Filters
Your Selections
    Asset
    Published
    Vehicle Domain
    Topical Categories
    Supplier
    OEM
    Region / Country/Territory
    FISITA World Mobility Conference 2025: Key themes and concerns for the automotive industry
    One thing is abundantly clear after the FISITA World Mobility Conference (WMC) last week. Megatrends impact everything. No longer can chassis development, braking, safety validation and so forth stand alone without impact from the broader drive towards electrification, the AI revolution or SDVs, to name a few.  The event’s sessions gave the impression that electrification is already baked into the industry, particularly in Europe where the debate on (regulation-pushed) direction is ...
    Beyond horsepower: Compute becomes the new competitive edge for OEMs
    Automotive compute power is becoming a defining metric of vehicle capability — not just for autonomy, but across cockpit systems, connectivity and life-cycle software deployment. As vehicles transition toward centralized electrical/electronic (E/E) architectures and software-defined platforms, silicon performance is now a core determinant of what a vehicle can do — and how long it will remain competitive in the field. Two metrics have emerged as industry standards for measuring this compu...
    NIO ventures into chip development with focus on intelligent cabin technology
    According to a report published by Pandaily on June 25, NIO is undertaking the independent research and development of chips, with a focus on producing key chips, particularly AD chips, within the next one to two years. Vice President of hardware Bai Jian previously mentioned this initiative on social media. Recent information indicates that NIO's first self-developed chip will target the intelligent cabin and will be created using Samsung's 7 nm process technology. A former executive from Hu...
    AutoTechInsight Weekly - 30 June 2025
    Click the link above to download this week's issue
    Trimble partners with TDK for enhanced navigation solutions
    Trimble and InvenSense, a TDK group company, have announced a collaboration to deliver an advanced navigation solution aimed at enhancing accuracy and reliability in automotive and IoT applications, such as autonomous vehicles, drones and industrial machinery. This new solution combines the Trimble ProPoint Go engine and Trimble RTX correction service with TDK's SmartAutomotive Inertial Measurement Units (IMUs). The Trimble ProPoint Go engine provides high-accuracy position and orientation data ...
    Silicon Motion's UFS solution validated on Qualcomm Snapdragon cockpit platform
    Silicon Motion Technology Corporation, a global company specializing in NAND flash controllers for solid-state storage devices, announced the successful compatibility validation of its Universal Flash Storage (UFS) solution on the Qualcomm Snapdragon Cockpit SA8295P Platform, as reported in a press release on June 26. This development allows automotive customers to integrate Silicon Motion's UFS solution into designs featuring the Snapdragon Cockpit SA8295P platform. The UFS solution is noted...
    Murata Manufacturing begins mass production of new high-capacitance MLCC for automotive applications
    Murata Manufacturing Co. Ltd., under the leadership of President Norio Nakajima, has commenced mass production of its new multilayer ceramic capacitor (MLCC), the GCM21BE71H106KE02. This product is notable for being the first in the 0805-inch size to offer a capacitance of 10µF with a 50Vdc rating, specifically designed for automotive applications. This development represents a significant advancement in the field of MLCC design by maintaining capacitance and voltage rating within a reduced pac...
    Intel closes automotive business amid strategic downsizing and layoffs
    Intel has announced substantial layoffs and the closure of its Automotive Chip division, aimed at cost reduction and operational efficiency, according to a report published by Hans India on June 26. This strategic shift comes under the guidance of newly appointed CEO Lip-Bu Tan, who has prioritized lean operations and diminished bureaucracy. According to a WARN Act filing, 107 employees at Intel's headquarters in Santa Clara, California, will face layoffs starting July 15. This reduction...
    Valeo provides VSS360 system for European premium OEM vehicle platform
    Valeo has been chosen to provide its Valeo Smart Safety 360 (VSS360) for a premium European original equipment manufacturer vehicle platform, the company reported June 25. The system combines Valeo's expertise in hardware, software development and system integration to enhance vehicle safety, reduce accidents and support the progression of autonomous vehicles. VSS360 offers optimized driver and parking assistance in a scalable advanced driver assistance system solution, allowing OEMs to ...
    Elektrobit partners with Foxconn to develop AI-centric software platform for EVs
    In a press release on June 25, Elektrobit announced a joint development agreement with Hon Hai Technology Group (Foxconn) to create EV.OS, an AI-centric software platform aimed at advancing software-defined electric vehicles. The collaboration aims to develop a smart EV platform, integrating both hardware and software, to introduce groundbreaking supply chain innovations. The goal is to develop automotive platform solutions that minimize complexity, reduce the total cost of ownership, scale prod...
    Continental supplies digital access system for Audi Q6 e-tron
    Continental is providing Audi's new premium Q6 e-tron sport utility vehicle with an advanced access system that includes both a traditional car key and the digital CoSmA intelligent access system. This digital system, which uses highly secure ultra-wideband technology (UWB), allows for vehicle access without needing to physically handle a key or smartphone, though the option to use a physical key remains. The system is compatible with numerous smartphone models from major providers. The Aud...
    Bosch unveils compact Bluetooth-enabled microelectromechanical system sensor for tire pressure monitoring
    Bosch has introduced a highly compact microelectromechanical system (MEMS) sensor, the SMP290, featuring an integrated Bluetooth low energy (BLE) interface for measuring tire pressure in vehicles. The sensor incorporates all critical components required for a tire pressure monitoring system (TPMS), including a microcontroller, Bluetooth interface, two-axis acceleration sensor, and pressure and temperature sensors. The highly integrated sensor is also energy efficient, allowing for an operat...
    EPC introduces EPC9196 high-performance motor drive inverter for medium-voltage applications
    Efficient Power Conversion Corp. (EPC) has introduced the EPC9196, a high-performance 25-amperes-root-mean-square (ARMS), three-phase brushless DC (BLDC) motor drive inverter reference design, as reported in a company press release on June 10. This design is powered by the EPC2304 gallium nitride field-effect transistor (eGaN FET) and is specifically tailored for medium-voltage (96 V-150 V) battery-powered motor drive applications. These applications include steering systems in au...
    Toshiba launches second smart motor control driver for automotive applications
    Toshiba Electronic Devices & Storage Corp. has initiated sample shipments of the TB9M001FTG, the second offering in its Smart Motor Control Driver series, SmartMCD, as reported in a press release on June 23. The microcontroller in the SmartMCD features a relay driver and a Local Interconnect Network (LIN) transceiver function, making it adept at driving relays and controlling two brushed DC motors, particularly in automotive environments. The product addresses the increasing dem...
    Continental's AESS collaborates with GlobalFoundries for semiconductor solutions
    According to a press release on June 23, Continental's Automotive group has formed a new organization named Advanced Electronics & Semiconductor Solutions (AESS) to design and verify automotive semiconductors to meet internal demand. GlobalFoundries (GF) has been appointed as the manufacturing partner for AESS.  The initiative aligns with the Automotive board's strategy to invest in technology and increase autonomy. It aims to establish a resilient supply chain, improve product quali...
    PlateSmart and LensLock team up to revolutionize vehicle intelligence for law enforcement
    PlateSmart Technologies, recognized for its collaborations with numerous law enforcement agencies to address crimes and enhance safety, has formed a strategic alliance with LensLock to expand its reach. This collaboration aims to deliver PlateSmart's advanced technology to a wider range of agencies. Kathleen Chigos, president of PlateSmart Technologies, highlighted LensLock's reputation as a reliable provider of high-quality video solutions, emphasizing that this partnership will equip agencies ...
    ZKW Group appoints Christian Amsel new CTO, effective June 1
    ZKW Group, the Austria-based lighting supplier, announced in a press release on June 17 that Christian Amsel has been appointed as the new chief technology officer, effective June 1. Amsel took over from Udo Hornfeck, who left the company to explore new professional opportunities. Amsel brings to the ZKW Group more than 22 years of experience in automotive electronics and lighting technology. Most recently, he served in chief technology officer roles at Inalfa Roof Systems and Kongsberg Autom...
    AutoTechInsight Weekly - 23 June 2025
    Click the link above to download this week's issue
    Zoox opens new robo-taxi production facility in US
    As reported in a press release on June 18, Zoox has launched the first serial production facility for purpose-built robo-taxis in the US, aimed at supporting the company's planned expansion in robo-taxi services across various markets, starting with Las Vegas and San Francisco, and later including Austin and Miami. This new facility, located in Hayward, California, spans 220,000 square feet and is Zoox's second vehicle production site in the Bay Area, while the first, in Fremont, California, foc...
    X-FAB expands 180-nm XH018 process with new isolation class for enhanced single-photon avalanche diode integration
    As reported in a press release on June 19, X-FAB Silicon Foundries SE has introduced a new isolation class within its 180-nanometer (nm) XH018 semiconductor process to enhance single-photon avalanche diode (SPAD) implementations. This new class supports more compact and efficient SPAD designs, enabling tighter integration, improved pixel density and a higher fill factor, resulting in a reduced chip area. SPADs are vital in applications such as Lidar for autonomous vehicles, 3D imagi...
    Kodiak Robotics partners with Roush Industries to scale autonomous truck upfitting by 2025
    In a press release on June 18, Kodiak Robotics, an AI-powered autonomous vehicle technology provider, announced a collaboration with Roush Industries Inc., a product development supplier in industries including mobility and defense, to scale the upfitting of autonomous trucks featuring the Kodiak Driver. Starting in the second half of 2025, Roush will conduct this upfitting at its facility in Livonia, Michigan. The first trucks to be upfitted by Roush will be for Atlas Energy Solutions, ...
    Innoviz collaborates with major automotive manufacturer for Level 3 automation Lidar integration
    According to a press release on June 17, Innoviz Technologies, a supplier of automotive-grade Lidar sensors and perception software, has entered into a Statement of Development Work (SoDW) agreement with a major passenger automotive manufacturer. As part of this agreement, Innoviz will provide advanced Lidar units for the manufacturer's Level 3 automated series-production program, which aims for a start of production in 2027. Starting in the second quarter of 2025, Innoviz will focu...
    Murata launches BLM15VM series for 5G-V2X noise suppression in automotive sector
    As reported in a press release on June 18, Murata Manufacturing is advancing automotive noise suppression technology with its new BLM15VM series of automotive-compliant chip ferrite beads. This series is designed to provide wideband noise suppression for high-frequency 5G vehicle-to-everything (5G-V2X) applications with high impedance. Mass production should begin in July. The automotive sector has seen a rise in high-frequency wireless communication for applications such as navigation, audio...
    Toshiba launches new two-channel digital isolators for automotive applications
    According to a press release on June 18, Toshiba Electronic Devices & Storage Corp. introduced a new series of two-channel high-speed standard digital isolators designed for automotive applications. The DCM32xx00 Series consists of four devices that support stable operation with a high common-mode transient immunity (CMTI) of 100 kV per microsecond (μs) and a high data transmission rate of up to 50 Mbps. These isolators conform to the AEC-Q100 standard, ensuring the safety and reliabil...
    Nissan unveils third-generation 2026 LEAF with enhanced range and innovative features
    Nissan Motor has unveiled the all-new 2026 LEAF, the third generation of its electric vehicle, offering a reimagined design with clean, dynamic body lines and a sport utility vehicle-like stance. The LEAF is set to reach US Nissan dealerships in the fall, with availability expanding to other markets thereafter. The new LEAF will be assembled alongside the Ariya at Nissan's Tochigi plant in Japan for the US and Canada markets. Key features of the vehicle include a new 3-in-1 powertra...
    Critical Metals Corp. receives $120 million Letter of Interest from US EXIM Bank to develop rare earth project in Greenland
    Critical Metals Corp., a critical minerals mining company, has received a Letter of Interest (LOI) from the Export-Import Bank of the United States (EXIM) for a non-dilutive funding package of $120 million. This funding is intended to develop the Tanbreez Project in Greenland, recognized as one of the largest rare earth deposits globally. EXIM's consideration involves financing up to $120 million, repayable over 15 years as part of its Supply Chain Resiliency Initiative (SCRI). This fund...
    US Senate's draft bill proposes tax credits increase for semiconductor manufacturers
    The US Senate's draft tax bill proposes increasing the investment credit for semiconductor manufacturers from 25% to 30%, according to a Bloomberg report on June 17. This incentive aims to encourage chipmakers to begin new projects in the US before the 2026 deadline, allowing them to continue claiming credits for ongoing construction beyond that date. The tax credit, part of the 2022 Chips and Science Act, is designed to revitalize the US semiconductor industry by offsetting the shift of prod...
    Applied Materials and CEA-Leti expand collaboration on specialty semiconductor innovation
    In a press release on June 16, Applied Materials and CEA-Leti announced an expanded phase of their collaboration, following a memorandum of understanding (MOU), aimed at accelerating innovation in specialty semiconductors. The partnership is focused on developing materials engineering solutions to overcome infrastructure challenges in AI datacenters. The joint lab, which concentrates on device innovations for the ICAPS markets (Internet of Things, Communications, Automotive, Power and Sensors...
    NXP completes acquisition of TTTech Auto to enhance software-defined vehicle solutions
    NXP Semiconductors announced the completion of its acquisition of TTTech Auto, a supplier of middleware for software-defined vehicles (SDVs), as reported in a press release on June 17. This acquisition follows an agreement announced in January. The combination of NXP's CoreRide platform and TTTech Auto's MotionWise safety middleware is designed to help automakers address integration challenges related to software and hardware. It aims to simplify development processes, enhance scalability a...
    Chinese automakers target 100% domestic chip production in vehicles from 2026
    Mainland Chinese automakers such as SAIC Motor, Changan, Great Wall Motor, BYD, Li Auto and Geely are set to launch models featuring 100% domestically produced chips, with at least two brands planning mass production by 2026, according to Nikkei Asia report on June 17. These models will include updated versions of existing lines, as part of mainland China's push for self-reliance in chip production. The initiative is overseen by the Ministry of Industry and Information Technology (MIIT), whic...
    NXP collaborates with Rimac Technology on advanced SDV centralized architectures
    NXP Semiconductors has announced a collaboration with Rimac Technology, an automotive industry supplier, to advance centralized architectures for software-defined vehicles (SDVs), according to a press release on June 12. This collaboration will focus on utilizing NXP's S32E2 processors, which form part of the S32 Automotive Processing Platform. The S32E2 processors are designed to meet the connectivity, security and safety challenges in modern automotive environments by providing high-performanc...
    Cadence expands collaboration with Samsung Foundry in multiyear intellectual property agreement for advanced process nodes
    In a press release on June 16, Cadence announced an expansion of its collaboration with Samsung Foundry through a new multiyear intellectual property (IP) agreement aimed at broadening Cadence's memory and interface IP solutions across Samsung Foundry's advanced process nodes, including SF4X, SF5A and SF2P. This partnership leverages Cadence's AI-driven design solutions alongside Samsung's advanced technology to deliver high-performance, low-power solutions tailored for AI datacenters, automo...
    Rimac Technology collaborates on Bugatti Tourbillon's hybrid hypercar set for 2026 delivery
    Rimac Technology, a tier 1 technology supplier in the automotive industry, has played a significant role in the engineering and design of the Bugatti Tourbillon hyper-sports car by integrating its advanced battery systems, e-axles and electronic control units into the vehicle. The Bugatti Tourbillon, which utilizes Rimac Technology's revolutionary hybrid system, is set for deliveries in 2026 with production limited to 250 units. The Tourbillon showcases Rimac Technology's expertise ...
    AutoTechInsight Weekly - 16 June 2025
    Click the link above to download this week's issue
    Xpeng working to integrate Turing smart driving chip into VW models in China
    Mainland Chinese automaker Xpeng said it has developed chips for autonomous driving that are more powerful than NVIDIA’s products, and it expects Volkswagen (VW) and other rivals to be customers, Financial Times reported June 12. He Xiaopeng, Xpeng’s co-founder and CEO, said it was working to integrate its self-designed Turing AI chip into select Volkswagen car models slated for launch in mainland China in 2026. He added that talks with Volkswagen and other companies about using the chips...
    NIRA Dynamics partners with BANF for enhanced tire safety and predictive maintenance
    NIRA Dynamics AB, a Swedish automotive software company, has joined forces with South Korea's BANF Smart Tire System to advance vehicle safety and predictive maintenance. This partnership, marked by a memorandum of understanding, aims to integrate BANF's high-frequency tire sensors into NIRA's established software ecosystem to enhance real-time monitoring for commercial vehicles. With this collaboration, both companies are transforming tire pressure monitoring systems (TPMS) to better protect ti...
    Infineon expands PSOC 4 HV microcontroller platform for automotive applications
    As reported in a press release on June 12, Infineon Technologies plans to expand its PSOC 4 HV microcontroller (MCU) platform with the introduction of the PSOC 4 HVMS product family. This new line is designed for space-constrained sensing or actuator applications, integrating high-voltage functionality and advanced analog sensing capabilities into a standard MCU. The aim is to connect easily to car batteries and vehicle networks with minimal external components required. In the automotive mar...
    Kyocera AVX unveils compact antennas for system-in-package applications in automotive
    Kyocera AVX introduced a range of compact and high-performance antennas designed for system-in-package (SiP) applications, as reported in a press release on June 12. These applications are gaining popularity due to their ability to integrate multiple integrated circuits (ICs) in a single package, providing the functionalities of an electronic system, such as processing and memory, in a small, efficient and cost-effective form. The company's new antennas are tailored for SiP modules, offering ...
    Calterah unveils mmWave radar and ultra-wideband technology for mobility applications
    At Calterah Day 2025 on June 6, Calterah announced significant advancements in its mmWave radar chip technology, focusing on imaging radar, advanced driver assistance system radar and emerging short-range radar. The company introduced the Dubhe, the  IEEE 802.15.4ab-compliant ultra-wideband (UWB) system-on-a-chip (SoC) series. The Andes Premium 8T8R Solution, achieved with two cascading Andes RoPTM chips, provides enhanced range detection and stable weak target detection in imaging ...
    Marelli gains interim court approval to access up to $519 million of debtor-in-possession financing
    Marelli Holdings has received interim approval from the US Bankruptcy Court for the District of Delaware to access up to $519 million out of a total $1.1 billion in debtor-in-possession financing. This approval pertains to Marelli's First Day motions related to its voluntary Chapter 11 petitions. Marelli filed for Chapter 11 bankruptcy protection to restructure its long-term debt on June 11. The secured financing, along with revenue from Marelli's ongoing operations, is intended to provi...
    Nuvoton releases 4th-generation automotive human-machine interface display integrated circuit series
    Nuvoton Technology Corp. Japan (NTCJ) will start the mass production of its 4th-generation automotive human-machine interface (HMI) display integrated circuit (IC) series, Gerda, available in three variants: Gerda-4M, Gerda-4L and Gerda-4C. This new lineup features image-processing technology, security and display safety functions to support the higher level of safety requirements and more comfortable driving experiences. The Gerda IC contributes to the development of next-generation H...
    General Motors plans to invest $4 billion on its US manufacturing plants
    US carmaker General Motors (GM) announced that it plans to invest $4 billion over the next two years to boost its domestic production of gasoline-powered and electric vehicles. This investment aims to increase the company's annual domestic vehicle assembly to over 2 million units. GM's announcement follows an earlier plan to invest $888 million in the Tonawanda propulsion plant near Buffalo, New York, to support the development of its next-generation V-8 engine. The new investments will impac...
    LEM releases high-voltage battery sensor that combines shunt and Hall effect technologies
    As reported in a press release on June 11, LEM has introduced a new current sensing unit for battery management in electric vehicles, named the Hybrid Supervising Unit (HSU), which combines shunt and open-loop Hall effect technologies into one component. It is designed to simplify system architecture, enhance safety and enable seamless upgrades without changes to the mechanical layout. In EVs, high-voltage battery management systems (BMS) have a critical role in managing the battery's state o...
    Xpeng unveils G7 SUV with proprietary Turing chip for smart-driving features
    Xpeng, a Chinese automaker, unveiled its first vehicle featuring a proprietary smart-driving chip, marking a step away from reliance on US chipmaker NVIDIA, according to a report published by Nikkei Asia on June 11. The newly introduced G7 sport utility vehicle is equipped with Xpeng's Turing chip, named after the computer science pioneer Alan Turing. This chip is promoted as an enhancement for the company's intelligent cockpit and autonomous driving functionalities. Xpeng Chairman and CEO He...
    Cyclic Materials to invest $25 million on setting up a center of excellence for rare earth recycling in Ontario
    Cyclic Materials, an advanced recycling company, has announced a $25 million investment to establish North America's first Centre of Excellence for rare earth recycling in Kingston, Ontario. This facility, which covers over 140,000 square feet and will create 45 skilled jobs, will serve as the company's industrial and innovation hub, integrating commercial processing with research and development to tackle the challenge of sourcing rare earth elements for permanent magnets. The Kingston facil...
    US-China agree on framework to ease export restrictions, trade conditions
    US and mainland Chinese officials have agreed on a framework to revive trade and ease mainland China's export restrictions on rare earths, though the agreement offers limited potential of resolving long-standing trade differences, a Reuters report said June 11. After intense negotiations in London, US Commerce Secretary Howard Lutnick said the framework would add substance to a previous agreement from Geneva, which aimed to ease bilateral tariffs that had reached high levels. The Geneva ...
    Hyundai Motor’s rare earth stockpile can last about a year, report
    South Korean automaker Hyundai Motor has accumulated a rare earths stockpile sufficient to last about a year, Reuters reported June 10. The company does not expect any immediate effects from the global supply chain disruptions triggered by mainland China's export restrictions on rare earth elements and magnets. Mainland China's decision to limit exports of rare earths and related magnets in April caused challenges in the supply chains vital to automakers, aerospace manufacturers, semicondu...
    VW to build future EVs on Rivian's new R2 platform
    As part of Volkswagen's joint venture with Rivian, VW will use Rivian's upcoming R2 platform for all its future electric vehicles, according to Rivian's Chief Software Officer Wassym Bensaid. Rivian plans for the R2 production to begin in the first half of 2026, with improvements over its predecessor, the R1, making the development process more efficient. The R2 offers a modular and scalable tech stack, allowing Volkswagen brands such as ŠKODA and Audi to inco...
    Toshiba enhances silicon carbide trench MOSFETs and Schottky barrier diodes for power conversion efficiency
    According to a press release on June 9, Toshiba Electronic Devices & Storage Corp. has developed new technology that enhances silicon carbide (SiC) trench metal-oxide-semiconductor field-effect transistor (MOSFETs) and SiC semisuper junction (SJ) Schottky barrier diodes (SBDs) by reducing on-resistance and improving unclamped inductive switching (UIS) ruggedness. These advancements are poised to enhance the reliability and efficiency of power conversion devices utilized in applicatio...
    Sony Semiconductor launches IMX479 SPAD depth sensor for automotive Lidar systems
    According to a press release on June 10, Sony Semiconductor Solutions Corp. (SSS) announced the launch of the IMX479 stacked, direct time-of-flight (dToF) SPAD depth sensor designed for automotive Lidar systems, promising high-resolution and high-speed capabilities. This new sensor uses a dToF pixel unit composed of 3×3 SPAD pixels to improve measurement accuracy through a line scan methodology. It features SSS's proprietary device structure, achieving a frame rate of up to 20 frames ...
    Infineon launches inductive sensor for automotive chassis applications
    Infineon Technologies has announced the launch of the XENSIV TLE4802SC16-S0000, an inductive sensor aimed at improving automotive chassis applications. The sensor is capable of conducting high-precision torque and angle measurements while maintaining robust stray field performance. It supports digital output via SENT or SPC protocols and does not require additional shielding. Designed specifically for electric power steering systems, including torque and steering angle sensors, as well as pedal ...
    STMicroelectronics reveals digital automotive audio amplifiers for smart-cockpit applications
    STMicroelectronics (ST) has introduced new class-D automotive audio amplifiers, the HFDA80D and HFDA90D, designed for smart-cockpit applications. These amplifiers are engineered for compact size and feature a digital input to simplify circuit design. They expand ST's range of high-frequency automotive amplifiers and complement the existing HFA80A analog-input integrated circuit. Operating at a switching frequency of 2 MHz, the devices save printed circuit board (PCB) space and reduce materi...
    Aumovio appoints new executive board members to drive future growth
    Continental is on track to spin off its automotive group sector business under the Aumovio brand and its subsequent listing on the Frankfurt Stock Exchange by the end of 2025. Aumovio SE reached a key milestone on June 5, when its supervisory board confirmed the executive board appointment. Alongside CEO Philipp von Hirschheydt, four new members have been appointed to strengthen the board. Ingo Holstein will assume the role of chief human resource offic...
    Hyundai Mobis opens new Logistics Center in Gyeongju
    Hyundai Mobis has inaugurated a significant logistics center in Gyeongju, South Korea, to enhance the supply of aftersales parts for Hyundai Motor and Kia in the country, according to a report published by Business Korea on May 30. The Yeongnam Logistics Center, situated in the Myeonggye 3 General Industrial Complex in Gyeongju, North Gyeongsang Province, began full operations earlier in 2025. Construction of the center cost approximately 97 billion won (about $0.071 billion) and spann...
    VeriSilicon advances GPGPU-based AI computing intellectual properties for automotive electronics
    According to a press release on June 9, VeriSilicon announced advancements in its general-purpose graphics processing unit (GPGPU) architecture-based AI computing intellectual properties (IPs), which now power next-generation automotive electronics. These IPs combine programmable parallel computing with an AI accelerator, offering high computing density for AI workloads such as large language model inference and real-time decision-making in environments with thermal and power constrain...
    Oppo signs patents licensing deal with Volkswagen for connected vehicles
    Smart device company Oppo announced a global patent licensing agreement with Volkswagen. This agreement involves licensing Oppo's cellular standard-essential patents, including those for 5G technology, to Volkswagen. The collaboration aims to enhance the user experience of Volkswagen's connected vehicle products worldwide. Vincent Lin, head of Patent Licensing at Oppo, acknowledged Volkswagen's intellectual property team's efforts in recognizing the value of this partnership, marking a commitmen...
    China approves export licenses for rare earths amid rising global demand
    Mainland China recently approved several export license applications for rare earth-related items in response to the increasing international demand for medium and heavy rare earth elements, primarily utilized in high-tech manufacturing sectors such as industrial robotics and electric vehicles. This strategy aims to balance mainland China's resource security with its status as a crucial supplier in the global high-tech value chain. The Commerce Ministry said that the export controls on rare e...
    AutoTechInsight Weekly - 9 June 2025
    Click the link above to download this week's issue
    Synopsys expands collaboration with Arm to accelerate development of software-defined vehicles
    According to Synopsys' blog post on June 4, Synopsys has expanded its long-standing collaboration with Arm to support the automotive industry’s rapid transition to software-defined vehicles (SDVs). The partnership focuses on addressing the growing demand for smarter, AI-powered in-car experiences while tackling the rising complexity, cost and development challenges faced by automakers. As vehicles become increasingly reliant on advanced computing capabilities, current architectures struggle...
    Samsung collaborates with Infineon and NXP for next-gen automotive semiconductor solutions
    Samsung Electronics has teamed up with Infineon and NXP to develop next-generation automotive semiconductor technology solutions, aiming to address the rising demand for high-performance computing chips in future smart vehicles, according to a report published by TrendForce on June 5. The evolution of autonomous driving technology has driven the need for increased computing power in automotive chips. Samsung is leveraging its expertise in memory and processor technologies to introduce advanced p...
    Minieye partners with Changan Automobile for ADAS domain controllers
    Minieye announced a partnership with Changan Automobile, securing a production program for main models under Changan's self-owned new-energy vehicle brand, according to a report published by SMM on June 6. As the designated supplier, Minieye will provide advanced driver-assistance domain controllers designed to support a comprehensive range of driving scenarios, enhancing safety and convenience for both drivers and passengers in various environments such as highways, urban areas and parking...
    Suzuki halts production of Swift models owing to shortage of rare earth materials in Japan
    Suzuki Motor has suspended production of its Swift subcompact car owing to the shortage of rare earth materials and magnets in Japan. Mainland China's restrictions on rare earth exports have caused the shortage. Citing unnamed sources aware of the development, a news report published by Reuters on June 5 stated that Suzuki became the first Japanese automaker affected by these curbs. Production of the Swift models, excluding the Swift Sport version, was halted on May 26 because of a sh...
    Qualcomm acquires Autotalks to enhance automated driving and vehicle-to-everything deployment
    According to a press release on June 5, Qualcomm Inc. announced that its subsidiary, Qualcomm Technologies Inc., has finalized the acquisition of Autotalks, a notable entity in the realm of direct vehicle-to-everything (V2X) communication solutions. V2X technology is pivotal for improving road safety and enhancing transportation efficiency. The acquisition allows automakers and related sectors to access a comprehensive range of production-ready, automotive-qualified global V2X solutions ...
    Infineon partners with Typhoon HIL for integrated xEV powertrain development
    In a press release on June 5, Infineon Technologies AG announced a collaboration with Typhoon HIL to provide an integrated real-time development and testing environment for xEV powertrain systems. This collaboration enables automotive engineering teams to use Typhoon's hardware-in-the-loop (HIL) simulator with Infineon's AURIX TC3x/TC4x microcontrollers (MCUs) to achieve ultrahigh-fidelity motor drive, onboard charger, battery management system (BMS) and power electronics emulation. The sol...
    CLEPA seeks urgent action as mainland China’s export restrictions on rare earth begins to disrupt European auto supply chains
    The European Association of Automotive Suppliers (Comité de Liaison Européen des Fabricants d'Equipements et de Pièces Automobiles [CLEPA]) warned that mainland China’s export restrictions on rare earth elements (REEs) and magnets have caused a severe shortage of critical materials, shuttering several assembly lines and plant operations in Europe. “These restrictions have led to the shutdown of several production lines and plants across Europe, with further impacts expected in the comi...
    Cadence extends support for automotive solutions on Arm Zena Compute Subsystems
    In a press release on June 4, Cadence announced new intellectual property (IP), design solutions and expert design services for software and systems-on-chip (SoCs) based on Arm Zena Compute Subsystems (CSS), intended for the automotive sector. This initiative is the first major output of a collaboration with Arm, which began in 2024 to accelerate development in the automotive chiplet ecosystem. Through this collaboration, Cadence utilizes a combination of digital twins for software developm...
    Stradvision collaborates with Arm on Zena Compute Subsystems for AI-defined vehicles
    Stradvision is supporting Arm's announcement of the Arm Zena Compute Subsystems (CSS), a platform created to aid the development of AI-defined vehicles. As vehicles' software capabilities expand, automakers and tech partners are facing demands for scalable, high-performance and safety-enabled compute platforms. Zena CSS is designed to meet these needs, offering a comprehensive compute platform that supports advanced computing requirements across various domains in a vehicle, such as central comp...
    GlobalFoundries invests $16 billion in semiconductor manufacturing in New York and Vermont
    In a press release on June 4, GlobalFoundries (GF) announced a strategic plan to invest $16 billion to enhance its semiconductor manufacturing and advanced packaging capabilities in New York, US, and Vermont, US. This investment is designed to address the rising demand for semiconductors due to the growing prevalence of AI, which requires chips that are both power-efficient and capable of high-bandwidth performance. The initiative is supported by collaboration with the Trump administration an...
    US imposes export controls on chip design software to China
    The Trump administration has implemented new export controls on chip design software that is used to produce and utilize advanced AI chips, according to a report published by TechCrunch on May 30. Siemens EDA, Cadence Design Systems and Synopsys have confirmed receiving notifications from the US Commerce Department regarding these export controls specifically targeting electronic design automation (EDA) software to China. EDA tools are essential for designing and validating semiconductor manufac...
    AutoSens US 2025: IntoPIX unveils intelligent image compression advancements for ADAS
    At the upcoming AutoSens US 2025 event in Detroit, intoPIX is set to reveal its latest advancements in intelligent image compression tailored for advanced driver assistance systems and autonomous vehicles. These innovations assist automotive engineers in managing the growing data requirements of next-generation perception systems while maintaining safety, adaptability and cost-effectiveness, according to a press release on June 3. IntoPIX's JPEG XS and TicoRAW technologies provide ultralow la...
    Continental develops sensor technology to reduce use of rare earth in electric motors
    Continental unveiled a pioneering sensor technology, the e-Motor Rotor Temperature Sensor (eRTS), designed for electric vehicles. This technology measures the temperature within permanently excited synchronous motors directly on the rotor, enhancing accuracy from a 15°C tolerance to just 3°C. This precision allows automakers to reduce the usage of rare earth elements (REEs) needed for heat resistance and to potentially boost motor performance, thus supporting sustainability. The eRTS is par...
    Industry stakeholders announce formation of OpenGMSL Association
    A leading automotive original equipment manufacturer, some Tier-1 suppliers and semiconductor manufacturers, along with ecosystem partners, announced the formation of the OpenGMSL Association, an initiative uniting industry leaders to establish serializer/deserializer (SerDes) transmission of video and/or high-speed data as an open, worldwide standard across the automotive ecosystem. The OpenGMSL Association is a non-profit entity with its own independent board of directors and encourages global...
    Mainland China to cooperate with other countries on rare earth export controls
    Mainland China announced its intent to enhance cooperation with other nations concerning its rare earth export controls amid potential shortages that could impact automobile and semiconductor manufacturers in Europe and India, according to a May 30 report by Reuters. Mainland China holds more than 90% of the global processing capacity for rare earth magnets, which are essential in various industries, and began enforcing stricter export regulations in early April, requiring exporters to acquir...
    STMicroelectronics unveils L9026 8-channel driver for enhanced safety in automotive applications
    STMicroelectronics has introduced the L90268-channel driver, featuring six configurable high-side/low-side outputs and two high-side outputs, catering to space-constrained applications. The L9026 is designed to enhance safety and reliability with its limp-home mode and two extra input pins for fail-safe operation in case of controller failure. It is capable of driving multiple relays, solenoids, LEDs and resistive loads, making it suitable for use in body electronics, climate controls and f...
    Segger extends J-Link support to Allegro MicroSystems' A892XX microcontrollers
    As reported in a press release on May 28, Segger announced the extension of support for its J-Link debug probes to include Allegro MicroSystems's A892XX-series microcontrollers. With this support, users can download programs into and debug Allegro's microcontrollers using Segger's J-Link probes. The support also brings access to the Ozone multiplatform debugger and the Flasher family of professional in-circuit programmers, facilitating production programming and service technician use. A...
    Japanese consortium proposes communication standard for automotive chips to UCIe Consortium
    A group of Japanese companies in the auto and semiconductor industries proposed a communication standard for automotive chips to an international body, aiming to advance technology essential for the growing electrification of vehicles, according to a report published by Nikkei Asia on June 2. The group, called Advanced SoC Research for Automotive (ASRA), comprises 14 companies, including Toyota Motor, Honda Motor, auto parts supplier DENSO and chipmaker Renesas Electronics. The establishment ...
    AutoTechInsight Weekly - 2 June 2025
    Click the link above to download this week's issue
    TSMC to open new design facility in Munich for automotive chip innovations
    Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) announced plans to establish a new facility in Munich, which will focus on optimizing chip designs for automotive and other industries, newelectronics reported May 28. The facility aims to cultivate and expand expertise in automotive and nonvolatile memory across the EU, particularly in the areas of resistive random-access memory (RRAM) and magnetoresistive random-access memory (MRAM) innovations, and will support the industry in advancing be...
    Innometry to showcase EV battery X-ray inspection solutions at The Battery Show Europe 2025
    Innometry announced its plans to present X-ray inspection solutions for electric vehicle batteries at The Battery Show Europe 2025 in Germany. This event, recognized as Europe's largest battery expo, will feature Innometry's booth showcasing its X-ray equipment capable of precisely analyzing the internal structure of rechargeable batteries to identify defects and mitigate EV fire risks. Emphasizing its technological capabilities, the South Korean company utilizes artificial intelligence-based so...
    Ambarella reports nearly 58% YOY revenue increase in Q1 of fiscal year 2025–26
    Ambarella Inc., based in Santa Clara, California, has released its financial results for the first quarter of fiscal year 2025–26, which ended on April 30, 2025. The company, listed on Nasdaq under the symbol AMBA, reported that its revenue for the period was $85.9 million, marking a 57.6% increase from $54.5 million in the same quarter of the prior fiscal year. The gross margin, according to US generally accepted accounting principles (GAAP), for this quarter was 60.0%, slightly down from 60....
    From silicon to software: Qualcomm’s expanding role in the automotive value chain
    Qualcomm has rapidly and deliberately expanded into the automotive sector, positioning itself as a key enabler of the software-defined vehicle era. This is partly a result of the company’s implementation of strategies developed in the mobile phone market, including power efficiency and the value of having a comprehensive ecosystem. As a result, Qualcomm has transformed its automotive portfolio from basic connectivity solutions to a comprehensive suite that includes digital cockpit technologies...
    Mobileye to supply imaging radar to global automaker for eyes-off driving
    A global automaker selected Mobileye imaging radar for its upcoming automated driving system for personal vehicles, according to a press release on May 28. Beginning in 2028, the automaker will integrate the imaging radar into its vehicles to implement SAE Level 3 automated driving on highways. This system is designed to effectively detect vehicles, people, and other objects, even in challenging conditions like fog or rain. Mobileye's 4D imaging radar aims to provide sensor redundancy thro...
    Samvardhana Motherson reports strong growth in revenue and profit in FY 2024/25; plans $700 million capital expenditure in FY 2025/26
    Samvardhana Motherson International Ltd. reported a 40% year-over-year increase in net income of 38 billion rupees (about $444.5 million) in the financial year ended March 31, 2025, the leading auto parts manufacturer from India said in a press release on May 29. The company recorded strong growth in net profit as total revenue surged 15.2% year over year to 1.14 trillion rupees. Higher revenue also helped the Indian supplier to record a profit before tax of 56.2 billion rupees, up 37% year...
    Dekra opens US Automotive Test Center of Excellence in Michigan
    Dekra, a leading provider of safety, security, and sustainability testing and certification services, has opened a new automotive testing laboratory in Plymouth, Michigan. The facility, which is designed to address the future needs of the mobility sector, provides a wide range of automotive testing, validation and certification services, including electric vehicle testing, automotive electromagnetic compatibility (EMC), reliability testing, automotive connectivity technologies and digital t...
    Pioneer India opens new automotive R&D center in Bengaluru
    Pioneer India, a subsidiary of Pioneer Corp., has established a new Research & Development Center in Bengaluru, India. This center will coordinate with Pioneer's global R&D and engineering networks to develop solutions in various areas, including automotive vision and sensing technologies, advanced driver assistance systems, and digital cockpit and human-machine interfaces. It will also focus on cloud-connected infotainment and telematics, AI and mobility data platforms, and connected so...
    Loxo selects Aeva to power autonomous delivery vehicles
    In a press release on May 28, Aeva announced that Loxo, a Swiss provider of urban autonomy software, has chosen its long-range 4D Lidar technology for integration into Loxo's autonomous driving platform, Digital Driver. This collaboration will kick off with the deployment of Aeva Atlas, Aeva’s 4D Lidar sensor, across Loxo’s fleet of delivery vehicles. The Aeva Atlas will be implemented in Loxo's delivery vehicles, which are specifically designed for middle and last-mile log...
    Premium global automaker selects Valeo’s imaging radar system for automated driving
    As reported in a press release on May 28, Valeo has been chosen by a leading global automaker to provide a new radar system designed for its personal vehicles, which will feature an automated driving system that allows for hands-free and eyes-free operation. This initial production selection for the radar system will enhance the operational design domain of automated driving and improve the human-machine interaction when responding to road hazards at high speeds, among other additional features....
    Infineon SEMPER NOR Flash receives ASIL-D certification for automotive applications
    Infineon Technologies announced that its SEMPER NOR Flash memory has been certified by SGS-TÜV to ASIL-D, which is the highest certification level for functional safety, the company said in a press release on May 8. This certification comes after a comprehensive analysis of the product's safety documentation according to the ISO 26262:2018 standard. External experts from SGS-TÜV have confirmed that the SEMPER devices meet the most stringent safety performance criteria required for automotive a...
    South Korean government offers $182.2 million in low-interest loans to support auto-parts firms hit by US tariffs
    The South Korean government announced plans to provide a total of 250 billion won (about $182.4 million) in low-interest loans to small and medium-sized auto-parts manufacturing firms until the end of 2026 as a measure to mitigate the impact of US tariff, Yonhap News Agency reported May 28. This initiative, articulated by the Industry Ministry on Wednesday (May 28), is aimed at cushioning the sector from economic disruptions caused by these tariffs. Auto-parts manufacturers that have been exp...
    Wolfspeed plans to file bankruptcy amid debt management challenges
    Semiconductor supplier Wolfspeed is preparing to file for Chapter 11 bankruptcy within weeks due to challenges in managing its debt, according to a Reuters report dated May 20. The report referenced The Wall Street Journal as the original source of the news, which cited sources familiar with the situation. Following this news, the company's shares fell over 57% in extended trading. Wolfspeed has been facing difficulties stemming from low demand in industrial and automotive markets, as well as...
    Foretellix expands Foretify platform to train autonomous vehicle stacks
    Foretellix, a leader in data automation for AI-powered autonomy, announced an expansion of its Foretify platform to help autonomous vehicle developers reduce development time by half and save substantial financial resources. The platform addresses the challenges faced by autonomous vehicle developers in the realm of physical AI, offering solutions to train AI engines using real drive data augmented with hyper-realistic synthetic data. The necessity of validating autonomous vehicle systems for sa...
    Joynext launches ultra-wideband-based child presence detection product for enhanced vehicle safety
    According to a press release on May 26, Joynext has introduced its first child presence detection (CPD) product, utilizing ultra-wideband (UWB) technology, now available on the market. This product will be installed in vehicle models of a notable Japanese joint venture brand to enhance child safety in automobiles. It is one of the initial mass-produced products in China that adhere to the China New Car Assessment Program's (C-NCAP) direct detection requirements for CPD using UWB techno...
    Auto Shanghai 2025: It was all there, from software-defined vehicle to vehicle-defining software
    The biennial Auto Shanghai 2025 has emerged as a showcase for an array of technologies that blend hardware with software, effectively blurring the lines of traditional automotive classifications. Over the last decade, the event has matured into a pivotal global stage for both local debuts and international launches. Yet, the conspicuous absence of several key brands suggests a potential transformation within the industry. For the first time since 2002, major Korean automakers Hyundai, Kia, an...
    Silanna launches small and efficient laser driver platform
    Silanna Semiconductor launched the FirePower series of laser driver integrated circuits (ICs), designed to reduce the size and increase peak power of light detection and ranging (LiDAR) applications, the company said in a May 21 press release. The FirePower laser driver ICs integrate charging and firing on a single chip, enabling smaller size, reduced losses and fewer components on the printed circuit board (PCB), which decreases the component coun...
    AutoTechInsight Weekly - 26 May 2025
    Click the link above to download this week's issue
    New Xiaomi YU7 gets upgraded E/E architecture, HMI, ADAS and infotainment
    Xiaomi EV has unveiled its first sport utility vehicle, the YU7. Positioned as a high-performance luxury SUV, the YU7 represents a completely reimagined vehicle from the ground up, including refreshed design, cabin comfort, safety and smart capabilities.  To begin, the YU7 has significantly upgraded its electrical/electronic architecture (EEA). It adopts a Four-in-One Domain Control Module, integrating the assisted driving domain (ADD) controller, digital cockpit domain (DCD) controller,...
    NXP launches OrangeBox 2.0 with AI and post-quantum cryptography for software-defined vehicles
    NXP Semiconductors launched OrangeBox 2.0, an advanced automotive-grade development platform that incorporates advanced technologies such as AI, post-quantum cryptography and integrated software-defined networking. These enhancements secure vehicles against evolving cyber threats and facilitate the transition to software-defined vehicles. OrangeBox 2.0 offers a fourfold increase in CPU performance over its predecessor and integrates innovations such as embedded AI acceleration, an Automotive Saf...
    Asahi Kasei Microdevices partners with Dirac for enhanced automotive audio DSPs
    As reported in a press release on May 19, Asahi Kasei Microdevices (AKM) and Swedish company Dirac have announced a partnership to integrate Dirac's AudioIQ software into AKM's automotive audio digital signal processors (DSPs), including the AK7709 model. The collaboration aims to enhance sound quality in vehicle interiors and reduce tuning time. The integration will bring precise audio capabilities to automotive amplifier systems, offering a natural and immersive sound experience with less n...
    Foretellix enhances AI training for autonomous vehicles with NVIDIA Omniverse integration
    As reported in a press release on May 21, Foretellix developed the Foretify data automation toolchain, which trains AI-powered autonomous vehicle stacks by curating real-world data and augmenting it with synthetic scenarios. This toolchain leverages NVIDIA Omniverse and Cosmos to create hyper-realistic sensor simulation data, boosting the efficiency of achieving safety in specific operational design domains (ODDs) by tenfold. It also assesses real and simulated drive data to provide independent ...
    Ireland unveils Silicon Island to boost its semiconductor industry
    As reported in a press release on May 29, Ireland unveiled its Semiconductor Strategy, dubbed Silicon Island, focusing on strengthening the country's global position in the semiconductor industry. This initiative, aligned with the European Chips Act and the EU Digital Decade, aims to expand Ireland's semiconductor sector by creating high-value jobs, attracting investment and positioning the country as a pivotal player in Europe's semiconductor landscape. The strategy was developed through con...
    loading
    Searching our resources for you...
    preload preload preload preload preload preload