomous has announced a strategic commercial cooperation agreement with a prominent Chinese manufacturer specializing in AI-based stereo vision solutions. According to the agreement, Foresight will integrate the manufacturer's 3D perception systems into its product offerings, targeting exclusive commercialization in India and South Korea, with plans for further global market distribution. The collaboration aims to enhance Foresight's product range, initially focusing on the advanced...

Hesai Technology has been selected by Li Auto to supply lidars for its next-generation assisted driving platform, which includes the L Series, i Series and MEGA. Li Auto designs, develops, manufactures and sells smart electric vehicles, having delivered over 1.46 million vehicles as of Oct. 31. Lidars have been a standard feature in all new Li Auto models since May. Since 2021, Hesai and Li Auto have maintained a close partnership focused on collaboration and innovation. This cooperation...

Stradvision has announced a multiyear collaboration with AMD to advance perception technology in autonomous driving. At Consumer Electronics Show (CES) 2026, the companies will demonstrate Stradvision's MultiVision software running on the AMD Versal AI Edge Series Gen 2 VEK385 Evaluation Kit, showcasing multicamera perception capabilities in next-generation vehicles.  The partnership integrates Stradvision's SVNet and MultiVision software with AMD's automotive system-on-chips (...

GlobalFoundries (GF) has announced a technology licensing agreement with TSMC for 650-V and 80-V gallium nitride (GaN) technology. This strategic move is intended to accelerate GF's development of next-generation GaN products for applications in data centers and automotive power systems, thereby providing US-based GaN capacity for a global clientele. As traditional silicon complementary metal-oxide-semiconductor (CMOS) technologies approach their performance limits, GaN is being recogniz...

AEye announced an acceleration of its growth strategy through expanded manufacturing with Liteon Technology and a strategic investment from an institutional investor. This strategy will enhance AEye's capital-light model, enabling the rapid scaling of Apollo production to meet increasing global demand while maintaining efficiency and financial discipline. Liteon, specializing in optoelectronics and power management, is establishing a dedicated manufacturing line for Apollo lidar units. T...

Volkswagen Group China announced the development of its first self-designed system-on-chip (SoC) in mainland China. This chip, developed locally through Carizon, a joint venture between Cariad and Chinese technology company Horizon Robotics, is intended for the next generation of smart, connected cars in China. It will power Volkswagen's advanced driver assistance systems and automated driving functions, processing data from cameras and sensors to enhance driving safety and intelligence. Volkswa...

Magnachip Semiconductor has announced an agreement with Hyundai Mobis Co. Ltd. concerning the use of high-performance insulated-gate bipolar transistor (IGBT) technology. Hyundai Mobis, a global provider of auto parts focusing on differentiated mobility solutions, has been collaborating with Magnachip since 2015 on developing IGBTs for traction inverters targeted at hybrid and electric vehicles. Recognizing the importance of internalizing core power semiconductor technologies for traction system...

The new Geely EX5, set to launch in the UK, serves as a testament to how Arm technology seamlessly combines performance, safety and connectivity on a single platform. The SiEngine StarEagle (SE1000) system-on-chip (SoC), at the core of the EX5, is built on Arm's Automotive Enhanced technologies, showing the benefits of close silicon partnerships in automotive innovation. This SoC houses Arm Cortex-A CPUs for application processing, Arm Cortex-R CPUs for real-time control, Arm Mali GPUs for high-...

Niron Magnetics has announced a partnership with the Greater St. Cloud Development Corp. (GSDC) to emphasize the regional economic impact of its new project — a 190,000-square-foot permanent magnet manufacturing facility in the Sartell city, Minnesota, US. The collaboration builds on previous efforts between the two organizations, which involved creating an incentive package and a development plan, as well as setting job creation targets to establish Niron Magnetics' Plant 1 in Sartell. Wor...

The United States and Japan have signed a framework agreement to secure the supply of rare earths and critical minerals, aiming to reduce dependence on mainland China's dominant role in the global market. This agreement was signed by US President Donald Trump and Japanese Prime Minister Sanae Takaichi during Trump's visit to Tokyo, which was part of his weeklong tour of Asia. The document outlines cooperation in extraction, recycling, stockpiling and investment in mineral supply chains crucia...

Uber Technologies Inc. announced a collaboration with NVIDIA to enhance the next generation of robo-taxi and autonomous delivery fleets using NVIDIA AI Architecture, according to the Oct. 28 news release. The partnership aims to significantly expand Uber's global autonomous fleets. Stellantis will contribute by delivering at least 5,000 NVIDIA-DRIVE-powered Level 4 (L4) autonomous vehicles to Uber for robo-taxi operations both in the US and internationally. These vehicles will be developed wi...

Mobility technology company Ecarx announced a strategic partnership with Victory Giant Technology (VGT), renowned for its expertise in printed circuit boards (PCBs). The collaboration aims to develop advanced computing platforms for the automotive sector. VGT is known for its high-density interconnect (HDI) and high-layer-count PCBs, which are crucial in automotive intelligence, AI and data center applications. Operating manufacturing sites in Vietnam, Malaysia and Thailand, VGT serves over 350 ...

Tata Technologies has announced a strategic collaboration with Synopsys to accelerate the development of software-defined vehicles (SDVs). The partnership will focus on the early and expedited verification and validation of electronic systems, aiming to address the complexities inherent in next-generation mobility. Tata Technologies will contribute its deep domain expertise in vehicle engineering, while Synopsys will offer its virtualization solutions for deploying electronics digital twins, cre...

DENSO Corp. will participate in the Japan Mobility Show 2025 at Tokyo Big Sight from Oct. 30 to Nov. 9. The theme of DENSO's exhibit will focus on technologies that enhance societal value through advancements in automobiles and connectivity with urban environments. The exhibition will include a four-seater simulation vehicle, an immersive theatre and presentations that feature videos and real products. DENSO highlights the future of transportation with the introduction of software-defined ...

ChipSync and Cortus are collaborating to develop electronic automotive and consumer solutions for the Indian market. ChipSync is an innovator in connected car technology in India, while Cortus specializes in reduced instruction set computing, version 5 (RISC-V) chips and AI inference chiplets. The partnership focuses on integrating Cortus' RISC-V automotive chips and AI chiplets with ChipSync's connected car software solutions, aiming to advance automotive and software-defined vehicle techn...

Novosense Microelectronics, United Automotive Electronic Systems (UAES) and Innoscience have entered into a strategic alliance to advance power electronics in new-energy vehicles (NEVs). The collaboration will focus on developing intelligent integrated gallium nitride (GaN) products to enhance GaN driving and protection features, thereby supporting higher power density and facilitating wider application in automotive systems. GaN, known for its superior material properties compared to traditi...

Imec announced that GlobalFoundries has joined its Automotive Chiplet Program (ACP) as a foundry partner. Alongside GlobalFoundries, semiconductor and system companies such as Infineon, Silicon Box, STATS ChipPAC and Japanese autonomous driving technology developer Tier IV have also committed to the ACP. This expansion aims to enhance Imec's network and accelerate the development and adoption of advanced chiplet architecture tailored for the automotive industry's specific requirements. With t...

Autoliv plans to establish a joint venture with Hangsheng Electric Co. Ltd. (HSAE), a company specializing in automotive electronics, to jointly develop and produce advanced safety electronics tailored to the evolving automotive market in mainland China. The JV is expected to be formally established in the first quarter of 2026, contingent upon receiving regulatory approvals from mainland Chinese authorities. HSAE will have a majority stake of 60% in the JV, with Autoliv owning the remaining 40%...

Microchip Technology and AVIVA Links have achieved the Automotive SerDes Alliance Motion Link (ASA-ML) interoperability milestone, marking a shift toward open standards in automotive connectivity. In October, AVIVA Links announced its acquisition by NXP Semiconductors, reflecting industry support for ASA-ML standards. ASA-ML is being increasingly adopted by original equipment manufacturers and tier 1 suppliers for in-vehicle networking due to its high-speed communication capabilities for cameras...

Bosch has initiated a strategic integration of the NVIDIA DRIVE AGX Thor platform into its upcoming compute and electronic control unit (ECU) architectures. This collaboration aims to advance Bosch's provision of AI-driven solutions for software-defined vehicles (SDVs), reflecting the rising trend among automakers toward centralized computing platforms that can manage both safety-critical tasks and AI workloads. Industry analysts predict that by 2030, over half of new vehicles sold will adopt...