Filters
Your Selections
    Reset
    Save Cancel
    Asset
    Published
    Vehicle Domain
    Topical Categories
    Supplier
    OEM
    Region / Country/Territory
    FISITA World Mobility Conference 2025: Key themes and concerns for the automotive industry
    One thing is abundantly clear after the FISITA World Mobility Conference (WMC) last week. Megatrends impact everything. No longer can chassis development, braking, safety validation and so forth stand alone without impact from the broader drive towards electrification, the AI revolution or SDVs, to name a few.  The event’s sessions gave the impression that electrification is already baked into the industry, particularly in Europe where the debate on (regulation-pushed) direction is ...
    Insights
    Beyond horsepower: Compute becomes the new competitive edge for OEMs
    Automotive compute power is becoming a defining metric of vehicle capability — not just for autonomy, but across cockpit systems, connectivity and life-cycle software deployment. As vehicles transition toward centralized electrical/electronic (E/E) architectures and software-defined platforms, silicon performance is now a core determinant of what a vehicle can do — and how long it will remain competitive in the field. Two metrics have emerged as industry standards for measuring this compu...
    Insights
    Beamr Imaging unveils high-performance video compression solution for autonomous vehicles
    As reported in a press release on June 11, Beamr Imaging is set to launch a new high-performance video compression solution specifically designed for autonomous vehicles at the NVIDIA GTC Paris, part of the Viva Technology 2025 event. This development addresses the substantial video data needs of autonomous vehicles, which generate vast amounts of data. Beamr's technology, known for high-efficiency video compression, offers a solution for managing large volumes of video data used in training aut...
    News
    Zeekr unveils 900-volt high-voltage SEA-S hybrid platform
    Zeekr, a premium EV unit of Geely, has introduced a new hybrid platform named SEA-S and plans to begin pre-sales of its first model based on this platform, the Zeekr 9X, which is a full-size luxury sport utility vehicle (SUV), at the end of next month. Zeekr's SEA-S platform is described as the industry's first luxury hybrid-exclusive platform, built on a pure electric architecture and the world's first full-stack 900V high-voltage hybrid platform. Zeekr's Super Hybrid System, based o...
    News
    Nexperia unveils electrostatic discharge diodes for 48-V automotive data communication networks
    As reported in a press release on July 2, Nexperia has launched a new series of electrostatic discharge (ESD) diodes designed specifically to safeguard 48-V automotive data communication networks from ESD events. This series, which includes six robust AEC-Q101 qualified devices, is intended to handle the higher reverse working maximum voltage (VRWM) needed for the increasingly prevalent 48-V board nets in modern vehicles. The introduction of these diodes ultimately contributes to saving space on...
    News
    LEM introduces DC meters for fast and megawatt charging solutions
    LEM, a specialist in electrical measurement technology, has introduced a new series of DC meters, the DCES600 and DCES1500, designed to facilitate DC charging infrastructure manufacturers in expediting their market delivery of fast and megawatt charging solutions with kilowatt-hour billing services, the company said in a press release on July 2. These meters enhance performance, flexibility and system optimization, making them suitable for applications including e-truck charging. They are cap...
    News
    ZF develops AI-based solution to accurately monitor temperature of electric motors
    ZF has introduced an AI-based solution, called TempAI, that enhances temperature management in electric drives, increasing forecast accuracy by over 15% and therefore allowing for more precise thermal utilization of electric machines. TempAI operates on a platform that quickly generates physically based models from measurement data, requiring minimal computing resources and making it cost-efficient for series production. According to Stefan Sicklinger, head of AI, Digital Engineering ...
    News
    KIST develops carbon nanotube-based lightweight coil for electric motors
    The Korea Institute of Science and Technology (KIST) has developed an innovative electric motor coil using carbon nanotubes (CNTs). The coil does not use copper and therefore is lighter in weight.  Lightweighting is a crucial technical challenge for future transportation technologies, such as electric vehicles, drones and spacecraft, as it enhances battery efficiency and extends range while contributing to sustainability by reducing carbon emissions. Electric motors, which are integ...
    News
    Vishay unveils compact AEC-Q200 qualified thermistor for automotive cooling systems
    In a press release dated July 2, Vishay Intertechnology introduced a new AEC-Q200 qualified negative temperature coefficient (NTC) immersion thermistor, designated as Vishay BCcomponents NTCAIMM66H. This thermistor features a compact design suitable for small spaces in liquid-cooled automotive systems, providing a rapid 1.5-second response time to temperature changes. It is built with a miniature NTC thermistor encased in a stainless-steel 316L housing and lead-free brass, offering traction...
    News
    Seoul Semiconductor's WICOP No-wire technology advances in automotive market
    In a press release on July 2, Seoul Semiconductor announced that its No-wire technology, WICOP, has been utilized in the automotive sector as mini LED displays since May. WICOP is significant for being the first No-wire LED technology, and its entry into the automotive display market is noteworthy due to its high brightness and durability, even under challenging conditions. The technology applied to mini LED displays allows for ultraslim designs, making it suitable for full array local dimmin...
    News
    Murata Manufacturing begins mass production of new high-capacitance MLCC for automotive applications
    Murata Manufacturing Co. Ltd., under the leadership of President Norio Nakajima, has commenced mass production of its new multilayer ceramic capacitor (MLCC), the GCM21BE71H106KE02. This product is notable for being the first in the 0805-inch size to offer a capacitance of 10µF with a 50Vdc rating, specifically designed for automotive applications. This development represents a significant advancement in the field of MLCC design by maintaining capacitance and voltage rating within a reduced pac...
    News
    Continental supplies digital access system for Audi Q6 e-tron
    Continental is providing Audi's new premium Q6 e-tron sport utility vehicle with an advanced access system that includes both a traditional car key and the digital CoSmA intelligent access system. This digital system, which uses highly secure ultra-wideband technology (UWB), allows for vehicle access without needing to physically handle a key or smartphone, though the option to use a physical key remains. The system is compatible with numerous smartphone models from major providers. The Aud...
    News
    Bosch unveils compact Bluetooth-enabled microelectromechanical system sensor for tire pressure monitoring
    Bosch has introduced a highly compact microelectromechanical system (MEMS) sensor, the SMP290, featuring an integrated Bluetooth low energy (BLE) interface for measuring tire pressure in vehicles. The sensor incorporates all critical components required for a tire pressure monitoring system (TPMS), including a microcontroller, Bluetooth interface, two-axis acceleration sensor, and pressure and temperature sensors. The highly integrated sensor is also energy efficient, allowing for an operat...
    News
    EPC introduces EPC9196 high-performance motor drive inverter for medium-voltage applications
    Efficient Power Conversion Corp. (EPC) has introduced the EPC9196, a high-performance 25-amperes-root-mean-square (ARMS), three-phase brushless DC (BLDC) motor drive inverter reference design, as reported in a company press release on June 10. This design is powered by the EPC2304 gallium nitride field-effect transistor (eGaN FET) and is specifically tailored for medium-voltage (96 V-150 V) battery-powered motor drive applications. These applications include steering systems in au...
    News
    Toshiba launches second smart motor control driver for automotive applications
    Toshiba Electronic Devices & Storage Corp. has initiated sample shipments of the TB9M001FTG, the second offering in its Smart Motor Control Driver series, SmartMCD, as reported in a press release on June 23. The microcontroller in the SmartMCD features a relay driver and a Local Interconnect Network (LIN) transceiver function, making it adept at driving relays and controlling two brushed DC motors, particularly in automotive environments. The product addresses the increasing dem...
    News
    Murata launches BLM15VM series for 5G-V2X noise suppression in automotive sector
    As reported in a press release on June 18, Murata Manufacturing is advancing automotive noise suppression technology with its new BLM15VM series of automotive-compliant chip ferrite beads. This series is designed to provide wideband noise suppression for high-frequency 5G vehicle-to-everything (5G-V2X) applications with high impedance. Mass production should begin in July. The automotive sector has seen a rise in high-frequency wireless communication for applications such as navigation, audio...
    News
    Toshiba launches new two-channel digital isolators for automotive applications
    According to a press release on June 18, Toshiba Electronic Devices & Storage Corp. introduced a new series of two-channel high-speed standard digital isolators designed for automotive applications. The DCM32xx00 Series consists of four devices that support stable operation with a high common-mode transient immunity (CMTI) of 100 kV per microsecond (μs) and a high data transmission rate of up to 50 Mbps. These isolators conform to the AEC-Q100 standard, ensuring the safety and reliabil...
    News
    Nissan unveils third-generation 2026 LEAF with enhanced range and innovative features
    Nissan Motor has unveiled the all-new 2026 LEAF, the third generation of its electric vehicle, offering a reimagined design with clean, dynamic body lines and a sport utility vehicle-like stance. The LEAF is set to reach US Nissan dealerships in the fall, with availability expanding to other markets thereafter. The new LEAF will be assembled alongside the Ariya at Nissan's Tochigi plant in Japan for the US and Canada markets. Key features of the vehicle include a new 3-in-1 powertra...
    News
    Rimac Technology collaborates on Bugatti Tourbillon's hybrid hypercar set for 2026 delivery
    Rimac Technology, a tier 1 technology supplier in the automotive industry, has played a significant role in the engineering and design of the Bugatti Tourbillon hyper-sports car by integrating its advanced battery systems, e-axles and electronic control units into the vehicle. The Bugatti Tourbillon, which utilizes Rimac Technology's revolutionary hybrid system, is set for deliveries in 2026 with production limited to 250 units. The Tourbillon showcases Rimac Technology's expertise ...
    News
    Xpeng working to integrate Turing smart driving chip into VW models in China
    Mainland Chinese automaker Xpeng said it has developed chips for autonomous driving that are more powerful than NVIDIA’s products, and it expects Volkswagen (VW) and other rivals to be customers, Financial Times reported June 12. He Xiaopeng, Xpeng’s co-founder and CEO, said it was working to integrate its self-designed Turing AI chip into select Volkswagen car models slated for launch in mainland China in 2026. He added that talks with Volkswagen and other companies about using the chips...
    News
    Kyocera AVX unveils compact antennas for system-in-package applications in automotive
    Kyocera AVX introduced a range of compact and high-performance antennas designed for system-in-package (SiP) applications, as reported in a press release on June 12. These applications are gaining popularity due to their ability to integrate multiple integrated circuits (ICs) in a single package, providing the functionalities of an electronic system, such as processing and memory, in a small, efficient and cost-effective form. The company's new antennas are tailored for SiP modules, offering ...
    News
    Calterah unveils mmWave radar and ultra-wideband technology for mobility applications
    At Calterah Day 2025 on June 6, Calterah announced significant advancements in its mmWave radar chip technology, focusing on imaging radar, advanced driver assistance system radar and emerging short-range radar. The company introduced the Dubhe, the  IEEE 802.15.4ab-compliant ultra-wideband (UWB) system-on-a-chip (SoC) series. The Andes Premium 8T8R Solution, achieved with two cascading Andes RoPTM chips, provides enhanced range detection and stable weak target detection in imaging ...
    News
    LEM releases high-voltage battery sensor that combines shunt and Hall effect technologies
    As reported in a press release on June 11, LEM has introduced a new current sensing unit for battery management in electric vehicles, named the Hybrid Supervising Unit (HSU), which combines shunt and open-loop Hall effect technologies into one component. It is designed to simplify system architecture, enhance safety and enable seamless upgrades without changes to the mechanical layout. In EVs, high-voltage battery management systems (BMS) have a critical role in managing the battery's state o...
    News
    Xpeng unveils G7 SUV with proprietary Turing chip for smart-driving features
    Xpeng, a Chinese automaker, unveiled its first vehicle featuring a proprietary smart-driving chip, marking a step away from reliance on US chipmaker NVIDIA, according to a report published by Nikkei Asia on June 11. The newly introduced G7 sport utility vehicle is equipped with Xpeng's Turing chip, named after the computer science pioneer Alan Turing. This chip is promoted as an enhancement for the company's intelligent cockpit and autonomous driving functionalities. Xpeng Chairman and CEO He...
    News
    VW to build future EVs on Rivian's new R2 platform
    As part of Volkswagen's joint venture with Rivian, VW will use Rivian's upcoming R2 platform for all its future electric vehicles, according to Rivian's Chief Software Officer Wassym Bensaid. Rivian plans for the R2 production to begin in the first half of 2026, with improvements over its predecessor, the R1, making the development process more efficient. The R2 offers a modular and scalable tech stack, allowing Volkswagen brands such as Å KODA and Audi to inco...
    News
    Sony Semiconductor launches IMX479 SPAD depth sensor for automotive Lidar systems
    According to a press release on June 10, Sony Semiconductor Solutions Corp. (SSS) announced the launch of the IMX479 stacked, direct time-of-flight (dToF) SPAD depth sensor designed for automotive Lidar systems, promising high-resolution and high-speed capabilities. This new sensor uses a dToF pixel unit composed of 3×3 SPAD pixels to improve measurement accuracy through a line scan methodology. It features SSS's proprietary device structure, achieving a frame rate of up to 20 frames ...
    News
    Infineon launches inductive sensor for automotive chassis applications
    Infineon Technologies has announced the launch of the XENSIV TLE4802SC16-S0000, an inductive sensor aimed at improving automotive chassis applications. The sensor is capable of conducting high-precision torque and angle measurements while maintaining robust stray field performance. It supports digital output via SENT or SPC protocols and does not require additional shielding. Designed specifically for electric power steering systems, including torque and steering angle sensors, as well as pedal ...
    News
    STMicroelectronics reveals digital automotive audio amplifiers for smart-cockpit applications
    STMicroelectronics (ST) has introduced new class-D automotive audio amplifiers, the HFDA80D and HFDA90D, designed for smart-cockpit applications. These amplifiers are engineered for compact size and feature a digital input to simplify circuit design. They expand ST's range of high-frequency automotive amplifiers and complement the existing HFA80A analog-input integrated circuit. Operating at a switching frequency of 2 MHz, the devices save printed circuit board (PCB) space and reduce materi...
    News
    Minieye partners with Changan Automobile for ADAS domain controllers
    Minieye announced a partnership with Changan Automobile, securing a production program for main models under Changan's self-owned new-energy vehicle brand, according to a report published by SMM on June 6. As the designated supplier, Minieye will provide advanced driver-assistance domain controllers designed to support a comprehensive range of driving scenarios, enhancing safety and convenience for both drivers and passengers in various environments such as highways, urban areas and parking...
    News
    AutoSens US 2025: IntoPIX unveils intelligent image compression advancements for ADAS
    At the upcoming AutoSens US 2025 event in Detroit, intoPIX is set to reveal its latest advancements in intelligent image compression tailored for advanced driver assistance systems and autonomous vehicles. These innovations assist automotive engineers in managing the growing data requirements of next-generation perception systems while maintaining safety, adaptability and cost-effectiveness, according to a press release on June 3. IntoPIX's JPEG XS and TicoRAW technologies provide ultralow la...
    News
    Continental develops sensor technology to reduce use of rare earth in electric motors
    Continental unveiled a pioneering sensor technology, the e-Motor Rotor Temperature Sensor (eRTS), designed for electric vehicles. This technology measures the temperature within permanently excited synchronous motors directly on the rotor, enhancing accuracy from a 15°C tolerance to just 3°C. This precision allows automakers to reduce the usage of rare earth elements (REEs) needed for heat resistance and to potentially boost motor performance, thus supporting sustainability. The eRTS is par...
    News
    STMicroelectronics unveils L9026 8-channel driver for enhanced safety in automotive applications
    STMicroelectronics has introduced the L90268-channel driver, featuring six configurable high-side/low-side outputs and two high-side outputs, catering to space-constrained applications. The L9026 is designed to enhance safety and reliability with its limp-home mode and two extra input pins for fail-safe operation in case of controller failure. It is capable of driving multiple relays, solenoids, LEDs and resistive loads, making it suitable for use in body electronics, climate controls and f...
    News
    Segger extends J-Link support to Allegro MicroSystems' A892XX microcontrollers
    As reported in a press release on May 28, Segger announced the extension of support for its J-Link debug probes to include Allegro MicroSystems's A892XX-series microcontrollers. With this support, users can download programs into and debug Allegro's microcontrollers using Segger's J-Link probes. The support also brings access to the Ozone multiplatform debugger and the Flasher family of professional in-circuit programmers, facilitating production programming and service technician use. A...
    News
    Pioneer India opens new automotive R&D center in Bengaluru
    Pioneer India, a subsidiary of Pioneer Corp., has established a new Research & Development Center in Bengaluru, India. This center will coordinate with Pioneer's global R&D and engineering networks to develop solutions in various areas, including automotive vision and sensing technologies, advanced driver assistance systems, and digital cockpit and human-machine interfaces. It will also focus on cloud-connected infotainment and telematics, AI and mobility data platforms, and connected so...
    News
    Joynext launches ultra-wideband-based child presence detection product for enhanced vehicle safety
    According to a press release on May 26, Joynext has introduced its first child presence detection (CPD) product, utilizing ultra-wideband (UWB) technology, now available on the market. This product will be installed in vehicle models of a notable Japanese joint venture brand to enhance child safety in automobiles. It is one of the initial mass-produced products in China that adhere to the China New Car Assessment Program's (C-NCAP) direct detection requirements for CPD using UWB techno...
    News
    Silanna launches small and efficient laser driver platform
    Silanna Semiconductor launched the FirePower series of laser driver integrated circuits (ICs), designed to reduce the size and increase peak power of light detection and ranging (LiDAR) applications, the company said in a May 21 press release. The FirePower laser driver ICs integrate charging and firing on a single chip, enabling smaller size, reduced losses and fewer components on the printed circuit board (PCB), which decreases the component coun...
    News
    New Xiaomi YU7 gets upgraded E/E architecture, HMI, ADAS and infotainment
    Xiaomi EV has unveiled its first sport utility vehicle, the YU7. Positioned as a high-performance luxury SUV, the YU7 represents a completely reimagined vehicle from the ground up, including refreshed design, cabin comfort, safety and smart capabilities.  To begin, the YU7 has significantly upgraded its electrical/electronic architecture (EEA). It adopts a Four-in-One Domain Control Module, integrating the assisted driving domain (ADD) controller, digital cockpit domain (DCD) controller,...
    News
    NXP launches OrangeBox 2.0 with AI and post-quantum cryptography for software-defined vehicles
    NXP Semiconductors launched OrangeBox 2.0, an advanced automotive-grade development platform that incorporates advanced technologies such as AI, post-quantum cryptography and integrated software-defined networking. These enhancements secure vehicles against evolving cyber threats and facilitate the transition to software-defined vehicles. OrangeBox 2.0 offers a fourfold increase in CPU performance over its predecessor and integrates innovations such as embedded AI acceleration, an Automotive Saf...
    News
    iMotion Automotive forms joint ventures with Delloyd Technology for ADAS production in Malaysia
    According to a report published by Telematics Wire on May 15, iMotion Automotive Technology (Singapore) Pte. Ltd., a subsidiary of iMotion Technology, formed two joint ventures with Delloyd Technology Berhad, a Malaysian automotive component manufacturer. The partnership will establish two entities in Malaysia—one focusing on production and the other on sales of advanced driver assistance systems. The collaboration, announced on iMotion's WeChat, aims to create a localized operational fra...
    News
    NVIDIA plans to launch new AI chip for China, to open new Shanghai research center
    NVIDIA is preparing to launch a new AI chip tailored for the Chinese market in the coming months, as the company navigates increasingly strict US export controls and rising competition from domestic players such as Huawei, Nikkei Asia reported May 17. The new chip, based on NVIDIA’s Hopper architecture, has reportedly been further downgraded to comply with Washington's export regulations. Unlike its global counterparts, the China-bound version will not feature high-bandwidth memory (HBM) â€...
    News
    BOS Semiconductors partners with Intel to boost AI in ADAS and in-vehicle information
    In a press release on April 25, BOS Semiconductors and Intel announced a strategic partnership to enhance AI performance for advanced driver assistance systems and in-vehicle information (IVI). This collaboration is powered by BOS's automotive AI chiplet system-on-a-chip (SoC), Eagle-N, and other products, combined with Intel's AI-enhanced software-defined SoCs. The partnership aims to offer automakers high-performance, high-compute AI solutions that form a robust foundation for in-vehic...
    News
    Vishay Intertechnology extends D2TO35 series with new AEC-Q200 qualified power resistor
    In a press release on May 14, Vishay Intertechnology announced the extension of its D2TO35 series of surface-mount thick-film power resistors with a new AEC-Q200 qualified device capable of higher pulse absorption, up to 15 Joules/0.1 second. This new device, the Vishay Sfernice D2TO35H, is available in the TO-263 (D2PAK) package and provides a high-power dissipation capacity of 35 W at a 25°C case temperature. The newly released automotive-grade device enhances energy absorption by 30% comp...
    News
    LeddarTech launches LeddarSim for enhanced ADAS and autonomous driving simulations
    LeddarTech Holdings Inc., a provider of AI-powered software for advanced driver assistance systems and autonomous driving, announced the launch of LeddarSim, a new simulation platform aimed at bridging the gap between virtual testing and real-world deployment. This platform offers a multimodality neural reconstruction of driving scenarios using inputs from cameras, radar and Lidar sensors, creating a high-fidelity environment for developers to train, test and validate perception models. ...
    News
    Novosense unveils automotive digital isolators for European market
    NOVOSENSE Microelectronics has introduced a new line of third-generation automotive-grade digital isolators with the NSI83xx series. These capacitive-based isolators are designed to enhance electrical overstress resilience and minimize power noise susceptibility, making them well-suited for simplified system-level electromagnetic interference mitigation and maintaining signal integrity in dense, high-frequency silicon carbide (SiC)-based switching environments. The NSI83xx series boasts reinf...
    News
    Infineon unveils CoolGaN bidirectional switch for enhanced power conversion efficiency
    In a May 12 press release, Infineon Technologies announced the CoolGaN bidirectional switch (BDS) 650 V G5, a gallium nitride switch capable of actively blocking voltage and current in both directions. This device, featuring a common-drain design and a double-gate structure, utilizes Infineon's gate injection transistor technology and CoolGaN technology to deliver a monolithic bidirectional switch. It serves as an efficient alternative to traditional back-to-back configurations in converters, ac...
    News
    Korean supplier Roots develops ultracompact phosphor-in-glass technology for smart automotive lighting systems
    Roots, a South Korea-based company specializing in phosphor-in-glass (PiG) products, has developed an ultracompact 450㎛ PiG component optimized for next-generation smart multibeam headlights. This development marks a significant evolution in existing PiG technology, enhancing Roots' competitive edge in the global market. Roots began the development of PiG technology in the mid-2010s using semiconductor processing techniques. The PiG component, a critical optical element, combines phosphor a...
    News
    Cadence introduces Tensilica NeuroEdge 130 AI coprocessor for advanced AI networks
    In a press release dated May 8, Cadence announced the Cadence Tensilica NeuroEdge 130 AI coprocessor (AICP), designed to complement any neural processing unit (NPU). The processor enables seamless execution of advanced AI networks across automotive and other sector systems-on-a-chip (SoCs). Based on the architecture of the Tensilica Vision DSP family, the NeuroEdge 130 AICP provides over 30% area savings and more than 20% savings in dynamic power and energy while maintaining performance. The ...
    News
    AEye's Apollo Lidar sensors enter production phase at LITEON facility in Taiwan
    In a press release on May 7, AEye announced the successful production of its Apollo Lidar sensors from the LITEON manufacturing line in Taipei, Taiwan. This development marks a significant milestone in AEye's efforts to position Apollo for high-volume production. The Apollo Lidar sensors are engineered to detect objects at highway speeds, boasting an impressive range of 1 km, and are intended to set new benchmarks in automotive safety and autonomous mobility performance. LITEON has demonstrat...
    News
    Power Integrations unveils new reference designs for automotive applications using flyback switcher integrated circuits
    In a press release on May 6, Power Integrations announced the release of five new reference designs for automotive applications utilizing their 1,700-V InnoSwitch 3-AQ flyback switcher integrated circuits (ICs). These designs cater to power levels ranging from 16 W to 120 W and are suitable for applications such as DC-DC bus conversion, inverter emergency power, battery management and power supplies for auxiliary systems in automotive. They employ both wound and low-profile planar transformers a...
    News
    Infineon launches trench-based SiC superjunction technology for automotive and industrial applications
    Infineon Technologies AG has introduced a new trench-based silicon carbide (SiC) superjunction (TSJ) technology, aiming to enhance the efficiency and design compactness of electric vehicle and industrial applications. The CoolSiC product line, ranging from 400 V to 3.3 kV, serves diverse applications such as automotive drivetrains, EV charging and solar energy systems. The new TSJ technology combines trench and superjunction design, promising higher performance and reliability. Infineon ...
    News
    Auto Shanghai 2025: Zhuoyu showcases advanced vehicle intelligence solutions
    Shenzhen Zhuoyu Technology Co. Ltd. (Zhuoyu) showcased its latest automotive intelligence solutions at Auto Shanghai 2025, underscoring its commitment to the advancement of next-generation intelligent vehicle development in China. Zhuoyu introduced several technologies, including its flagship Vision-Language-Action (VLA) large model based on NVIDIA DRIVE Thor, an integrated cabin-driving solution powered by Qualcomm's SA8775P, and the proprietary JIMU2.0 sensor. The company also debuted systems ...
    News
    Alpha and Omega Semiconductor launches Gen3 1,200-V alpha silicon carbide MOSFETs for automotive applications
    As reported in a press release on May 1, Alpha and Omega Semiconductor (AOS) has introduced its next-generation (Gen3) 1,200-V alpha silicon carbide metal-oxide-semiconductor field-effect transistor (αSiC MOSFETs), targeting improved efficiency in high-power applications. The Gen3 MOSFETs offer up to 30% better switching figure-of-merit (FOM) compared to previous generations while maintaining low conduction losses, and they possess AEC-Q101 qualification with features such as extended lifetime ...
    News
    Infineon unveils CoolSiC MOSFET 750-V G2 for automotive applications
    Infineon Technologies has introduced its CoolSiC metal-oxide-semiconductor field-effect transistor (MOSFET) 750-V G2 technology aimed at enhancing system efficiency and power density in automotive power conversion setups, according to a press release on April 29. The new MOSFET technology features a diverse portfolio with RDS(on) values reaching up to 60 milliohm at 25°C, suitable for a variety of applications such as onboard chargers, DC-DC converters and auxiliary systems for electric vehi...
    News
    Nexperia offers automotive planar Schottky diodes in CFP2-HP packaging
    In a press release on April 29, Nexperia announced the release of a new portfolio consisting of 16 low forward voltage drop (VF) optimized planar Schottky diodes in CFP2-HP packaging. The portfolio includes eight industrial products and eight AEC-Q101 qualified products. This development caters to the increasing preference among manufacturers for replacing devices in surface mount assembly/B/C-type packaging with chip flat package (CFP)-packaged devices, particularly in automotive applications. ...
    News
    Hesai's AT series powers Cadillac's in-cabin Lidar integration in new VISTIQ SUV
    In a press release on April 25, Hesai announced that its long-range, automotive-grade AT series Lidar has been selected by SAIC-GM for inclusion in Cadillac's new all-electric VISTIQ sport utility vehicle. This announcement was made during the Shanghai Auto Show. The VISTIQ SUV will feature in-cabin Lidar deployment, positioned behind the windshield. The behind-the-windshield Lidar solution was co-developed by Hesai and Cadillac. It incorporates the AT series long-range Lidar within the VISTI...
    News
    Auto Shanghai 2025: MediaTek unveils Dimensity automotive cockpit platform
    At the Auto Shanghai 2025, MediaTek introduced its new flagship platforms, the Dimensity Auto Cockpit Platform C-X1 and Dimensity Auto Connect MT2739. MediaTek, in collaboration with its ecosystem partners, is focusing on enhancing the future of intelligent driving with innovations in AI technology for autonomous vehicles. Mike Chang, corporate vice president at MediaTek, emphasized the significance of intelligent cockpits in differentiating vehicle designs in the software-defined vehicle era. T...
    News
    ROHM develops compact high-heat dissipation silicon carbide power modules
    In a press release on April 24, ROHM has introduced new 4-in-1 and 6-in-1 silicon carbide (SiC) molded modules within the HSDIP20 package, designed specifically for Power Factor Correction (PFC) and LLC converters in the onboard chargers (OBC) of electric vehicles. The product range includes six models rated at 750 V and seven rated at 1,200 V. These modules integrate all fundamental circuits needed for power conversion in high-power applications, thereby reducing the design workload for...
    News
    Auto Shanghai 2025: Neusoft unveils intelligent automotive solutions
    Neusoft Corp. has unveiled its latest advancements at Auto Shanghai 2025, announcing three core product portfolios that enhance intelligent automotive connectivity. These include the Neusoft A³ Cockpit-Driving-Parking Platform, the Neusoft NeuMind Empowerment System and the OneCoreGo Global In-Vehicle Intelligent Mobility Solutions 6.0. The Neusoft A³ Cockpit-Driving-Parking Platform integrates cockpit, instrument cluster, driving and parking features through a single chip, reducing hardw...
    News
    Infineon introduces ASIL-B-compliant XENSIV magnetic switch family for automotive applications
    Infineon Technologies AG announced the XENSIV TLE4960x magnetic switch family, designed to meet the requirements of ISO 26262 for autonomous driving applications. These switches are the only ASIL-B-compliant options available on the market, catering to a variety of automotive applications such as window regulators, sunroof actuators and seat adjustment. In addition to being compliant with automotive safety standards, the switches meet AEC-Q100 qualifications and are suitable for operation i...
    News
    Auto Shanghai 2025: Nullmax showcases advanced MaxDrive solutions for autonomous driving
    The Shanghai International Automobile Industry Exhibition commenced on April 23, featuring Nullmax, an AI technology company focused on automated driving/advanced driver assistance system (ADAS) solutions for various scenarios. Nullmax presented its MaxDrive solutions, developed to cater to the diverse needs of different vehicle models and markets, including active safety features and autonomous driving in urban environments. The MaxDrive solutions are adaptable to multiple chip platforms and se...
    News
    Auto Shanghai 2025: Bosch presents new software and hardware for assisted and automated driving
    At Auto Shanghai 2025, Bosch showcased its comprehensive array of solutions for assisted and automated driving and parking, highlighting a radar sensor developed entirely in-house. The sensor features Bosch's own computing chip, combining high computing power with a small footprint. This sensor is part of Bosch's advanced driver assistance systems product family, which offers a range of software, sensors and services adaptable for different vehicle segments. Bosch aims to enable global...
    News
    Auto Shanghai 2025: Intel unveils second-generation, AI-enhanced system-on-chip
    At Auto Shanghai 2025, Intel introduced its second-generation, AI-enhanced software-defined vehicle (SDV) system-on-chip (SoC), marking its first appearance at the event. This new automotive chip features the industry's first multiprocess node chiplet architecture, aiming to meet the increasing demands for intelligent and connected vehicles by offering scalable performance, advanced AI capabilities and cost-efficiency for automakers. In tandem with this launch, Intel announced new strategic coll...
    News
    Omnivision unveils OX01N1B image sensor for in-cabin driver monitoring systems
    In a press release on April 22, Omnivision announced the new OX01N1B image sensor designed for in-cabin automotive driver monitoring systems (DMS). This sensor is part of Omnivision's Nyxel near-infrared (NIR) technology family and features a 1.5-megapixel RGB-IR or Monochrome BSI global shutter sensor. It has a pixel size of 2.2 microns and an optical format of 1/4.51-inch. The OX01N1B will be showcased at Auto Shanghai from April 23 to May 2, along with Omnivision's ecosystem partners. ...
    News
    Hesai launches 'Infinity Eye' Lidar solution for Level 2 to Level 4 autonomous driving systems
    As reported in a press release on April 21, Hesai announced the launch of Infinity Eye, a new solution for autonomous driving, alongside three next-generation Lidar products â€” the ETX ultralong-range Lidar, the AT1440 ultrahigh-definition Lidar and the FTX fully solid-state blind spot Lidar. The Infinity Eye solution is available in three configurations, each designed for different levels of autonomous driving systems: Level 4, Level 3 and Level 2. Infinity Eye A is aimed at Level...
    News
    Horizon Robotics unveils Horizon SuperDrive urban driving assistance system for mass production
    According to a press release on April 18, Horizon Robotics has introduced the Horizon SuperDrive (HSD) urban driving assistance system for mass production at its 2025 annual product launch event in Shanghai. The event also saw Horizon Robotics collaborating with Chery Automobile to announce that the HSD system will debut globally on Chery's EXEED vehicles in September. This system is based on Horizon's Journey 6 processing hardware and offers a humanlike driving experience. It includes...
    News
    Auto Shanghai 2025: Schaeffler to showcase expanded electrification and intelligent solutions
    Schaeffler is set to participate in Auto Shanghai 2025, showcasing an expanded product portfolio resulting from its merger with Vitesco Technologies. The company plans to demonstrate a diverse range of solutions for electrification, including controllers, power electronics, thermal management systems, electric motors and drives. These solutions extend beyond chassis applications to include developments for the vehicle body, enhancing driving safety, comfort and intelligence. Schaeffler remain...
    News
    Infineon Technologies launches new high-voltage IGBT chips to boost EV performance
    Infineon Technologies AG has launched a new generation of products, including EDT3 (Electric Drive Train, 3rd generation) chips for 400-V and 800-V systems, and reverse-conducting insulated-gate bipolar transistor (RC-IGBT) chips specifically for 800-V systems. These devices are designed to enhance the performance of electric drivetrain systems, making them well-suited for automotive applications, the company announced in a press release on April 16. The EDT3 and RC-IGBT bare d...
    News
    STMicroelectronics launches extensible memory for automotive microcontrollers
    In a press release on April 16, STMicroelectronics has unveiled Stellar with xMemory, a new generation of extensible memory embedded into its Stellar series of automotive microcontrollers. This development aims to simplify the development of software-defined vehicles and electrification platforms by offering a single device with extensible memory, reducing the need to manage multiple devices with varying memory options. This approach helps carmakers future-proof their designs and fosters ad...
    News
    Fraunhofer IZM develops advanced inverter for high EV efficiency
    The Dauerpower inverter, a joint development by Fraunhofer IZM, Porsche AG and Robert Bosch GmbH, represents a significant advancement in the power electronics used within modern electric vehicles. Designed to convert electrical energy from batteries into usable power for engines, this inverter achieves peak efficiencies of 98.7% and is capable of managing approximately 600 kW (815hp) of continuous output, with short bursts up to 720 kW (979hp). This performance not only surpasses that of die...
    News
    Auto Shanghai 2025: Continental to unveil automated driving and light projection tech
    In a press release on April 15, Continental announced that it will highlight its innovations aimed at transforming future mobility through software-defined vehicle technologies, focusing on safety, autonomy and sustainability at Auto Shanghai 2025. During a press conference scheduled for April 23, Philipp von Hirschheydt, an executive board member responsible for the Group Sector Automotive, will reveal the name of an independent Automotive company that will emerge from Continental's planned spi...
    News
    Auto Shanghai 2025: Forvia plans to unveil range of innovative technologies aimed at enhancing mobility experiences
    At the upcoming Shanghai Auto Show, Forvia is set to present a range of innovative technologies aimed at enhancing mobility experiences. Among the innovations to be showcased is the Saphir, a midsize low-body car segment featuring AI-driven advancements designed for comfort, efficiency and freedom during travel. The exhibit will also introduce groundbreaking electronics such as the Electric fuse iConF and the Radar ForWave7e, both by Forvia Hella, which contribute to vehicle safety and autonomou...
    News
    Texas Instruments unveils new automotive Lidar and radar chips
    Texas Instruments (TI) has announced the launch of its latest portfolio in automotive Lidar, clock and radar chips, aiming to enhance vehicle safety and pilot more autonomous features across a broader range of vehicles. This new suite includes the LMH13000, the first integrated high-speed Lidar laser driver in the industry, designed to improve real-time decision-making by delivering ultrafast rise time for longer distance measurements. Additionally, TI introduced the first automotive bulk a...
    News
    Xpeng unveils Turing chip for autonomous driving, set for mass production
    Electric vehicle manufacturer Xpeng has developed its own autonomous driving chip named Turing, set to be mass-produced in the second quarter of 2025. This chip will first be implemented in one of Xpeng's new models. The Turing chip distinguishes itself by being 20% more efficient than general-purpose automotive chips and has the capability to manage large models with up to 30 billion parameters. This chip integrates two neural network processing units designed in-house, specifically tailor...
    News
    STMicroelectronics launches advanced automotive near-field communications readers
    As reported in a press release on April 14, STMicroelectronics has unveiled two new additions to its ST25R portfolio of automotive near-field communications (NFC) readers, the ST25R500 and ST25R501, designed to improve wake-up and detection range for a superior user experience. These new products conform to the Car Connectivity Consortium (CCC) and Wireless Power Consortium (WPC) standards, catering to the needs of digital key and center console applications, including device pairing, engine sta...
    News
    Marelli to unveil new ProZone zone control unit at Auto Shanghai 2025
    As reported in a press release on April 14, Marelli plans to showcase its software-defined vehicle (SDV) technologies at the Auto Shanghai 2025 event, prominently featuring its new ProZone, a midrange zone control unit. The product is designed to consolidate up to three domains, addressing complex, safety-critical functions, including thermal management, chassis control and advanced propulsion. The company will present from April 23 to May 2 at the Shanghai National Exhibition and Convention ...
    News
    Daanaa introduces new power transaction unit
    In a press release on April 10, Daanaa Resolution Inc. introduced its power transaction unit (PTU), a power system that features a high-voltage conversion ratio exceeding 110 times and offers greater than 95% power conversion efficiency across a broad operating range. This real-time programmable, compact module supports bidirectional and multimodal (AC/DC) operations, facilitating the development of energy-efficient systems for original equipment manufacturers in various sectors, including ...
    News
    Vishay Intertechnology expands LTO series with new power resistor
    In a press release on April 9, Vishay Intertechnology has announced the expansion of its LTO series with the introduction of the new AEC-Q200 qualified low-temperature coefficient (LTO) 150H thick film power resistor. This addition to the LTO series stands out for its significant pulse absorption capability, reaching up to 75 joules per 0.1 second, and is designed to be directly mounted on a heatsink through a clip-mount TO-247 package, offering an elevated power dissipation of 150 W at a case t...
    News
    Diodes introduces 12-bit Inter-Integrated Circuit 3D linear Hall-effect sensor for automotive applications
    In a press release on April 8, Diodes Inc. has announced the launch of its first automotive-compliant 3D linear Hall-effect sensor, designated as the AH4930Q. This sensor is capable of detecting magnetic fields in three dimensions — X, Y and Z — facilitating reliable contactless rotary motion and proximity detection. It is suitable for various applications, including rotary and push selectors in infotainment systems, stalk gear shifters, door handles and locks, as well as powered s...
    News
    Sensata Technologies introduces new PyroFuse to improve high-voltage safety
    In a press release on April 8, Sensata Technologies has introduced its new PyroFuse, a pyrotechnic circuit breaker designed to enhance safety in high-voltage applications up to 1,000 V. This product features a fast interrupt time and is compact and lightweight. The STPS500 series PyroFuse aims to provide reliable protection against damage from short circuits and electrical shock events, making it suitable for automotive, charging and other sectors. The PyroFuse addresses the increasing s...
    News
    Stradvision outlines roadmap for next-gen autonomous driving technology
    As reported in a press release on April 7, Stradvision announced its three-year product roadmap, leading up to the release of the next-generation SVNet MultiVision Gen 2 by 2027. This roadmap is designed to meet the evolving demands of the autonomous driving market and customer needs, with a prototype of MultiVision Gen 2 expected to debut at Consumer Electronics Show (CES) 2026. Aiming to advance from Level 2 and Level 2+ advanced driver assistance systems to developing Level 3 and Level 4 a...
    News
    Hyundai Mobis expands R&D center in Hyderabad to boost automotive software development
    Hyundai Mobis has announced the expansion of its Indian research and development center in Hyderabad, Telangana, striving to enhance its automotive software development capabilities. This move aims to consolidate two previously separate R&D centers into a singular, large-scale base, making it a strategic hub for software strategy with a focus on the growing importance of software in the automotive industry, particularly for electric vehicles and sport utility vehicles. The company seeks to s...
    News
    ZF enhances ProAI for optical multigigabit Ethernet in vehicles
    German automotive supplier ZF has enhanced its ProAI high-performance computer to support optical multigigabit Ethernet in automotive applications, leveraging newly developed chips and connectors. This advancement is in line with the IEEE 802.3cz standard, enabling ultrafast data transmission over automotive-grade optical fibers. Oliver Briemle, head of Cross-Domain Computing at ZF, highlighted this development as crucial for the electrical systems of future software-defined vehicles, offering t...
    News
    Valeo supplies Renault Grand Koleos with Valeo Smart Safety 360
    The Renault Grand Koleos model has been awarded First Grade (highest score of safety level) in the Korea-New Car Assessment Program (KNCAP) tests. This latest model is equipped with a Valeo Smart Safety 360 system including a smart front camera, radars, detection algorithms and advanced functionalities. The Renault Grand Koleos also received the best score on advanced driver assistance systems among all vehicles tested by KNCAP in 2024 in the D-sport utility vehicle category....
    News
    RoboSense unveils AC1 AI-powered robotic vision platform
    In a press release on March 28, RoboSense, an AI-driven robotics technology company, has launched AC1, its AI-powered robotic vision platform. Representing the first product in its Active Camera series, along with the AI-Ready ecosystem, it provides an all-in-one solution for robotic perception development. As the inaugural product in the Active Camera series, AC1 focuses on the fusion of three core sensors: Lidar, camera and inertial measurement unit (IMU). This hardware-level data...
    News
    Vector launches VN5614 interface for automotive Ethernet
    Vector has recently introduced the VN5614, a new compact interface designed for automotive Ethernet 10BASE-T1S with support for Open Alliance TC10 and extensive low-level error reporting functionalities. This interface is primarily aimed at facilitating thorough analysis, simulation, testing and monitoring of 10BASE-T1S buses, offering comprehensive solutions for automotive Ethernet applications. The VN5614 stands out for its compact design and versatility, providing connections for two indep...
    News
    Infineon introduces new Power PROFET + 24/48V switch family
    As the automotive industry evolves toward hybrid and electric vehicles, there is a growing shift from traditional 12 V and 24 V power systems to more robust 48 V power sources. This transition aims to accommodate the advanced features of modern vehicles, improve passenger comfort and boost efficiency by simplifying electrical complexities and reducing currents. In response to these changes, Infineon Technologies AG has introduced the Power PROFETâ„¢ + 24/48V switch family, designed to meet the m...
    News
    TTTech Auto introduces Automotive Data Logger for SDV verification and validation
    As reported in a press release on March 31, TTTech Auto has unveiled the PM-350, a new member of its Automotive Data Logger family, specifically designed to meet the needs of software-defined vehicle (SDV) verification and validation. This introduction marks an evolution from the previously available PM-200, enhancing capabilities in capturing high-speed automotive Ethernet to ensure vehicle safety through freedom from interference on a communication level. The PM-350 stands out by also facilita...
    News
    Imec unveils photonics-enabled FMCW 144GHz distributed radar
    As reported in a press release March 31, Imec, a research and innovation hub specializing in nanoelectronics and digital technologies, has developed and tested a first-of-its-kind photonics-enabled code-division multiplexing (CDM) frequency-modulated continuous wave (FMCW) 144GHz distributed radar system. This system, which allows for coherent chirps to be sent to remote radar units, has demonstrated successful range measurements, setting the stage for the development of multinode radar syste...
    News
    Renesas launches video processor to augment ASIL-B automotive display systems
    Renesas Electronics Corp. has introduced the RAA278830 Video Diagnostics Bridge integrated circuit (IC), a highly integrated dual low-voltage differential signal (LVDS) LCD video processor. The new IC integrates many of the features necessary to design ISO 26262-compliant ASIL-B automotive display systems such as head-up-displays (HUD), digital instrument clusters, camera monitor systems (CMS) and electronic mirrors. As automotive safety systems are increasingly dependent on display...
    News
    BMW launches production of Neue Klasse cars at its Hungary plant
    BMW has launched the assembly operations of its Neue Klasse models at its car manufacturing plant in Debrecen, Hungary, the German carmaker announced March 27. BMW said that its innovative Neue Klasse vehicle architecture opens new possibilities including a modular and scalable platform leading to greater efficiency, fewer connecting components and a simplified installation of the wiring harness. The new architecture also houses an innovative cockpit assembly, which contributes to acceleratin...
    News
    STMicroelectronics unveils TSC1801 amplifier simplifies high-accuracy sensing
    In a press release on March 27, the TSC1801 low-side current-measurement amplifier, produced by STMicroelectronics, stands out for its integration of matched resistors, which simplifies circuit design, reduces bill-of-materials costs and achieves gain accuracy within 0.15% across all temperatures due to its fixed-gain setting. The TSC1801's first gain version available is 20 volt per volt (V/V), with future models of 5 V/V and 50 V/V planned. This amplifier is particularly designed for high a...
    News
    Nexperia launches advanced automotive lighting integrated circuit for better compliance and efficiency
    Nexperia, a semiconductor company based in Nijmegen, the Netherlands, has unveiled a new automotive lighting solution: A 12-channel, 40-V high-side LED driver integrated circuit (IC) â€” the NEX13120FPC-Q100 â€” designed to meet the stringent ASIL-B level compliance for automotive lighting applications including tail, brake, signal and in-cabin illumination. This innovative product seeks to aid automotive manufacturers in achieving ASIL-B compliance earlier in the design proc...
    News
    Renesas Electronics launches automotive-qualified Bluetooth chip
    According to a press release on March 25, Renesas Electronics has launched the DA14533, a new Bluetooth chip that marks the first automotive-qualified device in its Bluetooth low energy (BLE) system-on-chip (SoC) family. This chip integrates a radio transceiver, an Arm M0+ microcontroller, memory, peripherals and security features into a compact SoC design, aiming to make system integration simpler while reducing power consumption. The DA14533 is optimized for power efficiency, offering ...
    News
    Mobileye launches surround ADAS for mass-market vehicles
    As reported in a blog post on March 25, Mobileye has introduced Mobileye Surround ADAS, which utilizes a single Mobileye EyeQ6 High system-on-chip (SoC) to offer a vertically integrated, software-defined, hands-off eyes-on driving experience. This system utilizes advancements in AI to manage up to 11 sensors with a single electronic control unit (ECU), integrating features such as computer vision, sensor fusion, REM crowdsourced mapping and over-the-air updates. The innovation enabl...
    News
    Cambridge GaN Devices unveils breakthrough in EV power electronics technology
    Cambridge GaN Devices (CGD), a fabless, clean-tech semiconductor company, announced a breakthrough in enabling gallium nitride (GaN) technology for the electric vehicle powertrain applications market, particularly for systems over 100 kW. The company's Combo ICeGaN solution, which integrates ICeGaN high-electron-mobility transistors integrated circuits (HEMT IC) with insulated-gate bipolar transistors (IGBT) within the same module or intelligent power module (IPM), aims to offer high e...
    News
    NXP unveils first 16-nanometer FinFET automotive microcontrollers
    NXP Semiconductors has revealed its latest S32K5 family of automotive microcontrollers (MCUs) during an event in Nuremberg, Germany. This new family of MCUs, distinguished as the automotive industry's first 16-nanometer (nm) FinFET MCU with embedded magnetic RAM (MRAM), is designed to drive advancements in software-defined vehicle (SDV) architectures, specifically focusing on zonal and electrification system solutions as part of the NXP CoreRide platform. The S32K5 aims to provide a scalabl...
    News
    BMW launches digital nervous system for Neue Klasse vehicles
    The BMW Group has introduced an innovative advancement in the automotive industry with its digital nervous system designed for the Neue Klasse, marking a significant first. This system encompasses four high-performance computers, referred to as "superbrains," which are allocated to handle key customer functions: the Brain of Panoramic iDrive for infotainment, the Brain of Automated Driving for driving assistance, the Heart of Joy for driving dynamics, and the Core Brain responsible for managing ...
    Briefing
    Everspin unveils new automotive-grade MRAM for extreme environments
    As reported in a press release on March 10, Everspin Technologies, a developer and manufacturer of magnetoresistive random-access memory (MRAM) solutions, has announced an expansion of its high-reliability MRAM products with the launch of the PERSYST EMxxLX family's new models, the EM064LX HR and EM128LX HR. These latest additions are designed to operate within an extended temperature range of -40°C to 125°C, adhering to the AEC-Q100 Grade 1 standard, which makes them suitable for automot...
    News
    Tier IV renews sensor fusion development kit for advanced object recognition
    As reported in a press release on March 10, Tier IV has announced an upgrade to its sensor fusion development kit, which was originally launched in June 2023. This upgrade simplifies the kit by integrating what was previously a dual-computer setup into a single unit, enhancing efficiency and facilitating the integration of advanced object recognition technologies. The kit amalgamates automotive cameras, high-performance Lidar and an autonomous driving computer, providing a comprehensive ...
    News
    Synopsys introduces virtualizer native execution on Arm hardware to accelerate software-defined product development
    Synopsys Inc. has introduced Synopsys Virtualizer Native Execution for Arm-based hardware, signaling a shift in software development for edge devices by significantly enhancing the speed of virtual prototype execution and deployment, as reported in a press release on March 10. This development is particularly geared toward supporting the creation of software-defined products within the automotive, high-performance computing (HPC), and internet of things sectors.  The Virtualize...
    News
    Telechips introduces South Korea's first automotive AI accelerator
    Telechips, a fabless semiconductor company listed on the KOSDAQ, has launched A2X (TCA2000/TCA1000), South Korea's first automotive AI accelerator, marking a significant advancement in the software-defined vehicles (SDVs) sector. The A2X chipset integrates sensor interfaces, data preprocessing and AI acceleration, boasting the largest neural processing unit (NPU) found in any domestic automotive AI accelerator. This development is poised to enhance AI controller performance and system effic...
    News
    Dream Chip, Cadence unveil automotive system-on-chip with Tensilica intellectual property at embedded world 2025
    At the embedded world 2025 event in Nuremberg, Germany, Cadence, in collaboration with Dream Chip Technologies, is set to present an intelligent automotive system-on-chip (SoC). This second-generation silicon device integrates several of Cadence's technologies, including the high-performance, low-power Tensilica Vision 341 DSP for vision and radar workloads, a programmable accelerator, the NNA110 accelerator with an embedded Vision P6 DSP for AI functions, and various digital intellectual proper...
    News
    loading
    Searching our resources for you...
    Trending News
    Latest Podcasts
    Latest Reports
    Latest Insights
    Latest Profiles
    Latest Startups
    preload preload preload preload preload preload