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    Is the automotive industry facing another chip crisis? Nexperia's control shift raises questions
    On Oct. 13, the Dutch government took control of Nexperia, a semiconductor manufacturer owned by mainland China's Wingtech, citing national security concerns and governance issues. This intervention aims to safeguard critical technological capabilities in the Netherlands and Europe, as approximately 80% of Nexperia's production capacity is based in mainland China, raising alarms about potential supply chain disruptions in the automotive industry. Who is exposed? While German original equip...
    Dutch move on Nexperia triggers nervousness among auto suppliers and OEMs
    On Monday, Oct. 13, the Dutch government took a decisive step to assume control of Nexperia, the Nijmegen-based semiconductor manufacturer owned by mainland China’s Wingtech. Officials described the intervention as “highly exceptional,” citing governance shortcomings, national security risks and the need to safeguard critical technological capabilities for the Netherlands and Europe. Nexperia, headquartered in Nijmegen, the Netherlands, has been owned by Wingtech since 2018. Wingtech is...
    A new tug of war for semiconductors: data centers vs. automakers
    The automotive semiconductor market has been navigating a period of unusual volatility. On one side, near-term demand pressures are easing. The slowdown in electric vehicle adoption is reducing average chip content per vehicle, since EVs typically contain significantly more semiconductors than internal combustion models. Tariffs are further dampening global vehicle demand. S&P Global Mobility estimates suggest up to 0.6 million fewer vehicles will be produced in 2026 because of trade barrier...
    Ecarx collaborates with Victory Giant Technology to develop automotive computing platforms
    Mobility technology company Ecarx announced a strategic partnership with Victory Giant Technology (VGT), renowned for its expertise in printed circuit boards (PCBs). The collaboration aims to develop advanced computing platforms for the automotive sector. VGT is known for its high-density interconnect (HDI) and high-layer-count PCBs, which are crucial in automotive intelligence, AI and data center applications. Operating manufacturing sites in Vietnam, Malaysia and Thailand, VGT serves over 350 ...
    Tata Technologies collaborates with Synopsys to accelerate software-defined vehicle innovation
    Tata Technologies has announced a strategic collaboration with Synopsys to accelerate the development of software-defined vehicles (SDVs). The partnership will focus on the early and expedited verification and validation of electronic systems, aiming to address the complexities inherent in next-generation mobility. Tata Technologies will contribute its deep domain expertise in vehicle engineering, while Synopsys will offer its virtualization solutions for deploying electronics digital twins, cre...
    DENSO to showcase future mobility technologies at Japan Mobility Show 2025
    DENSO Corp. will participate in the Japan Mobility Show 2025 at Tokyo Big Sight from Oct. 30 to Nov. 9. The theme of DENSO's exhibit will focus on technologies that enhance societal value through advancements in automobiles and connectivity with urban environments. The exhibition will include a four-seater simulation vehicle, an immersive theatre and presentations that feature videos and real products. DENSO highlights the future of transportation with the introduction of software-defined ...
    ChipSync and Cortus collaborate to offer tailored SDV solutions in India
    ChipSync and Cortus are collaborating to develop electronic automotive and consumer solutions for the Indian market. ChipSync is an innovator in connected car technology in India, while Cortus specializes in reduced instruction set computing, version 5 (RISC-V) chips and AI inference chiplets. The partnership focuses on integrating Cortus' RISC-V automotive chips and AI chiplets with ChipSync's connected car software solutions, aiming to advance automotive and software-defined vehicle techn...
    Novosense, UAES and Innoscience form alliance to advance power electronics in new-energy vehicles
    Novosense Microelectronics, United Automotive Electronic Systems (UAES) and Innoscience have entered into a strategic alliance to advance power electronics in new-energy vehicles (NEVs). The collaboration will focus on developing intelligent integrated gallium nitride (GaN) products to enhance GaN driving and protection features, thereby supporting higher power density and facilitating wider application in automotive systems. GaN, known for its superior material properties compared to traditi...
    GlobalFoundries, Infineon, Silicon Box, STATS ChipPAC, Tier IV join Imec Automotive Chiplet Program
    Imec announced that GlobalFoundries has joined its Automotive Chiplet Program (ACP) as a foundry partner. Alongside GlobalFoundries, semiconductor and system companies such as Infineon, Silicon Box, STATS ChipPAC and Japanese autonomous driving technology developer Tier IV have also committed to the ACP. This expansion aims to enhance Imec's network and accelerate the development and adoption of advanced chiplet architecture tailored for the automotive industry's specific requirements. With t...
    Autoliv, HSAE agree to form JV for automotive safety electronics in mainland China
    Autoliv plans to establish a joint venture with Hangsheng Electric Co. Ltd. (HSAE), a company specializing in automotive electronics, to jointly develop and produce advanced safety electronics tailored to the evolving automotive market in mainland China. The JV is expected to be formally established in the first quarter of 2026, contingent upon receiving regulatory approvals from mainland Chinese authorities. HSAE will have a majority stake of 60% in the JV, with Autoliv owning the remaining 40%...
    Microchip and AVIVA Links achieve Automotive SerDes Alliance Motion Link interoperability
    Microchip Technology and AVIVA Links have achieved the Automotive SerDes Alliance Motion Link (ASA-ML) interoperability milestone, marking a shift toward open standards in automotive connectivity. In October, AVIVA Links announced its acquisition by NXP Semiconductors, reflecting industry support for ASA-ML standards. ASA-ML is being increasingly adopted by original equipment manufacturers and tier 1 suppliers for in-vehicle networking due to its high-speed communication capabilities for cameras...
    Bosch integrates NVIDIA DRIVE AGX Thor into vehicle platforms for AI-driven advancements
    Bosch has initiated a strategic integration of the NVIDIA DRIVE AGX Thor platform into its upcoming compute and electronic control unit (ECU) architectures. This collaboration aims to advance Bosch's provision of AI-driven solutions for software-defined vehicles (SDVs), reflecting the rising trend among automakers toward centralized computing platforms that can manage both safety-critical tasks and AI workloads. Industry analysts predict that by 2030, over half of new vehicles sold will adopt...
    Mainland Chinese automakers’ tie-ups with Huawei to speed up smart EV launches
    Mainland China’s state-run automakers have pinned hopes on their partnerships with Huawei to gain a solid foothold in the country’s highly competitive electric vehicle (EV) market. Under Huawei-backed Harmony Intelligent Mobility Alliance (HIMA), mainland Chinese automakers have introduced a diverse range of EVs featuring Huawei’s smart vehicle technologies over the past three years. In late September, SAIC became the fifth automaker to join the auto alliance, following the footsteps of Se...
    Betamek collaborates with Jiangsu Yibang to advance EV charging solutions in ASEAN
    Betamek Bhd., an original design manufacturer and provider of electronics manufacturing services for the automotive industry, has announced a memorandum of understanding (MOU) with Jiangsu Yibang New Energy Technology Co. Ltd., a mainland Chinese company known for its expertise in new-energy vehicle charging protocol conversion technologies. Betamek, through its subsidiary Betamek Research Sdn. Bhd., aims to collaborate with Yibang in areas such as technical research and development, supply...
    Volkswagen to integrate Xpeng's autonomous driving technology in China EVs by 2026
    Volkswagen plans to incorporate Xpeng's autonomous driving technology, XNGP, into its China electric vehicles starting in 2026, with the first model being a midsize sport utility vehicle developed jointly with Xpeng. Initially, autonomous driving development was assigned to Cariad China, Volkswagen's software division. In July 2023, Volkswagen acquired a 4.99% stake in Xpeng for €700 million. By early 2024, both companies confirmed their collaboration on two midsize SUVs expected to launch in ...
    Quintauris collaborates with Everspin Technologies to enhance reliability of RISC-V platforms
    Quintauris, the company founded as a single source to enable compatible RISC-V–based products, and Everspin Technologies, a leader in magnetoresistive RAM (MRAM) and spin-transfer torque MRAM (STT-MRAM), announced a strategic collaboration to bring advanced memory solutions into the Quintauris ecosystem. The collaboration aims to strengthen the reliability and safety of RISC-V–based platforms, particularly for automotive, industrial and edge applications where data persistence, ...
    Forvia eyes more than €1 billion in annual revenue from India within the next five years
    Forvia is expanding its presence in the Indian automotive market with goal to generate more than €1 billion in revenue within the next five years, Autocar Professional reported Oct. 2. The French automotive supplier, which is growing at approximately 11% in India, plans to achieve this revenue target through an investment of approximately €218 million, focusing on local manufacturing and advanced technology. Martin Fischer, group CEO of Forvia, has emphasized India's growing importan...
    Tobii and STMicroelectronics launch mass production of advanced in-cabin sensing technology
    Tobii and STMicroelectronics have commenced mass production of an advanced interior sensing system for a premium European carmaker, enhancing driver and passenger monitoring. This cost-effective solution uses a single camera that integrates Tobii's interior-sensing technology with STMicroelectronics' imaging sensors, offering high-quality imaging both in daytime and nighttime environments. Adrian Capata,  senior vice president of Tobii Autosense, highlighted the collaboration with STMi...
    Mercedes-Benz collaborates with Athos Silicon to enhance autonomous driving technology
    Mercedes-Benz has announced a strategic collaboration with Athos Silicon, a semiconductor company formed by former engineers from Mercedes-Benz Research & Development North America (MBRDNA). This partnership focuses on advancing the adoption of advanced chiplet architecture for next-generation autonomous driving platforms. The initiative showcases Mercedes-Benz's innovation in Silicon Valley, California, and commitment to developing strategic ecosystems. The company's research and develop...
    GlobalFoundries partners with Egis to develop new direct time-of-flight sensors on 55-nm platform
    At its annual Technology Summit in Shanghai, GlobalFoundries (GF) announced a collaboration with Egis Technology to develop new direct time-of-flight (dToF) sensors on GF's 55-nanometer (nm) platform, as reported in a press release on Sept. 25. The innovation aims to support smart sensing technologies in smart mobile, internet of things, and automotive end markets. GF has introduced its first-generation front-side illuminated single-photon avalanche diode (FSI SPAD) device, which boasts super...
    Hyundai Mobis leads initiative to localize South Korea's automotive semiconductor industry
    Hyundai Mobis is spearheading a collaboration with over 20 companies and research institutions to enhance South Korea's automotive semiconductor industry. This initiative, the first private-sector-led K-automotive semiconductor cooperation, aims to foster domestic development and localize core semiconductors. The company hosted the inaugural Auto Semicon Korea (ASK) event on Sept. 29 at DoubleTree by Hilton Seoul Pangyo, attended by major companies such as Samsung Electronics, LX Semicon and SK ...
    Synopsys collaborates with TSMC to advance multidie solutions for AI chip innovation
    Synopsys has announced its ongoing collaboration with TSMC to deliver multidie solutions that support TSMC's advanced processes and packaging technologies, enhancing innovation in AI chip and multidie design. This collaboration has resulted in successful customer tape-outs with Synopsys' 3DIC Compiler exploration-to-signoff platform. Synopsys has also made available certified digital and analog flows with support from Synopsys.ai on TSMC's N2P and A16 processes, using the TSMC NanoFlex architect...
    STMicroelectronics leads STARLight project to advance silicon photonics in Europe
    The STARLight project is a collaboration of industrial and academic partners aiming to establish Europe as a leader in 300-mm silicon photonics (SiPho) technology by creating a high-volume manufacturing line and developing advanced optical modules to support a comprehensive value chain. Running until 2028, the project focuses on developing application-driven solutions for industry sectors such as data centers, AI clusters, telecommunications and automotive markets. Led by STMicroelectr...
    Raytron enhances safety for Level 4 autonomous vehicles with thermal imaging and radar technology
    Raytron has introduced high-frame-rate automotive thermal cameras that enable companies such as Didi Autonomous Driving and GAC Aion to conduct Level 4 robo-taxi tests in the extreme heat of Turpan, China. In temperatures reaching 50°C, Raytron's thermal imaging system, equipped with AEC-Q100 certified sensors, operates reliably within a range from -40°C to 85°C. Its dual-layer encapsulation provides protection against sand and dust, delivering accurate environmental data where traditional ca...
    Wayve unveils Gen 3 robot platform powered by NVIDIA DRIVE AGX Thor for autonomous driving
    Wayve has announced the development of its Gen 3 robot platform, which will utilize NVIDIA DRIVE AGX Thor, an advanced automotive-grade AI computer. This new platform represents the next step for Wayve's global development fleet, supporting the advancement of its AI Driver software into more secure, capable and scalable automated driving systems. The Gen 3 platform aims to progress self-driving technology to Level 3 and Level 4, necessitating a flexible and powerful computing capability to ma...
    SK Keyfoundry unveils advanced multilevel thick IMD process for capacitors
    SK Keyfoundry, a South Korean 8-inch pure-play foundry, has unveiled its multilevel thick intermetal dielectric (IMD) process for capacitors, boasting high breakdown voltage characteristics. These characteristics contribute to enhanced safety, reliability and lifespan while improving the noise immunity of semiconductor devices. The process facilitates the stacking of up to three IMD layers, achieving a total thickness of up to 18 micrometers (μm) in a metal-insulator-me...
    STMicroelectronics joins FiRa Consortium board to advance ultra-wideband technology
    STMicroelectronics announced the appointment of Rias Al-Kadi, the general manager of its Range and Connectivity Division, to the board of directors of the FiRa Consortium. This consortium is an industry body focused on advancing secured fine ranging and positioning using ultra-wideband (UWB) technology. STMicroelectronics is invested in the development of the IEEE 802.15.4ab amendment, which builds on previous UWB advancements, aiming to enhance system performance and broaden UWB's scope of appl...
    Forvia Hella launches series production of intelligent power distribution module
    Forvia Hella has commenced the series production of its intelligent Power Distribution Module (iPDM), a pioneering product ensuring a reliable and fail-operational power supply for vehicles, for a premium vehicle manufacturer. The iPDM module is designed as a key component for highly automated driving systems and incorporates electronic fuses (eFuses) for the first time in the automotive industry. Forvia Hella, with extensive experience in manufacturing electronic control units, has introduced t...
    Lucid receives $300 million from Uber for robo-taxi initiative using Lucid's EV technology
    As reported in a press release on Sept. 16, Lucid Group has secured a $300 million investment from Uber Technologies. This strategic investment is part of Lucid's next-generation premium global robo-taxi program, announced in July, which will utilize Lucid's electric vehicle technology. The robo-taxi is set to be manufactured at Lucid's Arizona, US, facility and operate exclusively on Uber's ride-hailing platform. This partnership aims to support the development costs associated with the autonom...
    Wind River and Hyundai Mobis collaborate on Mobis Development Studio for software-defined vehicles
    In a press release on Sept. 16, Wind River, an Aptiv company, announced the completion of Mobis Development Studio, a new integrated software development environment for software-defined vehicles (SDVs) created in collaboration with Hyundai Mobis. This system merges Hyundai Mobis' cloud-based vehicle development infrastructure with Wind River Studio Developer to expedite innovation in next-generation SDVs. Mobis Development Studio is a web-based platform that offers an intuitive user interface t...
    Wittenstein collaborates with Qualcomm to integrate Safertos RTOS on Snapdragon Digital Chassis
    Wittenstein High Integrity Systems (WHIS) has announced its collaboration with Qualcomm Technologies to integrate the WHIS SAFERTOS with Qualcomm's Snapdragon Digital Chassis safety island. This integration aims to provide a high-performance, safety-critical solution for automotive applications. With the automotive industry rapidly transforming to incorporate advanced infotainment, advanced driver assistance systems, real-time data processing and enhanced safety measures, the need for ...
    RoboSense announces lidar compatibility with NVIDIA DRIVE AGX for autonomous driving
    In a press release on Sept. 12, RoboSense announced the compatibility of its E1, EMX and EM4 automotive-grade digital lidars with the NVIDIA DRIVE AGX platform. As part of the NVIDIA DRIVE ecosystem, RoboSense's high-definition 3D perception data aims to shorten development and testing cycles for autonomous driving technologies and accelerate original equipment manufacturers' deployment of such systems.  The automotive industry's evolution toward Level 3/Level 4 autonomous driving r...
    IAA Mobility: Axera unveils M57 system-on-chip ADAS solution for global market impact
    Axera, a Chinese AI chip developer, made its debut at IAA Mobility, unveiling an advanced driver assistance system solution featuring its M57 system-on-chip (SoC). This launch aims to influence the global ADAS market. Developed in collaboration with Stradvision, a company specializing in AI visual perception, this all-in-one front-view perception solution incorporates an 8-megapixel high-definition camera and Stradvision's 3D visual perception algorithms. It offers features such as static object...
    Aston Martin to equip future models with Pirelli's Cyber Tire technology
    Pirelli has partnered Aston Martin to integrate Pirelli's Cyber Tire technology into future vehicles produced by the British ultraluxury performance car brand. Cyber Tire is noted as the first system globally capable of collecting data from sensors embedded in the tires, processing it with Pirelli's proprietary software and algorithms, and communicating it in real-time with the vehicle's electronic systems. This technology is enabled through a partnership with Bosch Engineering, allowing full...
    IAA Mobility 2025: ZF presents latest solutions in chassis, safety and electric powertrain
    ZF is presenting its latest automotive solutions at the IAA Mobility 2025 held from Sept. 9 to 12 in Munich. The Germany-based company focuses on electric, connected and safe driving, offering production-ready drives, by-wire systems and software for developing software-defined electric vehicles. ZF is enhancing passenger car chassis with intelligent actuators and software expertise to meet global market demands. The company supplies steer-by-wire (SBW) and brake-by-wire (BBW) solutions ...
    IAA Mobility 2025: Volkswagen Group highlights semiconductor procurement strategy with Rivian
    At the 4th Semiconductor Summit during IAA Mobility in Munich, Volkswagen Group brought together industry leaders to outline its semiconductor procurement strategy, strengthen partnerships and foster deeper collaboration between the automotive and semiconductor sectors. A key highlight was the introduction of the group’s new-level procurement model with Rivian and Volkswagen Group Technologies, covering more than 50 semiconductor categories, including core components such as microcontroller...
    Valens Semiconductor partners with Samsung for next-gen MIPI A-PHY automotive connectivity solutions
    In a press release on Sept. 9, Valens Semiconductor announced a partnership with Samsung to develop the next generation of MIPI A-PHY products, spurred by increasing demand from global original equipment manufacturers for high-speed sensor connectivity. Samsung has historically collaborated with Valens, having been an early investor in the company and a founding member of the HDBaseT Alliance alongside Valens, ProAV's largest interoperable ecosystem with over 200 member companies. The MIPI A-...
    IAA Mobility 2025: Rimac Technology unveils solid-state battery tech, next-generation electric axles
    Rimac Technology has unveiled its portfolio of advanced battery and powertrain technologies at IAA Mobility 2025 in Munich, including the next-generation solid-state solutions and a range of electric axles (e-axles). These technologies aim to reinforce Rimac Technology's position as a top tier 1 supplier, aiding in the automotive industry's electrification. Over the past years, Rimac has announced collaborations with automotive giants such as BMW Group, CEER Motors and Porsche, showcasing its...
    IAA Mobility 2025: Bosch unveils software-driven mobility innovations
    Bosch is showcasing its prowess in both software and hardware at the IAA Mobility 2025 event in Munich. The company highlighted its capacity to offer tailored, intelligent solutions that are integral to software-driven mobility. Bosch's by-wire systems for braking and steering are significant for the development of software-defined vehicles and automated driving, with predicted sales revenue exceeding €7.0 billion by 2032. The focus on by-wire technology marks a shift in vehicle construction t...
    Schaeffler begins large-scale production of high-voltage inverter brick in mainland China
    Schaeffler has commenced large-scale production of its high-voltage inverter brick in Tianjin, mainland China, within one year, for a leading mainland Chinese automotive manufacturer. This milestone signifies a significant step in Schaeffler's electrification strategy. The inverter brick, powered by cutting-edge silicon carbide (SiC) technology from development partner ROHM, is adaptable and scalable, making it suitable for various battery-electric, plug-in and range-extender vehicles. The in...
    IAA Mobility 2025: BMW and Qualcomm unveil Snapdragon Ride Pilot for automated driving
    According to a press release on Sept. 5, Qualcomm Technologies and BMW Group have announced the Snapdragon Ride Pilot, a new automated driving system developed over three years of collaboration. This system utilizes Qualcomm Technologies' Snapdragon Ride system-on-chips (SoCs) and the Snapdragon Ride automated driving software stack, co-developed by the two companies. It is designed to meet high safety standards, supporting automated driving levels from entry-level New Car Assessment Progra...
    Lear, Palantir expand collaboration for enhanced automotive manufacturing solutions
    Palantir Technologies has announced a five-year expansion of its collaboration with Lear Corporation, a US-based supplier of automotive Seas and E-Systems. Lear will enhance its utilization of Palantir's Foundry, Warp Speed manufacturing operating system and Artificial Intelligence Platform (AIP) across its worldwide manufacturing facilities.  Palantir‘s solutions assist Lear in proactively managing tariff exposure, streamlining administrative processes and dynamically balancing manufa...
    Renesas introduces RH850/U2A MCAL package for automotive applications with IAR toolchain support
    In a press release Sept. 4, IAR announced that Renesas has introduced a RH850/U2A MCAL package, available for mass production, supporting the IAR toolchain for RH850 (v2.21.2 FS). This package is tailored for the RH850/U2A microcontroller family, which caters to automotive applications requiring high performance, functional safety and low power consumption, such as advanced driver assistance systems, body control and electric vehicle platforms. The MCAL package, qualified for ASIL D MP, is based...
    Forvia Hella and Tau Motors collaborate to develop innovative onboard charger for electrification
    Forvia Hella and Tau Motors have entered into a partnership to develop a new a virtually isolated onboard charger (viOBC) for electric vehicles. The new solution will enhance Forvia Hella's portfolio of electrification components and contribute to sustainable mobility. The viOBC prototype has successfully completed technological and commercial testing, with series production anticipated within the next two to three years. Jörg Weisgerber, managing director of Electronics at Forv...
    IAA Mobility 2025: Bosch gears up to showcase innovative solutions for connected and intelligent transportation systems
    At the IAA Mobility 2025 event in Munich next week, Bosch will showcase its innovative solutions for connected and intelligent transportation systems. The Germany-based automotive supplier will present its solutions for advanced driver assistance systems that will support assisted driving and parking up to SAE Level 2 autonomy. Bosch offers ADAS solutions in three variants: Entry-level, mid-level and premium level. These variants differ in the scope of software function, the numbe...
    BASiC Semiconductor and CASTC partner to advance automotive semiconductor technology
    On Aug. 23, BASiC Semiconductor, based in Shenzhen, China, signed a strategic cooperation agreement with China Automotive Chip (Shenzhen) Technology Co. Ltd. (CASTC) to progress automotive-grade semiconductor technology, according to a report published by World-Energy Media. The partnership aims to enhance the development and application of power semiconductors within the automotive industry. BASiC Semiconductor will utilize its expertise in silicon carbide (SiC) power device research and commer...
    ChipFlow partners with ChipFoundry to enhance custom ASIC development workflow
    ChipFlow has formed a partnership with ChipFoundry, uniting two open-source leaders in the chip design field to create a developer-focused and cost-effective workflow for custom application-specific integrated circuit (ASIC) development. This partnership integrates ChipFlow's open-source EDA toolchain with ChipFoundry's fabrication portal, offering a comprehensive design experience that is lightweight, license-free and highly accessible. The collaboration enables users to move from RTL...
    Energy Fuels and Vulcan Elements collaborate on US rare earth magnet supply chain
    Energy Fuels Inc. and Vulcan Elements have signed a memorandum of understanding (MOU) to establish a domestic supply chain for rare earth magnets in the US, independent of mainland China. Energy Fuels, a US producer of rare earth element oxides, will supply Vulcan Elements with high-purity "light" and "heavy" rare earth oxides, specifically neodymium-praseodymium (NdPr) and dysprosium (Dy), which will be used for the production of rare earth permanent magnets. This collaboration involves sour...
    ProteanTecs partners with Dream Chip Technologies to advance imaging applications
    As reported in a press release on Aug. 26, proteanTecs and Dream Chip Technologies have announced a strategic collaboration aimed at advancing imaging applications for sectors such as automotive. By integrating proteanTecs' on-chip embedded monitors with Dream Chip Technologies' system-on-a-chip (SoC) design platform, the partnership seeks to enhance functional safety, reliability and system performance through real-time predictive monitoring. Dream Chip Technologies' modular image signal proces...
    NVIDIA rolls out Drive AGX Thor developer kit for automotive developers
    NVIDIA has made the DRIVE AGX Thor developer kit available for preorder and set for delivery in September. The kit provides developers and researchers with an advanced platform for accelerating the design, testing and deployment of autonomous vehicles and intelligent mobility solutions. The kit is based on the NVIDIA Blackwell architecture, next-generation Arm Neoverse V3AE CPUs, and the NVIDIA DriveOS 7 software stack. It is purpose-built for automotive development, supporting various sensors a...
    Samvardhana Motherson establishes new subsidiary to focus on advanced clean mobility electronics
    On Aug. 22, Samvardhana Motherson International Ltd. (SAMIL) established a wholly owned subsidiary, Motherson Egtronics Electronics Solutions Ltd. (MEESL), to focus on advanced clean mobility electronics, Autocar Professional reported Aug. 23. The new subsidiary was founded a month after the company entered a joint venture agreement (JVA) with South Korea-based Egtronics Co. Ltd. MEESL will initially be fully owned by SAMIL. According to the JVA, the ownership will eventually evolve to 51% ow...
    Tata Elxsi and Suzuki inaugurate cloud-enabled hardware-in-the-loop validation center in India
    Tata Elxsi and Suzuki Motor Corp. have inaugurated the Suzuki-Tata Elxsi Cloud HIL Center in Trivandrum, India. This facility is Suzuki's first full-vehicle cloud-enabled hardware-in-the-loop (HIL) validation center, marking the second engineering center established through the Suzuki-Tata Elxsi partnership, following an Offshore Development Center (ODC) in Pune, India. The Cloud HIL Center is designed for early-stage, full-vehicle simulation and validation via a cloud-native infrastructure...
    Cirrus Logic expands partnership with GlobalFoundries for advanced mixed-signal semiconductor manufacturing
    In a press release on Aug. 19, Cirrus Logic announced an expansion of its long-standing partnership with GlobalFoundries. The collaboration focuses on advancing and introducing efficient, powerful, and reliable semiconductor technologies intended to enhance the next generation of products such as smartphones and automobiles. The partnership is particularly centered on the development and commercialization of bipolar-CMOS-DMOS (BCD) process technology, which enables the integration of dif...
    Hesai Technology secures Toyota collaboration for lidar in new-energy vehicle model
    In a press release on Aug. 15, Hesai Technology announced a new design win from Toyota, where its long-range automotive lidar, ATX, will be used in a new-energy model produced by a Toyota joint venture in China. This model is set to enter mass production in 2026. The JV is focused on electrification and intelligence, leveraging local research and development to combine global engineering standards with Chinese innovation for advanced mobility solutions. This collaboration highlights Hesai's r...
    Xpeng and Volkswagen Group expand E/E architecture collaboration across multiple platforms in China
    As reported in a press release on Aug. 14, Xpeng and the Volkswagen Group have announced progress following the execution of a master agreement on E/E architecture technical collaboration on July 22, 2024. The collaboration aims to expand the application scope of the electrical/electronic (E/E) architecture within the Volkswagen Group, integrating it into its electric vehicle platforms as well as its internal combustion engine (ICE) and plug-in hybrid electric vehicle platforms in China. The sig...
    rFpro advances interior sensor simulation in Sim4CamSens2 project for automotive safety
    As reported in a press release dated July 29, Simulation software specialist rFpro has expanded the Sim4CamSens2 project, which aims to enhance the development and validation of automotive sensor systems through simulation. Building on the original Sim4CamSens project, which focused on external sensor systems, this initiative now includes interior sensor systems, addressing the importance of in-cabin monitoring for safety and autonomous driving. The project is led by Claytex and includes part...
    Silicon Creations integrates low-area phase-locked loop into Codasip's test chip for automotive RISC-V systems
    Silicon Creations announced the successful integration of its low-area integer phase-locked loop (PLL) into Codasip's latest test chip. This integration enables the evaluation of Codasip's L31AS dual-core lock-step central processing unit (CPU) and crypto accelerator intellectual property (IP). The partnership signifies an important development in deploying efficient clocking solutions tailored for automotive-grade RISC-V systems. Codasip's L31AS CPU, designed for automotive applications...
    Forge Nano develops US-sourced lithium ion for US Defense Department
    Forge Nano Inc., a technology company focused on advancing domestic battery and semiconductor technologies, announced its development of a lithium-ion battery cell intended for the US Defense Department. This development emphasizes the use of battery materials exclusively sourced from within the US. The 18650 cylindrical cell is designed to offer high capacity and energy density, conforming to the Defense Department's standards for cycle life and operating temperatures. Paul Lichty, CEO of Forge...
    Force Motors launches AI-powered platform for fleet intelligence and predictive diagnostics
    Force Motors Ltd. has introduced Force iPulse, a next-generation connected vehicle platform that offers advanced operational intelligence and vehicle life-cycle management. Developed with Intangles, the platform incorporates state-of-the-art AI and hybrid analytics to enhance fleet operations. The platform, part of Project DigiForce, provides real-time insights, predictive diagnostics, and improved driver comfort and safety. It continuously analyzes vehicular data to offer predictive insights, e...
    AiMotive and Socionext collaborate to enhance automotive AI technology for ADAS system-on-chips
    AiMotive and Socionext have entered into a license agreement allowing Socionext to utilize aiMotive's aiWare intellectual property and development tools for creating next-generation custom system-on-chips (SoCs) aimed at advanced driving assistance systems in the automotive sector. This collaboration highlights a strategic move for both companies as it seeks to enhance innovation in automotive AI technology. The partnership is designed to expedite the adoption of aiMotive's low-power, high-effic...
    LG Innotek partners with Aeva to develop next-gen lidar technology
    LG Innotek has partnered with Aeva to strengthen its presence in the lidar market. On July 29, LG Innotek announced a strategic partnership with Aeva to supply and jointly develop next-generation lidar technology. Aeva, known for its 4D lidar based on frequency modulated continuous wave (FMCW) technology, is recognized in the autonomous driving market and counts major automakers, including Daimler Truck, among its clients. Through this partnership, LG Innotek and Aeva will collaborate on the ...
    Tesla announces $16.5 billion AI chip partnership with Samsung
    Tesla CEO Elon Musk announced that the company has entered into a $16.5 billion multiyear agreement with Samsung for AI chips, as reported in a Reuters article dated July 28. Musk indicated that this is just the initial cost of the deal. According to Musk, Samsung's new Texas, US, fabrication facility will be dedicated to producing Tesla's next-generation AI6 chip, which will be used for Tesla's humanoid robot Optimus, fully autonomous vehicles and AI datacenters. Musk emphasized the str...
    STMicroelectronics acquires NXP's microelectromechanical sensors business for $950 million
    STMicroelectronics, a global semiconductor company, is enhancing its global sensor capabilities by acquiring the microelectromechanical sensors (MEMS) business of NXP Semiconductors. This acquisition primarily focuses on automotive safety products and sensors for industrial applications. The acquisition aims to complement and expand STMicroelectronics' MEMS technology and product portfolio, facilitating growth opportunities across the automotive, industrial and consumer sectors. T...
    SenseTime and ECADI partner to integrate AI in China's architectural sector
    According to a press release dated July 25, SenseTime, an AI company, has partnered with Arcplus' East China Architectural Design & Research Institute (ECADI), a player in China's architectural design sector, through a strategic cooperation agreement signed in Shanghai. This partnership intends to merge SenseTime's advanced AI technology, especially its SenseNova large model, with ECADI's extensive engineering expertise. Together, they aim to apply AI throughout the entire building life cycl...
    Onsemi and Schaeffler expand collaboration with new EliteSiC-based PHEV platform
    In a press release on July 24, Onsemi announced an expansion of its collaboration with Schaeffler through a new design agreement that utilizes Onsemi's latest EliteSiC silicon carbide metal-oxide-semiconductor field-effect transistors (MOSFETs). This collaboration will aid Schaeffler in powering a traction inverter for a major global automaker's new plug-in hybrid electric vehicle platform. The EliteSiC technology from Onsemi provides lower conduction losses and superior short-circuit robustness...
    Aeva expands partnership with Daimler Truck North America for autonomous vehicle technology
    Aeva announced an expansion of its partnership with Daimler Truck North America (DTNA) to facilitate the commercialization of autonomous vehicles. This enhanced collaboration will focus on the increased production of Aeva's advanced 4D Lidar technology. DTNA is contributing additional non-recurring funding to support Aeva as it progresses toward series production. In response to rising demand, Aeva plans to boost its production capacity to 200,000 Lidar units annually, aiming to support a r...
    Elektrobit, Infineon and HighTec collaborate to integrate Rust with AUTOSAR in automotive software
    Elektrobit, Infineon Technologies and HighTec EDV-Systeme have announced a strategic collaboration to accelerate automotive software innovation. This collaboration aims to integrate Rust applications with AUTOSAR Classic basic software. As ecosystem partners in Infineon's Drive Core for its AURIX microcontrollers (MCUs), HighTec and Elektrobit are launching a development bundle to simplify and speed up automotive software development. The bundle includes Elektrobit's EB tresos AutoCore and HighT...
    AiMotive and Nextchip collaborate on automated driving solutions in South Korea
    As reported in a press release on July 22, aiMotive and Nextchip have announced a collaboration to develop and validate new automated driving solutions through real-world testing in South Korea. This partnership aims to provide production-ready open solutions for automated driving by leveraging aiMotive's automated driving technology and Nextchip's automotive-grade system-on-chips (SoCs). The initiative builds on their previous work on the Apache6 SoC, which features the aiWare neural pr...
    Tata Electronics and Bosch collaborate on semiconductor manufacturing
    According to a press release on July 17, Tata Electronics and Robert Bosch GmbH have signed a memorandum of understanding (MOU) to collaborate in the electronics and semiconductor industries. The agreement was signed by Randhir Thakur, CEO and managing director of Tata Electronics, and Dirk Kress, executive vice president of Semiconductor Operations at Robert Bosch GmbH. The collaboration will focus on chip packaging and manufacturing at Tata Electronics' forthcoming assembly and test unit in...
    Stony Brook University partners with Onsemi on $20 million semiconductor R&D facility
    New York-based Stony Brook University has partnered with semiconductor company Onsemi to to build a $20 million semiconductor research and development facility on its campus. Announced by New York State Gov. Kathy Hochul, this partnership aims to advance R&D in silicon carbide (SiC) chip technology, essential for clean energy applications and electric vehicles. The collaboration is supported by Empire State Development and combines Onsemi's $8 million and Stony Brook's $10 million investment...
    BMW taps Momenta to develop China-specific ADAS solutions
    BMW Group is deepening its commitment to China’s digital innovation ecosystem through a new strategic partnership with Chinese advanced driver assistance system technology leader Momenta. The collaboration will focus exclusively on co-developing ADAS tailored for the Chinese market. The joint development will begin with BMW’s upcoming Neue Klasse platform, with the aim of delivering intelligent, intuitive and locally optimized driving experiences. The partnership leverages BMW’s core dr...
    Indie introduces low-noise LXM-U lasers for automotive application
    Indie, an automotive solutions supplier, has unveiled its latest LXM-U lasers, utilized in next-generation Quantum applications, offering significant frequency stability and integration flexibility, as reported in a press release on July 14. Indie's Photonics Business Unit was formed earlier in 2025 by combining its Canada photonics team, formerly TeraXion, which specializes in laser and optical components, with its recently acquired Swiss team, Exalos, known for its super luminescent diodes (SL...
    SK keyfoundry and LB Semicon complete testing of Direct RDL in South Korea
    SK keyfoundry, a South Korea-based company specializing in analog and mixed-signal foundry services for semiconductor companies, has announced the successful co-development and completion of the reliability testing of the Direct RDL (Redistribution Layer) in collaboration with LB Semicon. This milestone marks a key step in advancing next-generation semiconductor packaging technologies and enhancing the competitiveness of automotive semiconductor products. ...
    Tata Elxsi partners with Synopsys to develop automotive virtualization solutions
    As reported in a press release on July 11, Tata Elxsi and Synopsys have announced a memorandum of understanding (MOU) to jointly develop advanced automotive virtualization solutions. The agreement was signed during the SNUG India 2025 event in Bengaluru by senior leaders from both organizations. This collaboration aims to provide customers with preverified, integrated solutions and services for designing and deploying virtual electronic control units (vECUs), which are crucial for efficient soft...
    Ecarx expands technology partnership with Samsung for automotive intelligence, robotics and AI
    Mobility technology provider Ecarx Holdings announced a new global strategic partnership with Samsung Group, marking a significant advancement in their collaboration. The partnership aims to accelerate the commercialization of advanced automotive intelligence technologies, focusing on integrating Samsung's next-generation displays, high-speed memory and flash storage solutions into Ecarx's product offerings. This collaboration will extend beyond automotive intelligence to include the develo...
    NEVC and MeriTech sign agreement to enhance automotive chip innovation
    Mainland China's National New Energy Vehicle Technology Innovation Center (NEVC) and MeriTech Integrated Circuits (MeriTech) have signed a strategic cooperation agreement in Beijing. NEVC has established a 4+2 business framework in its automotive chip division, focusing on standard research, testing and evaluation, product certification, and automotive-grade management, along with two technical service systems for application verification and quality management for automotive-grade chips. These ...
    MediaTek expands automotive sector focus in India with advanced AI and connectivity solutions
    MediaTek is focusing on expanding its footprint in the automotive sector in India, with projections that the country will contribute 20% of its global automotive deployments over the next five years, according to a report published by Autocar Professional on July 9. “From an automotive standpoint, India is expected to account for 20% of the total number of deployments in the segment in the next five years,” said Rita Wu, director of Product Marketing, Automotive Platform, at MediaT...
    Cadence expands partnership with Samsung Foundry through new multiyear instrument panel agreement
    On July 8, Cadence announced on its WeChat account that it has expanded its collaboration with Samsung Foundry through a new multiyear intellectual property (IP) agreement. This agreement aims to extend the deployment of Cadence memory and interface IP solutions on Samsung Foundry's advanced SF4X, SF5A and SF2P process nodes. These solutions are designed to support high-performance, low-power applications in areas such as AI datacenters, automotive systems and next-generation radio-frequency con...
    LG Group expands automotive software ventures with global carmakers
    Chief executives from LG Group's key units, including LG Electronics, will hold closed-door meetings with global carmakers to expand in the software industry. LG Innotek, a major South Korean electronics parts developer, has entered the automotive application processor market, which is expected to grow at 22% annually over the next five years. LG Electronics, a leading global home appliance maker, announced plans to invest more than 1 trillion South Korean won ($762 million) in its ven...
    Phlux Technology raises £9 million to expand infrared sensor technology in communications and sensing
    Phlux Technology, a UK startup specializing in infrared sensor technology, has raised £9 million in a Series A funding round led by BGF, with participation from existing investors including Octopus Ventures, Northern Gritstone and Foresight. This funding will facilitate Phlux's expansion into the optical communications and sensing industries, utilizing its unique antimonide-based semiconductor technology to create faster and more energy-efficient systems. The investment will support the scaling...
    Innoviz Technologies begins high-volume production of InnovizTwo Lidar units with Fabrinet
    In a press release on July 8, Innoviz Technologies announced the shipment of the first InnovizTwo Lidar units from a high-volume production line managed by Fabrinet. This milestone represents a significant step forward in the mass production of Innoviz's InnovizTwo Lidar technology, aimed at the autonomous vehicle industry.  The successful assembly of the first units signifies Innoviz's progress toward high-volume production while maintaining quality processes to meet customer requiremen...
    NXP intensifies China localization strategy, collaborates with local foundry
    According to a report published by TrendForce on July 4, NXP has intensified its focus on its China localization strategy amid growing US export controls and potential tariff risks. The company announced plans to collaborate with a local Chinese foundry to manufacture its chips entirely within China. Although NXP operates a significant packaging and testing facility in Tianjin, the majority of its wafer fabrication occurs in the US and Singapore. This move aligns with broader trends among semico...
    Microchip introduces first ASA-ML camera platform with partners for Japanese automotive market
    According to a press release on July 2, Microchip Technology has collaborated with camera module supplier Nippon Chemi-Con Corp. and video-testing solutions provider NetVision to facilitate the adoption of Automotive Serdes Alliance Motion Link (ASA-ML) in advanced driver assistance systems. They have introduced the first ASA-ML camera-development platform for the Japanese automotive market, featuring scalable high-speed asymmetric data rates and hardware-based link-layer security to comply with...
    Nota AI and Renesas collaborate to optimize driver monitoring system on RA8P1 microcontroller unit
    According to a press release dated July 2, Nota AI announced a collaboration with Renesas Electronics to optimize a driver monitoring system (DMS) on Renesas' new RA8P1 microcontroller unit (MCU). This collaboration focuses on integrating AI efficiently into compact processors, enabling scalable, real-time driver behavior analysis in embedded systems, which enhances safety features in automotive environments where space and power are limited. The RA8P1 incorporates Arm Cortex-M85 and Cor...
    KD integrates 10GBASE-AU transceiver with Leopard Imaging's optical automotive camera
    According to a press release dated June 25, KD, a fabless semiconductor company, announced the integration of its 10GBASE-AU KD7251 optical transceiver into Leopard Imaging's optical automotive multigigabit camera, the LI-VENUS-ISX031-BASE-AU. Leopard Imaging specializes in embedded vision and AI camera technology. Corning Inc. contributed by designing a hybrid cable and connector system using its automotive-grade materials. The new system upgrades the existing camera interface from the ...
    QNX and Vector Informatik collaborate to launch foundational vehicle software platform
    BlackBerry division QNX and Vector have announced a memorandum of understanding (MOU) to jointly develop a foundational vehicle software platform aimed at speeding up the development of software-defined vehicles (SDVs) and simplifying automotive software integration. This collaboration merges Vector's middleware technology with QNX's safety-certified operating system. The platform, integrated with TTTech Auto, also includes MotionWise Schedule for enhanced component scheduling. The core objectiv...
    AEye's Apollo Lidar selected by major OEM for transportation safety systems
    In a press release on June 30, AEye, a company specializing in adaptive, high-performance Lidar solutions, announced that its Apollo Lidar units have been chosen by a major transportation original equipment manufacturer. This selection represents a significant potential revenue opportunity of $30 million or more, expected over the next 24 to 36 months. AEye's Apollo was selected due to its superior capability to detect objects from up to 1 km away, facilitating quicker hazard identification and ...
    L&T Technology Services and thyssenkrupp Steering to jointly establish software hub in Pune
    L&T Technology Services (LTTS) and thyssenkrupp Steering have announced a strategic agreement to create a state-of-the-art software development center in Pune, India. The collaboration aims to enhance modern automotive software solutions, focusing on safety-critical software for advanced steering technologies. LTTS will establish and manage the software hub on behalf of thyssenkrupp Steering, reflecting its expertise in engineering intelligent and sustainable mobility. LTTS has been recog...
    Trimble partners with TDK for enhanced navigation solutions
    Trimble and InvenSense, a TDK group company, have announced a collaboration to deliver an advanced navigation solution aimed at enhancing accuracy and reliability in automotive and IoT applications, such as autonomous vehicles, drones and industrial machinery. This new solution combines the Trimble ProPoint Go engine and Trimble RTX correction service with TDK's SmartAutomotive Inertial Measurement Units (IMUs). The Trimble ProPoint Go engine provides high-accuracy position and orientation data ...
    Valeo provides VSS360 system for European premium OEM vehicle platform
    Valeo has been chosen to provide its Valeo Smart Safety 360 (VSS360) for a premium European original equipment manufacturer vehicle platform, the company reported June 25. The system combines Valeo's expertise in hardware, software development and system integration to enhance vehicle safety, reduce accidents and support the progression of autonomous vehicles. VSS360 offers optimized driver and parking assistance in a scalable advanced driver assistance system solution, allowing OEMs to ...
    Elektrobit partners with Foxconn to develop AI-centric software platform for EVs
    In a press release on June 25, Elektrobit announced a joint development agreement with Hon Hai Technology Group (Foxconn) to create EV.OS, an AI-centric software platform aimed at advancing software-defined electric vehicles. The collaboration aims to develop a smart EV platform, integrating both hardware and software, to introduce groundbreaking supply chain innovations. The goal is to develop automotive platform solutions that minimize complexity, reduce the total cost of ownership, scale prod...
    PlateSmart and LensLock team up to revolutionize vehicle intelligence for law enforcement
    PlateSmart Technologies, recognized for its collaborations with numerous law enforcement agencies to address crimes and enhance safety, has formed a strategic alliance with LensLock to expand its reach. This collaboration aims to deliver PlateSmart's advanced technology to a wider range of agencies. Kathleen Chigos, president of PlateSmart Technologies, highlighted LensLock's reputation as a reliable provider of high-quality video solutions, emphasizing that this partnership will equip agencies ...
    Kodiak Robotics partners with Roush Industries to scale autonomous truck upfitting by 2025
    In a press release on June 18, Kodiak Robotics, an AI-powered autonomous vehicle technology provider, announced a collaboration with Roush Industries Inc., a product development supplier in industries including mobility and defense, to scale the upfitting of autonomous trucks featuring the Kodiak Driver. Starting in the second half of 2025, Roush will conduct this upfitting at its facility in Livonia, Michigan. The first trucks to be upfitted by Roush will be for Atlas Energy Solutions, ...
    Innoviz collaborates with major automotive manufacturer for Level 3 automation Lidar integration
    According to a press release on June 17, Innoviz Technologies, a supplier of automotive-grade Lidar sensors and perception software, has entered into a Statement of Development Work (SoDW) agreement with a major passenger automotive manufacturer. As part of this agreement, Innoviz will provide advanced Lidar units for the manufacturer's Level 3 automated series-production program, which aims for a start of production in 2027. Starting in the second quarter of 2025, Innoviz will focu...
    Applied Materials and CEA-Leti expand collaboration on specialty semiconductor innovation
    In a press release on June 16, Applied Materials and CEA-Leti announced an expanded phase of their collaboration, following a memorandum of understanding (MOU), aimed at accelerating innovation in specialty semiconductors. The partnership is focused on developing materials engineering solutions to overcome infrastructure challenges in AI datacenters. The joint lab, which concentrates on device innovations for the ICAPS markets (Internet of Things, Communications, Automotive, Power and Sensors...
    NXP collaborates with Rimac Technology on advanced SDV centralized architectures
    NXP Semiconductors has announced a collaboration with Rimac Technology, an automotive industry supplier, to advance centralized architectures for software-defined vehicles (SDVs), according to a press release on June 12. This collaboration will focus on utilizing NXP's S32E2 processors, which form part of the S32 Automotive Processing Platform. The S32E2 processors are designed to meet the connectivity, security and safety challenges in modern automotive environments by providing high-performanc...
    Cadence expands collaboration with Samsung Foundry in multiyear intellectual property agreement for advanced process nodes
    In a press release on June 16, Cadence announced an expansion of its collaboration with Samsung Foundry through a new multiyear intellectual property (IP) agreement aimed at broadening Cadence's memory and interface IP solutions across Samsung Foundry's advanced process nodes, including SF4X, SF5A and SF2P. This partnership leverages Cadence's AI-driven design solutions alongside Samsung's advanced technology to deliver high-performance, low-power solutions tailored for AI datacenters, automo...
    Rimac Technology collaborates on Bugatti Tourbillon's hybrid hypercar set for 2026 delivery
    Rimac Technology, a tier 1 technology supplier in the automotive industry, has played a significant role in the engineering and design of the Bugatti Tourbillon hyper-sports car by integrating its advanced battery systems, e-axles and electronic control units into the vehicle. The Bugatti Tourbillon, which utilizes Rimac Technology's revolutionary hybrid system, is set for deliveries in 2026 with production limited to 250 units. The Tourbillon showcases Rimac Technology's expertise ...
    NIRA Dynamics partners with BANF for enhanced tire safety and predictive maintenance
    NIRA Dynamics AB, a Swedish automotive software company, has joined forces with South Korea's BANF Smart Tire System to advance vehicle safety and predictive maintenance. This partnership, marked by a memorandum of understanding, aims to integrate BANF's high-frequency tire sensors into NIRA's established software ecosystem to enhance real-time monitoring for commercial vehicles. With this collaboration, both companies are transforming tire pressure monitoring systems (TPMS) to better protect ti...
    VW to build future EVs on Rivian's new R2 platform
    As part of Volkswagen's joint venture with Rivian, VW will use Rivian's upcoming R2 platform for all its future electric vehicles, according to Rivian's Chief Software Officer Wassym Bensaid. Rivian plans for the R2 production to begin in the first half of 2026, with improvements over its predecessor, the R1, making the development process more efficient. The R2 offers a modular and scalable tech stack, allowing Volkswagen brands such as ŠKODA and Audi to inco...
    Oppo signs patents licensing deal with Volkswagen for connected vehicles
    Smart device company Oppo announced a global patent licensing agreement with Volkswagen. This agreement involves licensing Oppo's cellular standard-essential patents, including those for 5G technology, to Volkswagen. The collaboration aims to enhance the user experience of Volkswagen's connected vehicle products worldwide. Vincent Lin, head of Patent Licensing at Oppo, acknowledged Volkswagen's intellectual property team's efforts in recognizing the value of this partnership, marking a commitmen...
    Synopsys expands collaboration with Arm to accelerate development of software-defined vehicles
    According to Synopsys' blog post on June 4, Synopsys has expanded its long-standing collaboration with Arm to support the automotive industry’s rapid transition to software-defined vehicles (SDVs). The partnership focuses on addressing the growing demand for smarter, AI-powered in-car experiences while tackling the rising complexity, cost and development challenges faced by automakers. As vehicles become increasingly reliant on advanced computing capabilities, current architectures struggle...
    Samsung collaborates with Infineon and NXP for next-gen automotive semiconductor solutions
    Samsung Electronics has teamed up with Infineon and NXP to develop next-generation automotive semiconductor technology solutions, aiming to address the rising demand for high-performance computing chips in future smart vehicles, according to a report published by TrendForce on June 5. The evolution of autonomous driving technology has driven the need for increased computing power in automotive chips. Samsung is leveraging its expertise in memory and processor technologies to introduce advanced p...
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