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    US automakers, battery suppliers rationalize excess battery capacity, pivot to energy storage systems
    In December 2025, Ford Motor Co. and SK On announced plans to end their $11.4 billion battery joint venture — BlueOval SK — as part of their broader business overhaul amid a slowdown in demand for battery-electric vehicles (BEVs) and the end of government subsidies under the Inflation Reduction Act (IRA). The decision to cease the battery JV came as the two companies sought to avoid accumulating losses from EV battery operations in a market witnessing policy shifts away from BEVs and to r...
    European New Car Assessment Program’s button mandate forces a rethink of the digital cockpit
    For more than a decade, the automotive industry followed a clear trajectory: digitize the driving experience, replace physical controls with touchscreens and let software define the cockpit. From 2026, Europe’s most influential vehicle safety assessor will begin to reverse that logic. Under revised protocols, the European New Car Assessment Program (EuroNCAP) will explicitly reward vehicles that provide physical controls for essential driving functions, such as indicators, hazard lights, wi...
    BMW recalls over 58,000 vehicles in the US due to wiring harness issue
    BMW has announced a safety recall affecting 58,713 vehicles in the US due to a potential fire hazard linked to the air conditioning system’s electrical wiring harness. The recall has been registered with the US National Highway Traffic Safety Administration under campaign number 26V-096. The action covers several recent models across BMW’s 5 Series, 7 Series and M portfolios, including: The 2023–2025 i7 xDrive60 The 2024–2025 750e xDrive, i5 M60 xDrive and i7 eDr...
    NXP Semiconductors unveils 10BASE-T1S PMD transceivers for automotive use
    NXP Semiconductors has introduced production-released 10BASE-T1S Physical Medium Dependent (PMD) transceivers, specifically the TJA1410 for automotive use and the TJF1410 for industrial applications, including building automation. These groundbreaking transceivers allow original equipment manufacturers to extend low-cost, multidrop Ethernet all the way to the network edge, which is critical for both scalable software-defined vehicle (SDV) and industrial architectures. The TJA1410 is fully qualif...
    Capital Market Day 2026: Forvia unveils IGNITE strategic road map, targets sales of €21 billion-€22 billion in 2028, an operating margin of at least 7%
    Forvia unveiled its new strategic road map, IGNITE, at the 2026 Capital Markets Day. The road map, with the theme "Drive what matters and unlock what is next," will be implemented in two key phases: Focus & Strengthen between 2025 and 2028, followed by Lead & Grow. The strategic road map aims to sharpen Forvia's profile, reduce complexity and increase financial flexibility to promote growth and sustained cash flow generation. “IGNITE marks the start of a new strategic chapter for Fo...
    Forvia reports higher operating income, strong cash flow despite 3% year-over-year drop in sales to €26.9 billion
    Forvia Group delivered strong financial performance in the fiscal year ended Dec. 31, 2025. The France-based company reported sales of €26.2 billion, down 3% year over year from €26.9 billion in 2024. However, at constant currency, sales remained unchanged at the 2024 level. Despite lower sales, operating income increased 4% year over year to €1.4 billion, which led to a 40-basis-point increase in operating margin to 5.6%. The company reported a 47% year-over-year growt...
    Renesas R-Car V4H ADAS chip integrated in Toyota RAV4's control unit
    Renesas Electronics announced that its advanced driver assistance system automotive system-on-chip (SoC), R-Car V4H, has been chosen for the TSS(LSS) control unit in Toyota Motor Corp.'s new RAV4 model, which launched in December 2025. This control unit is supplied by DENSO Corp. The R-Car V4H is developed for ADAS applications and efficiently manages processing in the RAV4, including functions such as camera and radar sensor fusion, Driver Monitor, Advanced Park and panoramic views for enh...
    Aptiv’s Electrical Distribution Systems business to become Versigent after tax-free, spinoff on April 1
    Aptiv has announced that its Electrical Distribution Systems (EDS) business will be known as Versigent, following a tax-free spinoff planned for April 1. Versigent, expected to trade on the NYSE under the ticker symbol VGNT, will be led by Joseph Liotine as CEO. Liotine has been with Aptiv since 2024, serving as executive vice president and president of the EDS business. Doug Ostermann has been named CFO. Ostermann, who has extensive experience in the automotive and industrial sectors, recent...
    US International Trade Commission begins investigation into USMCA automotive rules of origin
    The US International Trade Commission (ITC) has initiated an investigation into the automotive rules of origin under the United States-Mexico-Canada (USMCA) trade agreement to assess their impact on the US economy, competitiveness, and relevance in light of recent technological changes. The USMCA's rules of origin have increased regional value content requirements, compelling manufacturers in the US, Mexico and Canada to source more inputs from within the region to qualify for free tra...
    AutoTechInsight Weekly - 23 February 2026
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    Ablic Inc. introduces S-19760/1 Series shunt reference integrated circuits with high accuracy for vehicles
    Ablic Inc., part of the MinebeaMitsumi Group and led by President Seiji Tanaka, has introduced the S-19760/1 Series automotive shunt reference integrated circuits (ICs). This new series offers output voltage accuracy of ±0.1% and output voltage temperature coefficient of ±20 ppm/°C. The ICs serve as a reference voltage for A/D converters, which transform analog sensor signals into digital values. Notable features of the S-19760/1 Series include the industry-topping output voltage accuracy ...
    BOS Semiconductors raises $60.2 million in Series-A funding for AI chip development
    BOS Semiconductors, a fabless chipmaker from South Korea, has successfully raised approximately $60.2 million (87 million won) in a Series-A funding round, a significant figure for an early-stage South Korean startup. This reflects the market's interest in AI semiconductors and BOS Semiconductors' rising status in the industry. The funding round saw participation from both existing and new investors, including Atinum Investment, Partners Investment, Stick Ventures, Industrial Bank of Korea,...
    Tasking unveils enhanced timing analysis tools for multicore embedded systems
    Tasking, a company specializing in high-performance embedded software development tools, has announced enhancements to its unified toolchain designed to provide more comprehensive timing analysis for real-time, multicore embedded systems. The toolchain integrates Tasking's compiler technology, BlueBox debuggers, winIDEA IDE, and the LDRA tool suite. These enhancements aim to help developers assess complex timing issues, such as worst-case execution time (WCET), in line with industry standards. T...
    Qualcomm plans India-based manufacturing for global automotive module export
    Qualcomm is preparing to sign a deal to contract-manufacture and source automotive module products from India, which will be exported worldwide and sold domestically, as stated by Qualcomm Global CEO and President Cristiano Amon. This development marks Qualcomm as potentially the first leading global chipmaker to export such products from India, following the Indian government's announcement of a $10 billion semiconductor incentive package nearly four years ago. The announcement coincides with t...
    Bharat Forge and VVDN Technologies sign memorandum of understanding for strategic collaboration
    Bharat Forge and VVDN Technologies have signed a memorandum of understanding (MOU) to explore strategic collaboration in various technology-driven sectors. The two companies plan to pursue opportunities in sectors such as automotive systems, defense applications, AI infrastructure and data center platforms.  The partnership leverages VVDN's expertise in electronics design, software development and system integration alongside Bharat Forge's capabilities in advanced manufacturing and prec...
    Mainland China’s DRAM push – a solution to the global supply crisis?
    The first quarter of 2026 opened with renewed concerns about a shortage of DRAM for automotive applications. Memory manufacturers have been reallocating wafer capacity toward high-bandwidth memory (HBM) and other premium products for AI data centers, where demand and margins are rising fastest. This reallocation tightened supply for traditional automotive DRAM, leaving vehicle makers exposed to constrained inventories and rising competition for limited fab capacity. A small number of firms do...
    Renesas unveils new system-on-chip technologies for automotive multidomain electronic control units with enhanced AI processing
    Renesas Electronics has developed three system-on-chip (SoC) technologies for automotive multidomain electronic control units (ECUs) featuring advanced AI processing capabilities and chiplet functions. These were presented at the International Solid-State Circuits Conference 2026. In software-defined vehicles (SDVs), automotive SoCs need to handle multiple applications simultaneously and ensure automotive-grade quality while controlling power consumption and safety. Renesas introduced a propr...
    Renesas unveils 3-nanometer TCAM for automotive applications with enhanced density and safety
    Renesas Electronics has unveiled a configurable ternary content-addressable memory (TCAM) built on a 3-nanometer (nm) fin-shaped field-effect transistor (FinFET) process, aimed at enhancing density, lowering power consumption and improving functional safety for automotive applications. The announcement was made at the International Solid-State Circuits Conference 2026 in San Francisco. This development comes amid growing network traffic driven by 5G and cloud/edge computing, prompting a demand f...
    ROHM unveils HPLF5060 for 40-V and 60-V automotive MOSFETs in compact package
    ROHM has introduced a new compact package, the HPLF5060, for its 40-V and 60-V automotive metal-oxide-semiconductor field-effect transistors (MOSFETs), targeting applications such as main inverter control circuits, electric pumps and LED headlights. This package, measuring 4.9 mm by 6.0 mm, is designed to accommodate the growing demand for smaller MOSFET packages in the automotive industry. The shift toward compact formats, such as the 5060-size, has posed challenges in reliable board mount...
    EU draft policy to mandate 70% local content for EVs to qualify for subsidies
    The EU is working on a new draft policy that aims to mandate electric vehicles to have at least 70% of their components produced within the EU, excluding batteries, to qualify for state support and subsidies. This policy is part of a broader strategy to protect the EU's €2.6 trillion manufacturing sector and to counteract challenges such as competition from low-cost Chinese products, high-energy prices and stringent climate regulations. Additionally, the policy is expected to requir...
    Globalfoundries and Renesas expand partnership for semiconductor manufacturing in the US
    GlobalFoundries (GF) and Renesas Electronics have announced an expanded strategic collaboration involving a multibillion-dollar manufacturing partnership. This collaboration enhances Renesas' access to GF technologies, including differentiated technology platforms, and aligns with US priorities to strengthen domestic semiconductor production for economic and national security. As vehicles become more intelligent and factories more automated, there is a critical need for a reliable semiconductor ...
    TDK expands NTCSP series of thermistors for high-temperature automotive applications
    TDK Corp. announced the expansion of its NTCSP series of NTC thermistors, designed for high-temperature environments up to 175°C, with mass production commencing in February 2026. These thermistors are aimed at enhancing automotive performance by supporting the need for more powerful and heat-resistant power semiconductors. Previously, TDK's thermistors were guaranteed to operate up to 150°C, but the new range extends this capability to 175°C. The NTCSP series is a device compliant with AE...
    Infineon and BMW to develop software‑defined vehicle architecture for Neue Klasse
    Infineon Technologies is significantly contributing to the development of BMW Group's Neue Klasse, which is a platform aimed at individual mobility through electrification, digitalization and sustainability. This platform provides an integrated and future-ready electrical/electronic (E/E) architecture, laying the ground for improved and sustainable mobility solutions. Infineon's role includes delivering dependable computing, high-speed connectivity and efficient power management. At the Annual G...
    BorgWarner wins new 48-V electric cross differential program with mainland China-based OEM
    BorgWarner has secured a new electric cross differential (eXD) program with a mainland China-based original equipment manufacturer. The solution is designed specifically for a 48-V system and integrates seamlessly with the OEM customer's existing 48-V electrical/electronic (E/E) architecture. This supply order marks BorgWarner's first 48-V eXD application within its global offerings, expanding the company's capabilities in torque management for electric vehicles. As the EV market evolves, E/E...
    Magna delivers mixed Q4 FY’2025 results, sales up 2% year over year but operating income down 70% due to noncash impairment charges
    Magna International delivered a mixed financial performance in the fourth quarter and the full year ended Dec. 31, 2025. Sales increased by 2% year over year in the fourth quarter to $10.8 billion, despite a 1% decline in global light vehicle production. The Canadian supplier attributed revenue growth to increased production from ongoing programs and the launch of new ones, as well as net customer recoveries, which largely offset higher tariff costs. The fourth quarter adjusted earnings ...
    AutoTechInsight Weekly - 16 February 2026
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    Dutch court orders investigation into Nexperia and upholds Chinese CEO's suspension
    A Dutch court has ordered an inquiry into alleged mismanagement at chipmaker Nexperia, in a development that affects its Chinese parent Wingtech. The decision allows the European management team, which assumed control following intervention by the Dutch state in 2025, to remain in charge. The dispute surrounding Nexperia — extending from corporate boardrooms to policymakers in Brussels and Beijing — has become one of the more visible recent corporate tensions between Europe and China. It ...
    CES 2026: Software-defined vehicles continue to evolve and gain momentum and scale
    The recently concluded Consumer Electronics Show (CES) 2026 (Jan. 6–9, 2026) marked a clear inflection point: software-defined vehicles (SDVs) have entered their industrialization phase. Original equipment manufacturers and suppliers shifted decisively away from exploratory demos and concepts toward scalable, production-ready SDV platforms, with most architectures, toolchains and compute strategies aligned to 2026–28 SOPs. The focus has clearly moved from what SDVs could do, to how they can ...
    Ericsson unveils in-vehicle 5G router with dual-SIM failover and edge AI
    Ericsson has launched the Ericsson Cradlepoint R2400 router and the extensible RC1250 modem. It is built for vehicles and mobile field teams, combining ultrafast failover, high-precision location services and advanced edge computing to help organizations operate more safely, efficiently and reliably. Designed for first responders, transit operators and private fleets, the R2400 supports mission-critical applications ranging from lifesaving emergency coordination to route...
    BorgWarner expands battery management system program with global OEM for BEVs and PHEVs
    BorgWarner, located in Auburn Hills, Michigan, has announced an expansion of its series-production battery management system (BMS) program with a global original equipment manufacturer. BorgWarner has been supplying the BMS to this customer since 2023, and the expanded program will support additional B-segment and C-segment passenger cars and light commercial vehicles (LCVs) for battery-electric vehicle (BEV) and plug-in hybrid electric vehicle applications, starting in 2029. Stefan Demm...
    GlobalFoundries reports FY'2025 revenue at $6.80 billion, up 1% YOY
    GlobalFoundries has reported fiscal year 2025 revenue at $6.80 billion, up 1% year over year, for the fiscal year ended Dec. 31, 2025. The company reported net income of $888 million for the year. The Non-IFRS adjusted EBITDA for the year was $2.36 billion. Net cash provided by operating activities for the year totaled $1.73 billion. In the fourth quarter of 2025, the company reported revenue of $1.83 billion, with a gross margin of 27.8%. GlobalFoundries recorded a net income ...
    STMicroelectronics launches Stellar P3E automotive microcontroller with AI acceleration
    STMicroelectronics has introduced the Stellar P3E, an advanced automotive microcontroller featuring AI acceleration for edge intelligence. This microcontroller unit (MCU) is designed for software-defined vehicles (SDVs), facilitating the integration of multifunction X-in-1 electronic control units, helping to reduce system cost and complexity. The Stellar P3E stands out due to its embedded ST Neural-ART Accelerator, which allows for efficient real-time AI processing, being the first in the autom...
    Arrow Electronics launches initiative for next-gen vehicle E/E architecture development
    Arrow Electronics has introduced a strategic initiative and research hub to facilitate the development of next-generation vehicle electrical and electronic (E/E) architecture. The initiative aims to provide automakers and tier 1 suppliers with engineering expertise and supply chain support as the industry shifts toward software-defined vehicles (SDVs). E/E architecture represents a shift from distributed computing, where separate computers manage individual features, to centralized systems that ...
    Mahindra selects Mobileye's ADAS for six upcoming models
    Mahindra & Mahindra has selected Mobileye's SuperVision and Surround advanced driver assistance systems for six upcoming vehicle models, with production anticipated to start in 2027. The program will utilize Mobileye's EyeQ6 High system-on-chip and will include multiple Mahindra models set to launch in India and other markets, with Mobileye serving as a tier 1 supplier. Both ADAS solutions will integrate various functions, such as perception, Road Experience Management (REM) intelligence and...
    Ouster acquires StereoLabs to enhance unified sensing platform for physical AI
    Ouster, a company specializing in sensing and perception for physical AI, announced that it completed the acquisition of StereoLabs SAS on Feb. 4. StereoLabs, known for its AI vision and perception solutions, has provided 3D vision systems since 2010, shipping over 90,000 ZED cameras to a customer base exceeding 10,000, and is supported by a broad developer community. With this acquisition, Ouster introduces physical AI's first unified sensing and perception platform, integrating digital lidar, ...
    AutoTechInsight Weekly - 9 February 2026
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    Nearly half of auto parts exports from India to US to attract zero duty, says Indian Minister of Commerce and Industry
    The bilateral trade agreement finalized between India and the US will see nearly half of auto parts exported to the US attracting zero duty, Autocar Professional reported, citing Indian Minister of Commerce and Industry Piyush Goyal. “Some auto parts exports will attract zero duty, while others will face an 18% tariff. Around 50% of exports will be duty-free,” Goyal said on Feb. 7.   Before the deal, Indian auto component exports to the US were subject to an average tariff of about&n...
    Foxconn opens EV technology R&D center in mainland China
    Taiwanese technology company Foxconn has started operations at its new research and development center focused on electric vehicles and associated technologies in Zhengzhou, located in mainland China. The local government announced that the facility is positioned close to BYD's factory in Zhengzhou and will concentrate on advancements in next-generation electric and electrical architecture, as well as smart driving technology. Li Guangyao, the general manager of a Henan, mainland China-bas...
    Qualcomm reports Q1 2026 revenue at $12.25 billion, rises 5% YOY
    Qualcomm Inc. reported its first quarter fiscal year 2026 revenue of $12.25 billion, representing a 5% year-over-year increase from $11.67 billion in the first quarter of fiscal year 2025. The company’s QCT Automotive segment delivered record quarterly revenue of $1.1 billion, marking a 15% year-over-year growth. Qualcomm also reported net income of $3 billion for the quarter. The company expects its second-quarter fiscal year 2026 revenue to range from $10.2 billion to $11.0 billion...
    Microchip Technology partners with Hyundai Motor Group for advanced in-vehicle network solutions
    Microchip Technology has announced a collaboration with Hyundai Motor Group to explore the use of advanced in-vehicle network solutions based on the 10BASE-T1S Single Pair Ethernet (SPE) technology. This partnership aims to develop more efficient and scalable vehicle architectures to meet the evolving demands of future mobility. The need for high-performance in-vehicle networks is driven by the rapid advancement of advanced driver assistance systems and connected vehicle features. SPE serves as ...
    VeriSilicon unveils enhanced ISP8200-FS series for advanced automotive camera systems
    VeriSilicon has announced enhanced versions of its image signal processing (ISP) IP ISP8200-FS series, namely ISP8200-ES and ISP8200L-ES, which offer improved performance and energy efficiency for complex automotive camera systems. These enhancements have achieved ISO 26262 ASIL-B functional safety certifications from TÜV NORD, underscoring their reliability for advanced driver assistance systems and autonomous driving applications. The enhanced ISP8200-FS series IP can operate up to 1.2 G...
    Valeo and Anritsu collaborate to accelerate digital twin validation for SDVs
    Valeo and Anritsu have announced a collaboration to develop virtual validation capabilities for software-defined vehicles. This endeavor aims to transform software development within vehicle domains, such as the telematics unit, to create a more cost-effective and forward-looking process. A live demonstration of their work will be presented at MWC2026 in Barcelona. The automotive industry is transitioning toward in-vehicle software-defined architectures, emphasizing the importance of cellular co...
    Cox Automotive and UVeye launch AI vehicle inspection technology for dealers
    Cox Automotive's vAuto has integrated with AI inspection specialist UVeye to enhance vehicle inspections within dealership workflows. This integration, operational at select dealerships such as Brickell Chrysler Dodge Jeep Ram in Miami, utilizes UVeye's high-speed scanners to quickly gather data on a vehicle's exterior, underbody and tire conditions. The data is then seamlessly integrated into vAuto's appraisal and inventory systems, allowing dealers to assess trade-ins more efficiently whi...
    QNX and HaleyTek power software-defined audio in new Volvo EX60
    BlackBerry's QNX division and HaleyTek have partnered to introduce a fully software-defined audio (SDA) system in the upcoming Volvo EX60 electric sport utility vehicle. This initiative is part of Volvo Cars' Superset tech stack strategy, aimed at transitioning vehicle functions from hardware-centric to software-driven architectures, beginning with the EX60's SPA3 infotainment platform. Unlike traditional audio systems with dedicated digital signal processors in amplifiers, the new SDA system ce...
    Heilind Electronics adds Molex high-speed FAKRA-mini system to automotive connectivity solutions
    Heilind Electronics has announced the addition of the Molex High-Speed FAKRA-Mini (HFM) Interconnect System to its portfolio of automotive connectivity solutions. This system is designed to meet the growing demands of modern vehicle electronics by providing high-speed transmission of up to 28 Gbps and frequencies up to 20 GHz, all within a compact form factor well-suited to space-constrained automotive architectures. As vehicles increasingly integrate sensors, cameras and other electronic module...
    Honda partners with Mythic to develop AI-enhanced system-on-a-chip for software-defined vehicles
    Honda Motor has announced a collaboration with Mythic, a technology company based in Texas, US, to codevelop a system-on-a-chip (SoC) for Honda's software-defined vehicles (SDVs). Honda has invested in Mythic due to its original technologies and proven expertise in enhancing the computing performance and energy efficiency of AI used in automated driving and other vehicle features. Specifically, Honda R&D., the research and development subsidiary of Honda, will partner with Mythic in the deve...
    Texas Instruments to acquire Silicon Labs for $7.5B to enhance embedded wireless connectivity solutions
    Texas Instruments, a global semiconductor company, has announced a definitive agreement to acquire Silicon Labs, known for its secure, intelligent wireless technology, for $231.00 per share in an all-cash transaction, valued at approximately $7.5 billion. This acquisition aims to enhance Texas Instruments' capabilities in embedded wireless connectivity solutions by integrating Silicon Labs' mixed-signal solutions with its own analog and embedded processing technology. The merger will leverage...
    Ford and Geely are in talks to collaborate on manufacturing and technology
    Ford Motor and Geely Auto are in discussions about a potential partnership to share the costs of technology and manufacturing. Geely may use Ford's European factory to produce vehicles for the European market, according to a Reuters report. Additionally, the companies are considering a framework for sharing automotive technologies, including autonomous driving. Progress on the European manufacturing negotiations appears to be smoother, with Ford's plant in Valencia, Spain, likely being con...
    Lear reports Q4 and full-year 2025 results; issues 2026 outlook
    On Feb. 4, Lear Corp. reported financial results for the fourth quarter and full year ended Dec. 31, 2025. In the fourth quarter, the US-based supplier of seats and electrical systems (E-Systems) recorded a 5% year-over-year increase in net sales to $6 billion. Higher sales were supported by new business across both segments — Seating and E-Systems — and commercial recoveries, but were partly offset by lower production on key platforms. The company recorded core operating earnings of $259 mi...
    Ecarx debuts preproduction sample of Zenith computing platform
    Mobility technology provider Ecarx Holdings introduced a preproduction sample of its innovative Zenith computing platform at the Consumer Electronics Show (CES) 2026, held recently in Las Vegas. This new platform, designed in collaboration with Qualcomm Technologies, utilizes the Snapdragon Elite SA8797 platform for automotive and offers an integrated high-performance intelligent cockpit and advanced driver assistance system architecture. The platform supports Android 16, Google Automotive Servi...
    NXP reports FY 2025 revenue at $12.27 billion, down 3% YOY
    NXP Semiconductors reported its fiscal year 2025 revenue at $12.27 billion, marking a 3% year-over-year decline from $12.67 billion in the previous year. The company posted net income of $3.0 billion for the year. In the fourth quarter, NXP recorded a 7% year-over-year increase in revenue, totaling $3.34 billion.  Automotive remained the core growth pillar, generating $7.1 billion in revenue in 2025, and NXP targets expanding its automotive business to $9.5 billion by 2027, underscoring ...
    STMicroelectronics completes acquisition of NXP's micro-electromechanical systems sensors business
    STMicroelectronics has finalized its acquisition of NXP Semiconductors' micro-electromechanical systems (MEMS) sensors business, a deal first announced in July 2025, which has now gained full regulatory approval. This acquisition enhances STMicroelectronics' global capabilities in automotive safety products and industrial application sensors. The company anticipates that this acquired business will contribute in the mid-40 million dollar range to its revenue in the first quarter of 2026. The tra...
    Infineon acquires non-optical sensor portfolio from ams OSRAM for €570 million
    Infineon Technologies has entered into an agreement to acquire ams OSRAM's non-optical analog and mixed-signal sensor portfolio, valued at €570 million. This acquisition aims to fortify Infineon's presence in the automotive, industrial and medical sensor markets. The deal, set to close in the second quarter of 2026, involves taking over a fabless sensor business, including products, intellectual property, research and development capabilities, and necessary equipment. It also involves the tran...
    Diodes Inc. unveils automotive-compliant MIPI D-PHY ReDriver for enhanced ADAS performance
    Diodes Inc. has announced the release of the automotive-compliant PI2MEQX2505Q, a 1.8-V, 2.5-Gbps MIPI D-PHY ReDriver with four differential data lanes and one clock lane. This device is designed for the MIPI D-PHY 1.2 protocol and regenerates D-PHY signaling in channels involving printed circuit board (PCB) traces, connectors and cables to ensure optimal electrical performance from CSI-2/DSI sources to sinks, compensating for frequency loss. The PI2MEQX2505Q supports data rates up to 2.5 Gbps, ...
    Indian supplier association ACMA welcomes bilateral trade deal reached between India and US
    On Feb. 2, India and the US finalized the long-awaited bilateral trade deal after nearly a year of prolonged negotiations and multiple rounds of talks. The agreement will see the US reduce import tariffs on Indian goods to 18% from 50% currently, providing relief to Indian exporters. In return, India will reduce tariffs and nontariff barriers on US goods to zero. In addition, India has agreed to purchase more than $500 billion worth of US energy, technolog...
    DENSO reports 3.9% YOY growth in nine-month FY'25/26 revenue; operating profit down 6.4%
    DENSO has announced financial results for the nine-month period ending Dec. 31, 2025, reporting a 3.9% year-over-year increase in consolidated revenue to ¥5.5 trillion (about $35.2 billion). Despite higher revenue, the Japan-based company recorded a 6.4% year-over-year decline in consolidated operating profit to ¥375.9 billion and a 12.5% year-over-year drop in consolidated profit attributable to owners of the parent company to ¥273.7 billion. In Japan, DENSO’s r...
    Stoneridge sells Control Devices business to US-based private equity firm Center Rock for $59 million
    Stoneridge has completed the sale of its Control Devices business to an affiliate of the US-based private equity firm Center Rock Capital Partners. The transaction, which closed on Jan. 30, included a base purchase price of $59 million. The divested business line offers a full range of control modules, including door, interior and chassis control modules, for various vehicle architectures and original equipment manufacturers. Stoneridge plans to use the...
    CES 2026: Key technology highlights in E/E and semiconductor domain
    The first Consumer Electronics Show kicked off in 1967, with 250 exhibitors and 17,500 attendees in New York City. Since then, CES has grown more than tenfold and now encompasses both traditional and nontraditional tech industries. CES 2026 was held in Las Vegas, on Jan. 6-9, 2026, with attendance reportedly reaching 148,000. Key trends Silicon enters the 3-nanometer (nm) era: CES 2026 highlighted a decisive step change in automotive computing power, with 3-nm-class semiconductors enabl...
    BMW partners with BlackBerry to integrate QNX software into next-generation vehicle platform
    BMW is partnering with BlackBerry to integrate QNX software into its next-generation vehicle platform. This agreement involves embedding BlackBerry's real-time operating system and AI capabilities into BMW's foundational vehicle architecture, enhancing BlackBerry's role in the automotive software sector and strengthening its relationship with a major automaker. This partnership underlines BlackBerry's shift from consumer hardware to a focus on safety-critical software for vehicles, leveraging fe...
    Hyundai Mobis secures record new business orders from non-Hyundai Motor Group customers worth $9.17 billion in 2025
    In 2025, Hyundai Mobis won new business orders worth $9.17 billion from global automakers, excluding Hyundai Motor Group, which owns Hyundai Motor and Kia, surpassing its own target by 23%. This achievement was driven by substantial new orders for electrification components, an expanded supply of high-value-added electronic components, and proactive market entry into emerging economies such as mainland China and India. These results are notable given the revisions many global automakers hav...
    Elon Musk proposes TeraFab to secure Tesla's semiconductor supply chain
    Elon Musk, Tesla's CEO, has emphasized the need for the company to establish a TeraFab, a large-scale semiconductor manufacturing facility in the US that produces logic chips, memory and packaging. This initiative is aimed at addressing anticipated supply constraints over the next three to four years. During Tesla's earnings call on Jan. 28, Musk expressed concerns that suppliers such as TSMC, Samsung Electronics and Micron Technology are unable to meet Tesla's chip requirements. Musk ...
    AutoTechInsight Weekly - 2 February 2026
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    Microchip technology expands maXTouch M1 family for improved automotive touchscreens
    Microchip Technology has expanded its maXTouch M1 family of touchscreen controllers to enhance touch detection in automotive displays. This expansion includes the ATMXT3072M1-HC and ATMXT288M1 products, which accommodate a range of display sizes from widescreen formats up to 42 inches to smaller screens between 2 and 5 inches. The controllers support technologies such as organic light-emitting diodes (next-generation display technology OLEDs) and microLEDs, utilizing Microchip's proprietary Smar...
    NVIDIA to power Mercedes-Benz S-Class robo-taxis
    NVIDIA will provide its DRIVE Hyperion architecture and full-stack DRIVE AV Level 4 software for the new Mercedes-Benz S-Class, specifically designed to support robo-taxi operations. These vehicles will be accessible to riders through Uber's mobility network, as part of NVIDIA's previously announced partnership with the ride-hailing company. The DRIVE Hyperion platform integrates diverse sensors, including cameras, radar and lidar, alongside redundant compute systems, with NVIDIA's Halos safety ...
    Repairify and Opus IVS collaborate to boost automotive diagnostics
    Repairify's diagnostics brands, asTech and BlueDriver, along with Opus IVS, have announced their intention to combine efforts to accelerate innovation in the automotive diagnostics industry. This merger aims to integrate complementary technologies, extensive technical expertise and a talented workforce to help repairers efficiently service complex vehicles. With the evolution of automotive technology and the growing demand for accurate diagnostics and advanced driver assistance system calibratio...
    Hyundai Mobis reports 6.8% year-over-year increase in 2025 revenue to $42.4 billion
    Hyundai Mobis has reported strong growth in revenue and profit in the financial year ended Dec. 31, 2025. The leading automotive supplier from South Korea recorded a 6.8% year-over-year increase in revenue to 61.1 trillion won (nearly $42.4 billion), driving a 9.2% year-over-year increase in operating profit to 3.3 trillion won. Apart from higher revenue, Hyundai Mobis benefited from companywide cost control, which helped it to offset the impact of US tariffs. However, the company concluded the ...
    SK Keyfoundry unveils 4th-gen high-voltage BCD process for enhanced power efficiency
    SK Keyfoundry, an 8-inch pure-play foundry based in South Korea, has launched its 4th-generation 200-V high-voltage 0.18-micron Bipolar-CMOS-DMOS (BCD) process. This new process is set to begin full-scale product development with major domestic and global customers and aims for mass production within the year. As the electrification of vehicles and the expansion of AI data centers progress, the demand for high-voltage, high-efficiency power semiconductors is increasing. Automotive electrical arc...
    Forvia appoints Yves Dumoulin as executive vice president of Faurecia Clarion Electronics
    Forvia has announced the appointment of Yves Dumoulin as executive vice president of Faurecia Clarion Electronics, effective Jan. 19. Dumoulin has also joined Forvia's executive committee. In his new role, he will report directly to Forvia CEO Martin Fischer. Dumoulin replaced Jim Chang, who led the business group for slightly more than a year. Dumoulin has been with Forvia since 2016, holding various leadership roles across different regions and business divisions. Dumoulin most recently ser...
    Volkswagen Group China starts producing vehicles based on locally developed zonal electronic architecture
    Volkswagen Group China has delivered its China Electronic Architecture (CEA) on schedule, laying the foundation for the successful start of production of its first CEA-based model, the VW ID. UNYX 07. The product marks Volkswagen Group’s entry into full-cycle software-defined vehicle (SDV) production in China, for China. In 2026, the Group will present four additional models across all Volkswagen brand joint ventures in China, built on the new architecture. With the delivery of the CEA, Vol...
    Innoviz Technologies unveils InnovizSMART for smart applications with advanced lidar capabilities
    Innoviz Technologies announced the release of InnovizSMART, a ready-to-buy lidar solution tailored for various smart applications. InnovizSMART features high-resolution 3D point cloud detection, low power consumption and ease of installation, making it suitable for applications such as perimeter security, traffic management and robotics. The product is fully industrialized, allowing global partners to utilize an automotive-grade sensor with short lead times to meet current and ant...
    QCraft launches next-gen over 500 TOPS autonomous driving solution
    QCraft has commenced the year with QCraft Day 2026, showcasing its advancements and objectives in the autonomous driving sector to over 200 industry guests in Beijing on Jan. 23. During the event, the company highlighted its achievements in mass production, development and deployment, as well as its plans for further expansion. James Yu, co-founder, chairman and CEO of QCraft, delivered a keynote speech titled "Bringing Autonomous Driving into Real Life," describing 2026 as the start of a t...
    ROHM launches UCR10C series shunt resistors for automotive application
    ROHM has introduced a new series of sintered-metal shunt resistors, the UCR10C Series, aimed at addressing the growing power and reliability demands in automotive and industrial current-sensing applications. The series has the highest-rated power for 2012-size shunt resistors, offering resistance values from 10 milliohm (mΩ) to 100 mΩ. These components are available with ratings of 1.0 W and 1.25 W, nearly doubling the power-handling capabilities compared to similar products in the same f...
    Tenstorrent joins EU's CHASSIS program for software-defined mobility innovation
    Tenstorrent, a US-based company specializing in building computers for AI, has announced its participation in the CHASSIS program, a three-year international research initiative in the EU focused on software-defined mobility projects. The key members of the consortium include Arteris, Axelera AI, BMW Group, Bosch, Fraunhofer, Imec, Infineon, Menta, NXP, Renault/Ampere, Siemens, Stellantis-CRF and TTTech-Auto. Within the consortium, Tenstorrent will focus on developing chiplet-based hardware...
    Motherson Group expands operations in Hungary with €95.4 million investment
    Samvardhana Motherson International Ltd., an India-based automotive supplier also known as Motherson Group, is expanding its operations in Hungary through several investments, including a research and development program and the establishment of a regional services center. The company’s €54 million R&D project focuses on AI-based sensors and advanced visual systems integrated into rearview mirrors. The investment is set to create 55 new jobs for automotive product development professi...
    AutoTechInsight Weekly - 26 January 2026
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    Ethernovia secures over $90 million in Series-B funding led by Maverick Silicon
    Ethernovia, a semiconductor startup specializing in Ethernet-based, packet processor-centric networking solutions for software-defined autonomy in vehicles, robots and intelligent machines, has announced the completion of a Series-B funding round exceeding $90 million. This round was led by Maverick Silicon, with contributions from Socratic Partners, Conduit Capital, CDIB-TEN Capital, and existing investors such as Porsche SE, Qualcomm Ventures and Fall Line Capital. Ethernovia is focused on ...
    Toshiba partners with Mikroe to enhance SmartMCD TB9M001FTG board for automotive use
    Toshiba Electronics Europe has collaborated with Mikroe to incorporate its SmartMCD technology for dual brushed DC motors into the SmartMCD TB9M001FTG board. This partnership aims to assist automotive system engineers in designing the TB9M001FTG smart motor control driver, which is applicable to automotive components such as electric sunroofs, windshield wipers, powered windows and adjustable seats, thereby simplifying the prototyping stage. The SmartMCD device adheres to AEC-Q100 (Grade...
    SK Hynix receives ASIL-D certification for LPDDR5X automotive DRAM from TÜV SÜD
    SK Hynix has received the Automotive Safety Integrity Level-D (ASIL-D) certification for its LPDDR5X automotive dynamic RAM (DRAM), the highest safety rating under the ISO 26262 standard for functional safety in vehicles. This certification, granted by TÜV SÜD, a global functional safety certification body, involves a thorough assessment of the development and production framework, encompassing the development process, product design, verification and quality management systems. With this achi...
    Qualcomm and Google expand collaboration to deliver AI-powered mobility solutions
    Qualcomm Technologies and Google have expanded their decade-long collaboration in the automotive industry, aiming to revolutionize the sector with innovative, AI-driven solutions. This partnership integrates Qualcomm's Snapdragon Digital Chassis technology with Google's automotive software to create advanced vehicles capable of adapting to drivers' needs. The collaboration focuses on delivering scalable AI experiences to millions of vehicles, starting with the pioneering work in Snapdragon-power...
    AutoTechInsight Weekly - 19 January 2026
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    Volvo to introduce Google Gemini with new all-electric EX60
    Volvo Cars is preparing to unveil the fully electric EX60 — a midsize sport utility vehicle that introduces a new era of human-centric, AI-powered mobility. The EX60 is the first Volvo designed to launch with Gemini, Google’s AI assistant, enabling truly natural, conversational interaction with the car. Set to make its global debut on Jan. 21, the EX60 combines cutting-edge AI, advanced computing and seamless software integration to make driving safer, easier and more intuitive. Every e...
    CES 2026 Spotlights Automotive Technology, from AI to Software-Defined Vehicles
    CES 2026 marked a clear shift in the automotive industry’s priorities. With demand for electric vehicles (EVs) softening and regulatory and cost pressures mounting, automakers and suppliers used the CES tech conference to emphasize automotive technology like artificial intelligence (AI) rather than electrification. Their focus moved to so-called physical and context-aware AI—systems that interpret real-world conditions in real time—positioning cars as software-defined vehicles rather than ...
    Silicon Storage Technology and United Microelectronics Corp. release automotive-grade embedded SuperFlash on 28HPC+ platform
    Silicon Storage Technology (SST), a subsidiary of Microchip Technology Inc., in collaboration with United Microelectronics Corp. (UMC), announced the completion of the full qualification and release of SST's embedded SuperFlash Gen 4 (ESF4) with automotive-grade 1 (AG1) capability on UMC's 28HPC+ foundry process platform. The partnership between SST and UMC focused on enhancing embedded non-volatile memory (eNVM) performance for automotive controllers, while reducing the number of additional mas...
    Schaeffler leads ReDriveS research project for circular use of electric-axle drives
    Schaeffler is leading the ReDriveS research project, which is funded by the German Federal Ministry for Economic Affairs and Energy. This initiative aims to develop an industrial, automated, scalable and non-destructive recycling concept for electric-axle drives. The ReDriveS project seeks to provide a technological edge in complying with statutory recycling requirements while ensuring cost-effective access to high-value materials in the future. Collaborating with 25 partners from industry...
    CES 2026: Autolink unveils first Deep Fusion EEA
    At the Consumer Electronics Show (CES) 2026, held earlier in January in Las Vegas, Autolink announced the world's first Deep Fusion Electronic/Electric Architecture (EEA), representing a significant advancement in the field of intelligent vehicle technology. The architecture is described as the automotive industry's first fully unified integration of central compute, zonal control and high-bandwidth in-vehicle optical communication. It serves as a platform for advanced driver intelligence, incor...
    DENSO invests $69 million in new logistics center in Lebanon, Tennessee
    DENSO plans to invest $69 million in constructing an advanced logistics center in Lebanon, Tennessee, which will retain 100 jobs in the area and enhance the company's operations and competitiveness in North America. The 280,000-square-foot facility is scheduled to begin construction in summer 2026 and open in spring 2027, replacing DENSO's current Wilson County, Tennessee, operations with a larger, technologically advanced space. The phased transition will ensure continuity for DENSO's workforce...
    BMW and Qualcomm introduce Ride Pilot ADAS for third-party automakers
    BMW and Qualcomm have collaborated to create an advanced driver assistance system known as Ride Pilot, which is now available for use by third-party automakers. Qualcomm Europe President Enrico Salvatori confirmed the existence of additional customers for the system during a discussion at the Consumer Electronics Show (CES) 2026, though specific details on these customers or a timeline for their announcement were not provided.  Qualcomm and BMW have been in talks with various automakers ...
    CES 2026: SmartEye and Green Hills Software collaborate for driver monitoring system
    At the Consumer Electronics Show (CES) 2026 in Las Vegas, Smart Eye and Green Hills Software jointly demonstrated how driver monitoring systems (DMS) can be integrated into automotive software-defined vehicle architectures. The collaboration provides a foundation for original equipment manufacturers and tier 1 suppliers aiming to develop and deploy secure DMS efficiently. The solution assists automakers in reducing integration complexity, shortening validation cycles, and complying with safety a...
    Forvia Hella partners with NXP Semiconductors to enhance automotive radar technology
    Forvia Hella, an international automotive supplier, is collaborating with NXP Semiconductors to advance high-resolution radar technology. This collaboration was announced during the Consumer Electronics Show (CES) in Las Vegas. Their joint effort focuses on the latest generation of high-resolution radar sensors, known as ForWave7HD, which feature up to 32 transmission and receive channels each. These ForWave7HD radar sensors are crucial for automated driving at SAE Level 2+ and Level 3. ...
    CES 2026: Garmin unveils Nexus automotive-grade high-performance compute platform with Qualcomm
    At the Consumer Electronics Show (CES) 2026 held in Las Vegas, Garmin announced the expansion of its collaboration on automotive technology by introducing the Nexus automotive-grade high-performance compute (HPC) platform. This platform, powered by Qualcomm's Snapdragon Elite Platform for automotive, is designed to integrate various vehicle domains, including in-vehicle infotainment, instrument clusters and advanced driver assistance systems into a cohesive system. Scheduled for programs star...
    Autolink partners with ReinOCS for in-vehicle optical-electrical systems
    Autolink, a mainland China-based technology company specializing in next-generation automotive electronic/electrical (E/E) systems, announced a strategic partnership with ReinOCS at the Consumer Electronics Show (CES) 2026 held in Las Vegas. Through a long-term cooperation agreement, Autolink's Deep Fusion EEA — an optical-electrical integrated E/E architecture — will serve as the foundation for joint solutions in intelligent vehicles. Deep Fusion EEA integrates centralized computing, zonal ...
    ZF collaborates with Qualcomm for advanced scalable ADAS solution
    ZF and Qualcomm Technologies have announced a collaboration to create an advanced and scalable advanced driver assistance system solution, integrating Qualcomm's Snapdragon Ride system-on-chips (SoCs) with ZF's ProAI supercomputer. This partnership aims to provide a platform for automated driving, offering automakers the ability to deploy scalable ADAS solutions across various vehicle types and automation levels, up to Level 3. The Snapdragon Ride enables the ZF ProAI supercomputer to serve...
    Honda diversifies chip supply chain amid past shortages and reliance on Chinese suppliers
    Honda is taking steps to diversify its semiconductor procurement from both domestic and international suppliers to mitigate the risk of another shortage that previously led to significant operating profit losses late in 2025. Starting January 2026, the automaker will incorporate these new supplies into its mass-produced vehicles. The decision follows a production halt in the US and China, which was triggered by a temporary supply cutoff from Chinese-owned Nexperia due to a standoff with the Dutc...
    CES 2026: NVIDIA unveils Alpamayo family to advance autonomous vehicle development
    NVIDIA has introduced the NVIDIA Alpamayo family of open AI models, simulation tools and datasets to enhance the development of autonomous vehicles with a focus on safe, reasoning-based functionality. Autonomous vehicles face challenges in managing a wide array of driving conditions, particularly rare and complex scenarios known as the "long tail". Traditional autonomous vehicle architectures often separate perception and planning, which can limit effectiveness in novel situations...
    CES 2026: Skyworks showcases intelligent connectivity innovations for automotive
    Skyworks Solutions showcased its expanded lineup of automotive-grade solutions, which enhance connectivity and electrification, at the Consumer Electronics Show (CES) 2026. Its products, such as the V2X Front-End Modules and Notch Filters, improve real-time road awareness and support autonomous vehicles. The SKY5A2110 GNSS L1 + L5 Dual-Frequency Automotive LNA FEM offers faster satellite positioning with robust interference immunity, supporting advanced navigation systems. Furthermore, S...
    CES 2026: FIH showcases advanced high-performance computing platform for software-defined vehicles
    FIH, a subsidiary of Hon Hai Technology Group (Foxconn), participated in the Consumer Electronics Show (CES) 2026 under the theme Driving the Future of Smart Mobility. The company exhibited its core automotive electronics solutions, including high-performance computing (HPC) platforms, in-vehicle infotainment (IVI) systems, advanced driver assistance systems and telematics control units (TCUs). As part of its showcase, FIH introduced an interactive demo vehicle demonstrating the centralized...
    AutoTechInsight Weekly - 12 January 2026
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    Qualcomm to drive infotainment capabilities for RV Tech's SDV architecture
    Volkswagen Group and Qualcomm Technologies have announced a letter of intent (LOI) for a long-term supply agreement to deliver next-generation infotainment and connectivity capabilities powered by the latter's Snapdragon Digital Chassis solutions. Under the intended agreement, Qualcomm Technologies would become Volkswagen Group’s primary technology provider for infotainment system-on-chips (SoCs) supporting the Group’s zonal software-defined vehicle (SDV) architecture, developed fo...
    CES 2026: Visteon showcases production-ready HPC solution on Snapdragon Cockpit Elite Platform
    Visteon Corp. has showcased the production specifications and original equipment manufacturer implementations of its High-Performance Compute (HPC) solution built on the Snapdragon Cockpit Elite platform. Building on the technology collaboration announced with Qualcomm Technologies at Auto Shanghai 2025, Visteon is now demonstrating the solution’s capabilities with leading automotive original equipment manufacturers worldwide. As the industry transitions toward centralized and zonal archite...
    CES 2026: ThunderSoft announces AquaDrive OS 2.0 Pre AI-native vehicle operating system
    At the Consumer Electronics Show (CES) 2026, ThunderSoft announced AquaDrive OS 2.0 Pre, the latest evolution of its AI-native vehicle operating system designed to accelerate the industry’s transition toward AI-defined vehicles. Unveiled under the theme AI-Native. Road-Ready, AquaDrive OS 2.0 Pre is built around three core pillars: A unified in-vehicle experience, AI-native intelligence by design, and faster readiness for mass production. The platform establishes a new foun...
    Porsche deploys AI to reduce switching losses in power transistors by up to 95%
    Porsche Engineering is deploying AI (AI tools) to reduce switching losses in power transistors by up to 95%. The potential for reducing losses in electric vehicle inverters through intelligent actuation of power transistors can directly enhance the efficiency and range of EVs. Power transistors within inverters experience line losses and switching losses. These losses can be minimized using intelligent soft-switching techniques, particularly zero-voltage switching (ZVS), which reduces&nb...
    Infineon partners with HL Klemove to advance automotive technology and autonomous driving
    Infineon Technologies and HL Klemove have signed a memorandum of understanding to enhance their strategic collaboration in automotive technologies. The partnership is focused on combining Infineon's expertise in semiconductors with HL Klemove's advanced autonomous driving systems to innovate vehicle electronic architecture for the software-defined vehicle era and advance autonomous driving technologies. The partnership will focus on developing next-generation zonal control units, with Infineo...
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