Toshiba Electronics Europe GmbH has introduced the TPD7110F, an ideal diode controller tailored to enhance power control and design flexibility in automotive systems. This component finds applications in body control modules, battery management systems (BMSs) and head-up displays. The TPD7110F features reverse-polarity protection to safeguard against battery connection errors, underscoring the role of ideal diode controllers in automotive safety designs that demand redundant configurations. T...

Tensor and Arm have announced a multiyear strategic collaboration to develop the foundational compute architecture for agentic AI personal Robocar. Tensor is utilizing the Arm compute platform, which integrates hardware, software, and ecosystem enablement to power AI workloads across the entire vehicle. This collaboration has resulted in the integration of over 400 Arm-based cores in each vehicle, representing the highest concentration of Arm technology in a consumer vehicle to date. As Tensor p...

NXP Semiconductors has introduced production-released 10BASE-T1S Physical Medium Dependent (PMD) transceivers, specifically the TJA1410 for automotive use and the TJF1410 for industrial applications, including building automation. These groundbreaking transceivers allow original equipment manufacturers to extend low-cost, multidrop Ethernet all the way to the network edge, which is critical for both scalable software-defined vehicle (SDV) and industrial architectures. The TJA1410 is fully qualif...

Ablic Inc., part of the MinebeaMitsumi Group and led by President Seiji Tanaka, has introduced the S-19760/1 Series automotive shunt reference integrated circuits (ICs). This new series offers output voltage accuracy of ±0.1% and output voltage temperature coefficient of ±20 ppm/°C. The ICs serve as a reference voltage for A/D converters, which transform analog sensor signals into digital values. Notable features of the S-19760/1 Series include the industry-topping output voltage accuracy ...

BOS Semiconductors, a fabless chipmaker from South Korea, has successfully raised approximately $60.2 million (87 million won) in a Series-A funding round, a significant figure for an early-stage South Korean startup. This reflects the market's interest in AI semiconductors and BOS Semiconductors' rising status in the industry. The funding round saw participation from both existing and new investors, including Atinum Investment, Partners Investment, Stick Ventures, Industrial Bank of Korea,...

Tasking, a company specializing in high-performance embedded software development tools, has announced enhancements to its unified toolchain designed to provide more comprehensive timing analysis for real-time, multicore embedded systems. The toolchain integrates Tasking's compiler technology, BlueBox debuggers, winIDEA IDE, and the LDRA tool suite. These enhancements aim to help developers assess complex timing issues, such as worst-case execution time (WCET), in line with industry standards. T...

Renesas Electronics has unveiled a configurable ternary content-addressable memory (TCAM) built on a 3-nanometer (nm) fin-shaped field-effect transistor (FinFET) process, aimed at enhancing density, lowering power consumption and improving functional safety for automotive applications. The announcement was made at the International Solid-State Circuits Conference 2026 in San Francisco. This development comes amid growing network traffic driven by 5G and cloud/edge computing, prompting a demand f...

ROHM has introduced a new compact package, the HPLF5060, for its 40-V and 60-V automotive metal-oxide-semiconductor field-effect transistors (MOSFETs), targeting applications such as main inverter control circuits, electric pumps and LED headlights. This package, measuring 4.9 mm by 6.0 mm, is designed to accommodate the growing demand for smaller MOSFET packages in the automotive industry. The shift toward compact formats, such as the 5060-size, has posed challenges in reliable board mount...

TDK Corp. announced the expansion of its NTCSP series of NTC thermistors, designed for high-temperature environments up to 175°C, with mass production commencing in February 2026. These thermistors are aimed at enhancing automotive performance by supporting the need for more powerful and heat-resistant power semiconductors. Previously, TDK's thermistors were guaranteed to operate up to 150°C, but the new range extends this capability to 175°C. The NTCSP series is a device compliant with AE...

BorgWarner has secured a new electric cross differential (eXD) program with a mainland China-based original equipment manufacturer. The solution is designed specifically for a 48-V system and integrates seamlessly with the OEM customer's existing 48-V electrical/electronic (E/E) architecture. This supply order marks BorgWarner's first 48-V eXD application within its global offerings, expanding the company's capabilities in torque management for electric vehicles. As the EV market evolves, E/E...

The recently concluded Consumer Electronics Show (CES) 2026 (Jan. 6–9, 2026) marked a clear inflection point: software-defined vehicles (SDVs) have entered their industrialization phase. Original equipment manufacturers and suppliers shifted decisively away from exploratory demos and concepts toward scalable, production-ready SDV platforms, with most architectures, toolchains and compute strategies aligned to 2026–28 SOPs. The focus has clearly moved from what SDVs could do, to how they can ...

STMicroelectronics has introduced the Stellar P3E, an advanced automotive microcontroller featuring AI acceleration for edge intelligence. This microcontroller unit (MCU) is designed for software-defined vehicles (SDVs), facilitating the integration of multifunction X-in-1 electronic control units, helping to reduce system cost and complexity. The Stellar P3E stands out due to its embedded ST Neural-ART Accelerator, which allows for efficient real-time AI processing, being the first in the autom...

Arrow Electronics has introduced a strategic initiative and research hub to facilitate the development of next-generation vehicle electrical and electronic (E/E) architecture. The initiative aims to provide automakers and tier 1 suppliers with engineering expertise and supply chain support as the industry shifts toward software-defined vehicles (SDVs). E/E architecture represents a shift from distributed computing, where separate computers manage individual features, to centralized systems that ...

Mobility technology provider Ecarx Holdings introduced a preproduction sample of its innovative Zenith computing platform at the Consumer Electronics Show (CES) 2026, held recently in Las Vegas. This new platform, designed in collaboration with Qualcomm Technologies, utilizes the Snapdragon Elite SA8797 platform for automotive and offers an integrated high-performance intelligent cockpit and advanced driver assistance system architecture. The platform supports Android 16, Google Automotive Servi...

Diodes Inc. has announced the release of the automotive-compliant PI2MEQX2505Q, a 1.8-V, 2.5-Gbps MIPI D-PHY ReDriver with four differential data lanes and one clock lane. This device is designed for the MIPI D-PHY 1.2 protocol and regenerates D-PHY signaling in channels involving printed circuit board (PCB) traces, connectors and cables to ensure optimal electrical performance from CSI-2/DSI sources to sinks, compensating for frequency loss. The PI2MEQX2505Q supports data rates up to 2.5 Gbps, ...

SK Keyfoundry, an 8-inch pure-play foundry based in South Korea, has launched its 4th-generation 200-V high-voltage 0.18-micron Bipolar-CMOS-DMOS (BCD) process. This new process is set to begin full-scale product development with major domestic and global customers and aims for mass production within the year. As the electrification of vehicles and the expansion of AI data centers progress, the demand for high-voltage, high-efficiency power semiconductors is increasing. Automotive electrical arc...

Volkswagen Group China has delivered its China Electronic Architecture (CEA) on schedule, laying the foundation for the successful start of production of its first CEA-based model, the VW ID. UNYX 07. The product marks Volkswagen Group’s entry into full-cycle software-defined vehicle (SDV) production in China, for China. In 2026, the Group will present four additional models across all Volkswagen brand joint ventures in China, built on the new architecture. With the delivery of the CEA, Vol...

Innoviz Technologies announced the release of InnovizSMART, a ready-to-buy lidar solution tailored for various smart applications. InnovizSMART features high-resolution 3D point cloud detection, low power consumption and ease of installation, making it suitable for applications such as perimeter security, traffic management and robotics. The product is fully industrialized, allowing global partners to utilize an automotive-grade sensor with short lead times to meet current and ant...

QCraft has commenced the year with QCraft Day 2026, showcasing its advancements and objectives in the autonomous driving sector to over 200 industry guests in Beijing on Jan. 23. During the event, the company highlighted its achievements in mass production, development and deployment, as well as its plans for further expansion. James Yu, co-founder, chairman and CEO of QCraft, delivered a keynote speech titled "Bringing Autonomous Driving into Real Life," describing 2026 as the start of a t...

ROHM has introduced a new series of sintered-metal shunt resistors, the UCR10C Series, aimed at addressing the growing power and reliability demands in automotive and industrial current-sensing applications. The series has the highest-rated power for 2012-size shunt resistors, offering resistance values from 10 milliohm (mΩ) to 100 mΩ. These components are available with ratings of 1.0 W and 1.25 W, nearly doubling the power-handling capabilities compared to similar products in the same f...

Samvardhana Motherson International Ltd., an India-based automotive supplier also known as Motherson Group, is expanding its operations in Hungary through several investments, including a research and development program and the establishment of a regional services center. The company’s €54 million R&D project focuses on AI-based sensors and advanced visual systems integrated into rearview mirrors. The investment is set to create 55 new jobs for automotive product development professi...

SK Hynix has received the Automotive Safety Integrity Level-D (ASIL-D) certification for its LPDDR5X automotive dynamic RAM (DRAM), the highest safety rating under the ISO 26262 standard for functional safety in vehicles. This certification, granted by TÜV SÜD, a global functional safety certification body, involves a thorough assessment of the development and production framework, encompassing the development process, product design, verification and quality management systems. With this achi...

At the Consumer Electronics Show (CES) 2026, held earlier in January in Las Vegas, Autolink announced the world's first Deep Fusion Electronic/Electric Architecture (EEA), representing a significant advancement in the field of intelligent vehicle technology. The architecture is described as the automotive industry's first fully unified integration of central compute, zonal control and high-bandwidth in-vehicle optical communication. It serves as a platform for advanced driver intelligence, incor...

At the Consumer Electronics Show (CES) 2026 in Las Vegas, Smart Eye and Green Hills Software jointly demonstrated how driver monitoring systems (DMS) can be integrated into automotive software-defined vehicle architectures. The collaboration provides a foundation for original equipment manufacturers and tier 1 suppliers aiming to develop and deploy secure DMS efficiently. The solution assists automakers in reducing integration complexity, shortening validation cycles, and complying with safety a...

At the Consumer Electronics Show (CES) 2026 held in Las Vegas, Garmin announced the expansion of its collaboration on automotive technology by introducing the Nexus automotive-grade high-performance compute (HPC) platform. This platform, powered by Qualcomm's Snapdragon Elite Platform for automotive, is designed to integrate various vehicle domains, including in-vehicle infotainment, instrument clusters and advanced driver assistance systems into a cohesive system. Scheduled for programs star...

NVIDIA has introduced the NVIDIA Alpamayo family of open AI models, simulation tools and datasets to enhance the development of autonomous vehicles with a focus on safe, reasoning-based functionality. Autonomous vehicles face challenges in managing a wide array of driving conditions, particularly rare and complex scenarios known as the "long tail". Traditional autonomous vehicle architectures often separate perception and planning, which can limit effectiveness in novel situations...

Skyworks Solutions showcased its expanded lineup of automotive-grade solutions, which enhance connectivity and electrification, at the Consumer Electronics Show (CES) 2026. Its products, such as the V2X Front-End Modules and Notch Filters, improve real-time road awareness and support autonomous vehicles. The SKY5A2110 GNSS L1 + L5 Dual-Frequency Automotive LNA FEM offers faster satellite positioning with robust interference immunity, supporting advanced navigation systems. Furthermore, S...

FIH, a subsidiary of Hon Hai Technology Group (Foxconn), participated in the Consumer Electronics Show (CES) 2026 under the theme Driving the Future of Smart Mobility. The company exhibited its core automotive electronics solutions, including high-performance computing (HPC) platforms, in-vehicle infotainment (IVI) systems, advanced driver assistance systems and telematics control units (TCUs). As part of its showcase, FIH introduced an interactive demo vehicle demonstrating the centralized...

At the Consumer Electronics Show (CES) 2026, ThunderSoft announced AquaDrive OS 2.0 Pre, the latest evolution of its AI-native vehicle operating system designed to accelerate the industry’s transition toward AI-defined vehicles. Unveiled under the theme AI-Native. Road-Ready, AquaDrive OS 2.0 Pre is built around three core pillars: A unified in-vehicle experience, AI-native intelligence by design, and faster readiness for mass production. The platform establishes a new foun...

Porsche Engineering is deploying AI (AI tools) to reduce switching losses in power transistors by up to 95%. The potential for reducing losses in electric vehicle inverters through intelligent actuation of power transistors can directly enhance the efficiency and range of EVs. Power transistors within inverters experience line losses and switching losses. These losses can be minimized using intelligent soft-switching techniques, particularly zero-voltage switching (ZVS), which reduces&nb...

Valens Semiconductor has announced a new design win for its VA7000 MIPI A-PHY-compliant chipsets, which will be integrated into the advanced driver assistance systems of a high-profile global automotive original equipment manufacturer targeting the Chinese market. The integration of the VA7000 chipsets into the OEM's vehicles is scheduled to commence production in 2027. MIPI A-PHY stands out as the premier standardized solution for high-speed sensor connectivity and has achieved design wins acro...

Omnivision has announced that its complementary metal-oxide-semiconductor (CMOS) image sensors, the 8-megapixel (MP) OX08D10 and the 3-MP OX03H10, featuring TheiaCel technology, are now supported on the NVIDIA DRIVE AGX Hyperion autonomous vehicle platform. This platform, unveiled by NVIDIA at the Consumer Electronics Show (CES) 2026, is designed to enhance functional safety and cybersecurity in autonomous vehicles, enabling Level 4-ready capabilities. The OX08D10 sensor is noted for its us...

Garmin has introduced Unified Cabin 2026 at the Consumer Electronics Show (CES) in Las Vegas this week (Jan. 6–9), featuring an advanced AI/large language model-based virtual assistant. This new technology operates on a single system-on-a-chip (SoC) with the Android Automotive OS and is capable of understanding multi-intents and adapting to multiple languages. It performs tasks such as playing a movie and sharing a screen through an LLM-driven action model, with audio and display routing ...

At the Consumer Electronics Show (CES) 2026 in Las Vegas, Leapmotor and Qualcomm Technologies jointly unveiled what they claim is the world's first cross-domain integrated solution using Snapdragon Cockpit Elite and Snapdragon Ride Elite automotive platforms. Displayed at Qualcomm's booth, the controller showcased how a dual-chipset architecture can enhance compute performance, streamline vehicle electronics and enable advanced AI capabilities throughout a vehicle. This collaboration underlin...

NXP Semiconductors has introduced the S32N7 super-integration processor series, based on a 5-nanometer (nm) foundation similar to its predecessor, the S32N55. This new series aims to help carmakers digitalize core vehicle functions such as propulsion, vehicle dynamics, body, gateway and safety domains, effectively reducing complexity and fostering AI-powered innovation on a large scale. The S32N7 processors are designed to integrate software and data into a centralized hub within vehicles, ensur...

Sony Honda Mobility (SHM) kicked off Consumer Electronics Show (CES) 2026 with a preview of its electric vehicle future, world-premiering the AFEELA Prototype 2026 and confirming US deliveries for the AFEELA 1 EV later in 2026. The announcements spotlight SHM's push to redefine EVs as Creative Entertainment Spaces, blending advanced AI, entertainment and seamless driving for electric mobility. At a pre-CES press conference, SHM positioned the AFEELA 1 pre-production model as its first EV...

AMD is returning to the Consumer Electronics Show (CES) with a new lineup of automotive demonstrations that push the boundaries of perception, digital cockpits, cloud-based development and in-vehicle computing. The 2026 showcases highlight how AMD brings together high-performance compute, adaptive architectures and AI acceleration to enable the next generation of software-defined vehicles (SDVs). AMD held live technology and partner demonstrations around advanced driver assistance systems at ...

Teradar, a US-based company specializing in terahertz (THz) vision technology, introduced its flagship sensor, Teradar Summit, at the Consumer Electronics Show (CES) 2026. The Teradar Summit is a long-range, high-resolution sensor designed to operate effectively in all weather conditions. This development addresses a crucial gap left by traditional radar and lidar sensors.  Teradar is engaged in eight development partnerships across the US and Germany and plans to start bidding on high-v...

Visteon Corp. is presenting its comprehensive solutions at the Consumer Electronics Show (CES) 2026 in Las Vegas this week (Jan. 6–9). The company’s showcases at the annual event feature a range of production-ready intelligent cockpit electronics, AI computing solutions, advanced displays and electrification platforms. "This is not a concept showcase, but real technology, running live, and ready for the road," said Sachin Lawande, president and CEO of Visteon. "We're demonstrating how sol...

Schaeffler will present its comprehensive motion technology portfolio at the Consumer Electronics Show 2026 (CES), which will be held in Las Vegas this week. The exhibition will feature intelligent motion components and systems addressing industry challenges in humanoid robotics, energy generation, industrial automation and vehicle technology. The German supplier will present technologies for software-defined vehicles (SDVs) that simplify vehicle architectures and enable real-time control. Th...

Canatu, a Finland-based company specialising in carbon nanotube (CNT) technology, has entered into a 17-month Joint Development Agreement (JDA) with DENSO Corp. to develop advanced manufacturing equipment to produce large-area CNT films specifically for automotive applications. According to the Finnish company, scaling the CNT film size is essential for enabling future applications, including full windshield heaters.   As part of the agreement, a large-scale CNT deposition chamber will b...

Seyond, a California, US-based company specializing in lidar solutions, will present its full end-to-end lidar portfolio at the Consumer Electronics Show (CES) 2026, scheduled to be held in Las Vegas on Jan. 6 to 9, 2026. The company’s showcase includes ultralong-range, long-range and fully solid-state sensing solutions designed for automotive, robotics and intelligent infrastructure applications. Seyond's comprehensive portfolio allows customers to meet all their lidar needs through a...

SiEngine, a mainland Chinese automotive research and development firm, has begun mass production of its new AI-capable chips for autonomous vehicles and advanced driver assistance systems. The AD1000 and AD800 system-on-chip (SoC) units are fabricated on a 7-nanometer (nm) process, providing improved thermal and power efficiency. These chips are aimed at car manufacturers interested in implementing Level 2 to Level 4 autonomous driving features, which include hands-free and attention-free drivin...

Innoviz Technologies has launched the InnovizThree lidar. InnovizThree is characterized by slimmer dimensions and reduced power consumption, while offering high performance at a significantly lower price compared to InnovizTwo. The new design allows for flexible integration options, such as behind the windshield or on the rooftop, providing automakers with various design options. InnovizThree is designed for enhanced sensing power and efficiency, offering reliability and scalability across vehic...

Intellias, a global software engineering and digital consulting company, plans to showcase its AI-enabled Engineering Maturity Model, chip-to-cloud Automotive Technology Platform, and partner-driven solutions that aim to accelerate the future of intelligent mobility at Consumer Electronics Show (CES) 2026. Intellias will be located at Meeting Space #3377 in the LVCC West Hall, Vehicle Tech & Advanced Mobility Area, where it will present next-generation solutions for software-defined mobility...

Aeva is preparing to showcase advancements in sensing and perception systems at the Consumer Electronics Show (CES) 2026 in Las Vegas from Jan. 6 to 9, 2026. It plans to demonstrate a passenger original equipment manufacturer vehicle equipped with 4D lidar integrated into the windshield and introduce a new 4D lidar sensor designed for applications in robotics, automotive and smart infrastructure. This sensor marks an evolution of Aeva's lidar-on-chip platform, enhancing capabiliti...

Rivian plans to launch its Gen 3 Autonomy Platform in late 2026 on the R2 model, featuring a shift to in-house silicon designed for vision-centric physical AI. This platform will be powered by the first-generation Rivian Autonomy Processor (RAP1), a custom 5-nanometer (nm) processor integrating processing and memory into a multichip module. The Autonomy Compute Module 3 (ACM3) will utilize RAP1 and boasts notable specifications, including 1600 sparse INT8 tera operations per second (TOPS) utiliz...

Renesas Electronics Corp. is expanding its software-defined vehicle (SDV) portfolio with new offerings built around its fifth-generation (Gen 5) R-Car family. The newest member of the lineup, the R-Car X5H, is the industry’s first multidomain automotive system-on-chip (SoC) manufactured using advanced 3-nanometer (nm) process technology. Designed for next-generation vehicle architectures, the R-Car X5H can concurrently support advanced driver assistance systems, in-vehicle infotainment (IVI)&n...

Visteon has inaugurated a new engineering center in Tunis, the capital city of Tunisia, La Presse reported Dec. 14. The development marks a significant step for the US-based automotive supplier, which has operated in Tunisia since 2005. Visteon aims to expand its workforce in Tunisia to 900 employees by 2028, up from 560 at present, with nearly 40% in managerial roles. The new center is expected to support growth in engineering as well as research and development. Leveraging local talent, the...

On Dec. 11, Rivian held its first Autonomy & AI Day event at its Palo Alto offices in the San Francisco Bay Area, California, highlighting its advancements in automotive technology. The US-based electric-car maker introduced its proprietary, purpose-built silicon and outlined its road map for next-generation vehicle autonomy, featuring a new software architecture enhanced by AI. “I could not be more excited for the work our teams are driving in autonomy and AI,” said RJ Scaringe, foun...

Molex has introduced the MX-DaSH Modular Wire-to-Wire Connectors, which are the latest additions to its MX-DaSH family of data-signal hybrid connectors. These connectors integrate power, signal and high-speed data connectivity into a single system. The design employs multiple cartridges within a single housing to simplify wiring and enhance design flexibility and scalability across various automotive models and applications. Specifically designed for zonal architectures, the MX-DaSH Modular W...

Hyundai Mobis is set to present over 30 advanced automotive technologies at the Consumer Electronics Show (CES) 2026 event in Las Vegas, scheduled from Jan. 6 to 9, 2026. The leading automotive supplier from South Korea will operate its booth as a private exhibit for invited customers, focusing on meaningful business opportunities with key North American clients. Under the theme Layer of Progress, Hyundai Mobis aims to showcase how its technologies connect and evolve, highlighting innovations...

BlackBerry division QNX will unveil major updates across its mission-critical embedded systems and automotive software portfolio at the Consumer Electronics Show (CES) 2026 — including a new demo of its Foundational Vehicle Software Platform (FVSP), developed in collaboration with Vector. At the QNX Booth (#4024, West Hall), visitors can explore three interactive zones: Automotive — Showcasing next-generation cockpit and software-defined audio solutions, including QNX Cabin ...

Marelli, a global mobility technology supplier to the automotive sector, has launched its new Intelligent Energy Management solution for hybrid and electric vehicles at the CTI Europe 2025 symposium in Berlin. This modular system is based on proprietary software that integrates seamlessly with vehicle control units and thermal components. It aims to coordinate the vehicle's energy domains: Thermal, propulsion and electronics, to maximize efficiency throughout the vehicle systems. The sol...

Shindengen Electric Manufacturing is expanding its range of products in the high-voltage surface-mount CG Package lineup, which is specifically designed for automotive applications. The company recognizes the increasing demand for compact, high-voltage surface-mount diodes as automotive and industrial equipment inverters become smaller and more advanced. A critical challenge in achieving high-withstand voltages is ensuring adequate terminal spacing for insulation, which is complicated by space c...

Voyant Photonics has announced new additions to its Carbon lidar platform, unveiling 32-line and 64-line variants intended for compact, cost-sensitive and compute-limited systems. These new models, to be showcased at Consumer Electronics Show (CES) 2026, complement the existing 128-line configurations, offering broader choices in the portfolio. The Carbon platform, built on the same semiconductor foundation as Voyant's flagship model, maintains advantages such as velocity measurement, interferen...

Murata Manufacturing has announced the launch and mass production of a new multilayer ceramic capacitor (MLCC) with a capacitance of 15 nF, a rated voltage of 1.25 kV and C0G characteristics in a compact 1210-inch (3.2 mm x 2.5 mm) size. This product is designed for high-efficiency power conversion and stable performance under high-voltage conditions, making it suitable for use in onboard chargers for electric vehicles and power supply circuits in high-performance consumer devices. The MLCC...

At the iREX 2025 global robotics expo, oToBrite introduced an array of advanced Vision-AI tools targeting outdoor robotics, unmanned ground vehicles (UGVs) and smart-mobility platforms. The presentation included its automotive-grade GMSL camera series, a visual-inertial odometry (VIO) camera, a multicamera positioning system named oToSLAM, and a new GMSL Camera developer kit compatible with the NVIDIA Jetson platform. The GMSL cameras are equipped with automotive-grade sensors that offer...

Diodes has launched the AL3069Q, a 60-V boost controller designed for automotive backlight applications. This device features four 80-V high-precision current sink channels, which are suitable for larger LED display panels, and includes extensive diagnostic functions to ensure system safety and reliability. It is applicable in infotainment panels, instrument clusters and head-up displays. The AL3069Q operates with adaptive boost voltage control over a wide input voltage range from 4.5 V to 60 V,...

Toshiba Electronics Europe GmbH has announced the commercial sample shipments of its new gate driver integrated circuit, the TB9084FTG, specifically designed for three-phase brushless DC (BLDC) motors. These motors are crucial for various automotive applications, including automotive body systems like power sliding doors, power back doors, power seats, electric pumps, fans, and motor generators. The TB9084FTG is based on its predecessor, the TB9083FTG, and integrates essential functions for d...

Joynext recently participated in the Tech Day event at Hyundai Motor's global headquarters in South Korea, where it showcased its cross-domain nCCU (central computing unit) series solution. This solution has gained significant recognition from Hyundai due to its technological strength and global delivery capabilities. In the future, the nCCU series solution is expected to be promoted for global mass production based on next-generation electrical/electronic (E/E) architecture, as indica...

Wolfspeed has introduced its new 1,200-V silicon carbide (SiC) six-pack power modules, which utilize Wolfspeed's Gen 4 SiC metal-oxide-semiconductor field-effect transistor (MOSFET) technology and innovative packaging. The modules feature advanced packaging technologies, including sintered die attach, epoxy encapsulant material and copper clip interconnects. Furthermore, they offer a 22% improvement in RDS(ON) at 125°C compared to the previous generation, along with a 60% reduction in t...

STMicroelectronics has unveiled the VNF1248F, a new addition to its Sti2Fuse family, which is an automotive e-fuse metal-oxide-semiconductor field-effect transistor (MOSFET) controller designed for enhanced protection, power efficiency and safety in modern vehicles. The VNF1248F offers a rapid response time of 100 microseconds, surpassing traditional wire fuses, to prevent fault propagation within vehicle electrical systems. It supports multiple boardnet voltages, including 12 V, 24 V and 4...

Microchip Technology has introduced the LAN866x family of 10BASE-T1S end point devices featuring remote control protocol (RCP) for zonal architectures in automotive networking. With its offerings, the company aims to address the challenges in the automotive industry's shift to zonal architectures for in-vehicle networking. These devices aim to simplify network integration by extending Ethernet connectivity to the edges of in-vehicle networks, facilitating the creation of software-defined vehicle...

Molex has launched the first product in its eHV high-voltage connector and terminal system portfolio designed for high-performance electrical connections in battery-electric vehicles (BEVs) and plug-in hybrid electric vehicles (PHEVs). The initial offering is the eHV60 High-Voltage Automotive Connector, which is suitable for auxiliary high-voltage functions such as DC/DC converters, onboard chargers, electric compressors and e-axles. The eHV60 provides a compact and efficient solution to increas...

TriLite has announced the Trixel 3 Cube, an addition to its laser beam scanner (LBS) display technology platform, designed for augmented reality (AR) and automotive applications. The Cube signifies an advancement in miniaturization and system efficiency, integrating TriLite's optical architecture into a compact form with power optimization for easy integration into AR eyewear and automotive displays. It is available as an engineering sample, with mass production expected to support customer desi...

Novosense Microelectronics, an automotive analog company based in mainland China, has announced the release of its new range of high-performance LED driver integrated circuits (ICs) — NSL21912, NSL23716x and NSL2163x — designed for both exterior and interior vehicle lighting. These innovations comprise high-side and low-side linear drivers, as well as integrated microcontroller (MCU) solutions for ambient RGB and RGB control, providing precise current regulation, advanced diagnostics an...

STMicroelectronics has unveiled the L98GD8, an eight-channel gate driver tailored for 48-V automotive power systems, supporting the move toward mild-hybrid vehicles and increased electrical efficiency. Operating from a 58-V supply, it features configurable channels for metal-oxide-semiconductor field-effect transistor (MOSFET) control in various configurations, including high-side and low-side switches, and H-bridges for DC motor applications. The device also supports peak-and-hold control ...

Infineon Technologies AG is expanding its MOTIX 32-bit motor control system-on-chip (SoC) family with the introduction of two new products — TLE994x and TLE995x — designed for both brushed (BDC) and brushless (BLDC) motor applications. These new solutions cater to small to medium-sized automotive motors, with applications ranging from battery cooling systems in electric vehicles to comfort features such as seat adjustments. As the number of motors in modern vehicles, especially electric o...

Magnachip Semiconductor has announced an agreement with Hyundai Mobis Co. Ltd. concerning the use of high-performance insulated-gate bipolar transistor (IGBT) technology. Hyundai Mobis, a global provider of auto parts focusing on differentiated mobility solutions, has been collaborating with Magnachip since 2015 on developing IGBTs for traction inverters targeted at hybrid and electric vehicles. Recognizing the importance of internalizing core power semiconductor technologies for traction system...

NXP Semiconductors has announced the release of its Electrochemical Impedance Spectroscopy (EIS) battery management chipset, marking a significant advancement in battery management technology. The chipset features hardware-based nanosecond-level synchronization across all devices, designed to enhance the safety, longevity and performance of electric vehicles and energy storage systems. By integrating EIS measurements directly into three battery management system (BMS) chipset units, NXP enables ...

ROHM has developed a Schottky barrier diode, dubbed the RBE01VYM6AFH, which overcomes the traditional forward voltage drop/reverse current (VF/IR) trade-off, providing high reliability protection for high-resolution image sensor applications such as advanced driver assistance systems (ADAS) cameras, according to an Oct. 23 news release. The need for greater precision in modern ADAS cameras necessitates higher pixel counts, leading to concerns about damage from photovoltaic voltage generated d...

Sony Semiconductor Solutions Corp. announced the upcoming IMX828, which is noted as the first in the industry to feature a CMOS image sensor for automotive applications with an integrated MIPI A-PHY interface, according to a news release. This enables the elimination of externally mounted serializer chips, resulting in a more compact, energy-efficient and thermally streamlined camera system. The IMX828 also boasts an 8-effective-megapixel resolution and the highest level of high dynamic range...

Geely’s new premium electric multipurpose vehicle, the LEVC L380, features an Infrared Night Vision System (NVS) developed by Raytron to improve visibility in low-light and nighttime conditions. The system uses a thermal imaging camera to help detect pedestrians and obstacles in darkness, fog, or glare, where conventional cameras may be less effective. It is part of the vehicle’s suite of 28 perception sensors, aimed at enhancing overall driving safety. According to the National Highway Traf...

Keysight Technologies has introduced the AE6980T nGBASE-AU Optical Automotive Ethernet Transmitter Test Solution, the first platform designed to qualify next-generation optical automotive Ethernet PHYs that align with the IEEE 802.3cz standard. This unveiling took place at the 2025 IEEE SA Ethernet & IP at Automotive Technology Day held in Toulouse, France. The IEEE 802.3cz standard pertains to multigigabit optical automotive Ethernet ranging from 2.5 G to 50 G over multimode fiber, offering...

DENSO has announced the development of new electrification products aimed at improving energy efficiency, driving performance and reducing charging times for electric vehicles. These innovations are designed to enhance the practicality of EVs and include an inverter to be featured in the new e-axle from BluE Nexus Corp., as well as a cell supervising circuit for measuring battery voltage and temperature, and a shunt current sensor for measuring current. These products will specifically be instal...

Mainland Chinese electric-vehicle maker Zeekr has officially launched the updated Zeekr 001 shooting brake, showcasing significant specification upgrades while maintaining its exterior design. The updated model features an official starting price of 269,800 yuan (about $37,826), up from the predecessor's 259,000 yuan. With a limited-time trade-in subsidy of 10,000 yuan, the effective starting price becomes 259,800 yuan. The 2026 Zeekr 001 is developed on a 900-V high-voltage architecture, ...

Ferrari unveiled its first all-electric car, the Ferrari Elettrica, during Capital Markets Day 2025. This marks a significant milestone in Ferrari's multi-energy strategy, which includes internal combustion engines (ICEs), hybrid electric vehicle (HEV) and plug-in hybrid electric vehicle powertrains, and now fully electric drive. The Ferrari Elettrica combines advanced technology and performance while maintaining Ferrari's traditional engineering and craftsmanship. The chassis and bodysh...

STMicroelectronics has introduced the L98GD8 driver, designed for 48-V automotive power systems, featuring eight configurable channels for driving metal-oxide-semiconductor field-effect transistors (MOSFETs) in various configurations. This driver can operate from a 58-V supply, offering diagnostics and protection to enhance safety and reliability. The 48-V powernet is beneficial for car manufacturers aiming to improve mild-hybrid systems by supporting integrated starter-generators (ISGs), enhanc...

Sumitomo Riko is integrating Ansys' AI technology to enhance efficiency in the design and manufacturing of automotive components. SimAI, which analyzes both new and legacy simulation data, is being used to create AI models that can quickly predict performance. The deployment of SimAI helps Sumitomo Riko accelerate complex computational tasks such as anti-vibration design, battery cooling, magnetic field analysis and mixing heat transfer analysis. As a global manufacturer of high-per...

Diodes Inc. has introduced the PI7C9X762Q, a high-performance automotive-compliant inter-integrated circuit/serial peripheral interface (I2C/SPI-bus-to-dual-channel) universal asynchronous receiver-transmitter (UART) bridge, designed to meet the needs of electric vehicle designs. The device is particularly suitable for smart cockpits, central controllers, input/output (I/O) module controllers, advanced driver assistance systems, telematics and zonal gateways due to its low-po...

Omnivision has introduced the OX05C, the first 5-megapixel (MP) back-side illuminated global shutter high-dynamic range sensor designed for in-cabin driver and occupant monitoring systems. This new sensor, part of its Nyxel near-infrared technology family, will be demonstrated at AutoSens Europe in Barcelona, Spain. The OX05C offers high-quality imaging with a pixel size of 2.2 micrometers (µm) and utilizes Nyxel technology for enhanced low-light performance at the 940-nanometer near in...

TE Connectivity (TE) has launched its Inside Device Connectivity portfolio to address the evolving requirements of automotive electronic control units (ECUs) and next-generation vehicle architectures, including software-defined vehicles (SDVs). The new lineup includes board-to-board, wire-to-board, flex-to-board and wire-to-wire connector solutions engineered for compact, high-performance applications within zonal architectures and key systems such as: Onboard charger (OBC), inverter...

Tobii and STMicroelectronics have commenced mass production of an advanced interior sensing system for a premium European carmaker, enhancing driver and passenger monitoring. This cost-effective solution uses a single camera that integrates Tobii's interior-sensing technology with STMicroelectronics' imaging sensors, offering high-quality imaging both in daytime and nighttime environments. Adrian Capata,  senior vice president of Tobii Autosense, highlighted the collaboration with STMi...

ROHM has introduced a new series of high-side smart switches, known as Intelligent Power Devices (IPDs), with advanced current-sensing capabilities and ON resistances ranging from 9 milliohm to 180 milliohm. These switches are designed to protect loads and subsystems from issues such as overcurrent, overvoltage and overtemperature, ensuring the reliable operation and protection of sensitive automotive components such as lighting, door locks and power windows. They also offer enhanced safety feat...

Littelfuse has introduced its 828 and 827 Series high-voltage cartridge fuses, which are compliant with AEC-Q200 standards. These fuses are designed for next-generation automotive electronics, with the 828 Series rated at 1,000 VDC and the 827 Series at 800 VDC. They provide a compact and reliable solution for circuit protection in electric vehicle systems, offering a 10-kiloampere (kA) interrupting rating, a wide operating temperature range from -55°C to 125°C, and various mounting configurat...

Wayve has announced the development of its Gen 3 robot platform, which will utilize NVIDIA DRIVE AGX Thor, an advanced automotive-grade AI computer. This new platform represents the next step for Wayve's global development fleet, supporting the advancement of its AI Driver software into more secure, capable and scalable automated driving systems. The Gen 3 platform aims to progress self-driving technology to Level 3 and Level 4, necessitating a flexible and powerful computing capability to ma...

SK Keyfoundry, a South Korean 8-inch pure-play foundry, has unveiled its multilevel thick intermetal dielectric (IMD) process for capacitors, boasting high breakdown voltage characteristics. These characteristics contribute to enhanced safety, reliability and lifespan while improving the noise immunity of semiconductor devices. The process facilitates the stacking of up to three IMD layers, achieving a total thickness of up to 18 micrometers (μm) in a metal-insulator-me...

Volvo Cars has announced significant hardware and software upgrades to its EX90 model, including enhanced safety features and increased electrical capacity for the 2026 model year (MY) cars. The electric sport utility vehicle will benefit from an additional NVIDIA Drive AGX Orin processor, replacing the older NVIDIA Xavier chip, increasing its computational power to 500 trillion operations per second. This upgrade enables advanced safety capabilities through the car's lidar sensor, including ...

Nexperia has introduced new 100-V metal-oxide-semiconductor field-effect transistors (MOSFETs), qualified for AEC-Q101 standards and housed in compact CCPAK1212 (12 mm x 12 mm) copper-clip packaging. These MOSFETs offer ultralow conduction losses with an on-resistance as low as 0.99 milliohm and support safe current levels exceeding 460 amperes. They are particularly suitable for thermally demanding 48-V automotive applications, such as onboard chargers, traction inverters and battery manag...

STMicroelectronics has introduced SPSA068, a compact and cost-effective power-management integrated circuit (PMIC) designed specifically for automotive applications. This PMIC supports ISO 26262 functional safety up to ASIL-B and is qualified to AEC-Q100. It is intended for use with microcontrollers (MCUs) that operate from a single-supply voltage and features a comprehensive suite of components needed for MCU power management. These include a 1A battery-compatible buck voltage regulat...

Ams OSRAM has introduced its AS8580 automotive capacitive sensor with a robust capacitive sensing approach based on IQ demodulation. This technology allows for separating the measured capacitance into parasitic resistive and capacitive parts, enhancing resilience against environmental disturbances and maintaining high sensitivity, making it suitable for both exterior and interior automotive applications. The AS8580 features a sensitivity of 1.9 fF/LSB, enabling accurate detection of touc...

Ecarx Holdings Inc. has announced the launch of the Geely Galaxy M9, which utilizes its Pikes computing platform and Cloudpeak cross-domain software stack to provide an advanced AI cockpit experience. The Galaxy M9 received over 40,000 orders within 24 hours of its presales starting Aug. 23, indicating a significant demand for this flagship model. The vehicle is powered by the 5-nanometer Qualcomm Snapdragon SA8295P automotive-grade system-on-chip (SoC), enabling advanced gra...