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    FISITA World Mobility Conference 2025: Key themes and concerns for the automotive industry
    One thing is abundantly clear after the FISITA World Mobility Conference (WMC) last week. Megatrends impact everything. No longer can chassis development, braking, safety validation and so forth stand alone without impact from the broader drive towards electrification, the AI revolution or SDVs, to name a few.  The event’s sessions gave the impression that electrification is already baked into the industry, particularly in Europe where the debate on (regulation-pushed) direction is ...
    Beyond horsepower: Compute becomes the new competitive edge for OEMs
    Automotive compute power is becoming a defining metric of vehicle capability — not just for autonomy, but across cockpit systems, connectivity and life-cycle software deployment. As vehicles transition toward centralized electrical/electronic (E/E) architectures and software-defined platforms, silicon performance is now a core determinant of what a vehicle can do — and how long it will remain competitive in the field. Two metrics have emerged as industry standards for measuring this compu...
    Qualcomm announces Snapdragon Auto Day in India to showcase automotive technology and partnerships
    Qualcomm has announced its inaugural Snapdragon Auto Day in India, set for July 30, in New Delhi, in collaboration with Amazon Web Services (AWS), according to a report published by Sakal Media Group on July 9. This event is designed to unite leaders from the automotive and technology industries, including original equipment manufacturers, tier 1 suppliers and ecosystem partners, to discuss the future of connected and software-defined vehicles. The main focus is to present innovations aimed a...
    MediaTek expands automotive sector focus in India with advanced AI and connectivity solutions
    MediaTek is focusing on expanding its footprint in the automotive sector in India, with projections that the country will contribute 20% of its global automotive deployments over the next five years, according to a report published by Autocar Professional on July 9. “From an automotive standpoint, India is expected to account for 20% of the total number of deployments in the segment in the next five years,” said Rita Wu, director of Product Marketing, Automotive Platform, at MediaT...
    LG Group expands automotive software ventures with global carmakers
    Chief executives from LG Group's key units, including LG Electronics, will hold closed-door meetings with global carmakers to expand in the software industry. LG Innotek, a major South Korean electronics parts developer, has entered the automotive application processor market, which is expected to grow at 22% annually over the next five years. LG Electronics, a leading global home appliance maker, announced plans to invest more than 1 trillion South Korean won ($762 million) in its ven...
    Mazda opens new R&D center in Tokyo, to focus on development of intelligent vehicles
    Mazda Motor Corp. has launched a new research and development office named Mazda R&D Center Tokyo (MRT), located in Azabudai Hills, Minato-ku, Tokyo, as part of its strategy to enhance its operations in the metropolitan area. Concurrently, Mazda has relocated its Tokyo Office from the Kasumigaseki Building to Azabudai Hills. The company aims to maintain its status as the Brand of Choice by adapting to the industry's shift toward electrified and intelligent vehicles while preserving i...
    Infineon advances gallium nitride semiconductor market with 300-mm wafer technology
    Infineon Technologies has provided an update on its 300-mm gallium nitride (GaN) manufacturing roadmap, confirming it is on track to ship initial customer samples by the fourth quarter of 2025. The company is progressing toward enhancing its customer base and reinforcing its market presence. Infineon is noted for its expertise in power systems, managing materials such as silicon (Si), silicon carbide (SiC) and GaN. GaN semiconductors offer advantages such as higher power density, faste...
    Intel closes automotive business amid strategic downsizing and layoffs
    Intel has announced substantial layoffs and the closure of its Automotive Chip division, aimed at cost reduction and operational efficiency, according to a report published by Hans India on June 26. This strategic shift comes under the guidance of newly appointed CEO Lip-Bu Tan, who has prioritized lean operations and diminished bureaucracy. According to a WARN Act filing, 107 employees at Intel's headquarters in Santa Clara, California, will face layoffs starting July 15. This reduction...
    Marelli gains interim court approval to access up to $519 million of debtor-in-possession financing
    Marelli Holdings has received interim approval from the US Bankruptcy Court for the District of Delaware to access up to $519 million out of a total $1.1 billion in debtor-in-possession financing. This approval pertains to Marelli's First Day motions related to its voluntary Chapter 11 petitions. Marelli filed for Chapter 11 bankruptcy protection to restructure its long-term debt on June 11. The secured financing, along with revenue from Marelli's ongoing operations, is intended to provi...
    Hyundai Motor’s rare earth stockpile can last about a year, report
    South Korean automaker Hyundai Motor has accumulated a rare earths stockpile sufficient to last about a year, Reuters reported June 10. The company does not expect any immediate effects from the global supply chain disruptions triggered by mainland China's export restrictions on rare earth elements and magnets. Mainland China's decision to limit exports of rare earths and related magnets in April caused challenges in the supply chains vital to automakers, aerospace manufacturers, semicondu...
    Aumovio appoints new executive board members to drive future growth
    Continental is on track to spin off its automotive group sector business under the Aumovio brand and its subsequent listing on the Frankfurt Stock Exchange by the end of 2025. Aumovio SE reached a key milestone on June 5, when its supervisory board confirmed the executive board appointment. Alongside CEO Philipp von Hirschheydt, four new members have been appointed to strengthen the board. Ingo Holstein will assume the role of chief human resource offic...
    Hyundai Mobis opens new Logistics Center in Gyeongju
    Hyundai Mobis has inaugurated a significant logistics center in Gyeongju, South Korea, to enhance the supply of aftersales parts for Hyundai Motor and Kia in the country, according to a report published by Business Korea on May 30. The Yeongnam Logistics Center, situated in the Myeonggye 3 General Industrial Complex in Gyeongju, North Gyeongsang Province, began full operations earlier in 2025. Construction of the center cost approximately 97 billion won (about $0.071 billion) and spann...
    Innometry to showcase EV battery X-ray inspection solutions at The Battery Show Europe 2025
    Innometry announced its plans to present X-ray inspection solutions for electric vehicle batteries at The Battery Show Europe 2025 in Germany. This event, recognized as Europe's largest battery expo, will feature Innometry's booth showcasing its X-ray equipment capable of precisely analyzing the internal structure of rechargeable batteries to identify defects and mitigate EV fire risks. Emphasizing its technological capabilities, the South Korean company utilizes artificial intelligence-based so...
    Dekra opens US Automotive Test Center of Excellence in Michigan
    Dekra, a leading provider of safety, security, and sustainability testing and certification services, has opened a new automotive testing laboratory in Plymouth, Michigan. The facility, which is designed to address the future needs of the mobility sector, provides a wide range of automotive testing, validation and certification services, including electric vehicle testing, automotive electromagnetic compatibility (EMC), reliability testing, automotive connectivity technologies and digital t...
    Pioneer India opens new automotive R&D center in Bengaluru
    Pioneer India, a subsidiary of Pioneer Corp., has established a new Research & Development Center in Bengaluru, India. This center will coordinate with Pioneer's global R&D and engineering networks to develop solutions in various areas, including automotive vision and sensing technologies, advanced driver assistance systems, and digital cockpit and human-machine interfaces. It will also focus on cloud-connected infotainment and telematics, AI and mobility data platforms, and connected so...
    Loxo selects Aeva to power autonomous delivery vehicles
    In a press release on May 28, Aeva announced that Loxo, a Swiss provider of urban autonomy software, has chosen its long-range 4D Lidar technology for integration into Loxo's autonomous driving platform, Digital Driver. This collaboration will kick off with the deployment of Aeva Atlas, Aeva’s 4D Lidar sensor, across Loxo’s fleet of delivery vehicles. The Aeva Atlas will be implemented in Loxo's delivery vehicles, which are specifically designed for middle and last-mile log...
    Wolfspeed plans to file bankruptcy amid debt management challenges
    Semiconductor supplier Wolfspeed is preparing to file for Chapter 11 bankruptcy within weeks due to challenges in managing its debt, according to a Reuters report dated May 20. The report referenced The Wall Street Journal as the original source of the news, which cited sources familiar with the situation. Following this news, the company's shares fell over 57% in extended trading. Wolfspeed has been facing difficulties stemming from low demand in industrial and automotive markets, as well as...
    Luminar to raise $200 million from investors through convertible preferred stock
    Luminar Technologies, a US-based company specializing in Lidar technology, finalized an agreement with YA II PN Ltd., an investment fund managed by Yorkville Advisors Global, and another accredited investor to raise up to $200 million through convertible preferred stock in registered direct offerings over the next 18 months. Under the terms of the agreement, Luminar will issue $35 million of convertible preferred stock, with the potential for additional issuances of up to $35 millio...
    Forvia Hella secures €1 billion order for advanced automotive control modules
    As reported in a press release on May 12, Forvia Hella has secured a significant customer order from a global premium manufacturer to develop and produce an advanced control module (ACM), with series production set to begin in 2028. Additionally, its intelligent power distribution module (iPDM) will start series production for another automotive manufacturer by midyear. The combined order volume for these projects exceeds €1 billion, with production based in Timisoara, Romania, and development...
    PCIM Europe 2025: Novosense showcases semiconductor solutions for automotive applications
    NOVOSENSE Microelectronics, a provider of analog and mixed-signal chips, showcases its solutions at PCIM Expo & Conference 2025 in Nuremberg, Germany, according to a press release on May 7.  Since its establishment in 2013, NOVOSENSE has achieved key milestones of shipping over 668 million automotive chips by 2024, acquiring MagnTek to bolster magnetic sensor expertise, and achieving ISO26262 ASIL D 'defined-practiced' certification for functional safety.  Automotive Electron...
    Ford halts project to develop next-generation EV architecture – report
    Ford Motor has terminated the development of its next-generation electrical architecture, known internally as FNV4, which was aimed at enhancing vehicle software functions to compete with electric vehicle companies such as Tesla, according to Reuters. The project, which began with substantial investment to streamline software functions, was discontinued due to escalating costs and delays. Despite this, Ford will integrate the lessons learned into its current software system, with a continued foc...
    Forge Nano secures $40 million to expand US battery and semiconductor operations
    Forge Nano Inc., a technology company specializing in battery and semiconductor innovations, has secured $40 million in new funding to scale its US operations. This funding round was led by RockCreek and Ascent Funds, with participation from Top Material, Orion Infrastructure Capital and existing investors. RockCreek joins other shareholders such as GM Ventures, Volkswagen, LG Technology Ventures and Hanwha, bringing Forge Nano's total capital investment to over $140 million. Paul L...
    Toyota Motor explores buying out Toyota Industries for $42 billion
    Toyota Motor is exploring the possibility of investing in a potential buyout of Toyota Industries, Reuters reported April 27. “We are currently exploring various possibilities, including partial investment,” the Japanese automaker confirmed in a regulatory filing with the Tokyo Stock Exchange on April 26. Meanwhile, a report from Bloomberg on April 25 said that Akio Toyoda, chairman of Toyota Motor, and his founding family have proposed to acquire Toyota Industries for ¥6 trillion (...
    Continental names Automotive Group Sector business as Aumovio
    Continental has decided to name its Automotive Group Sector business, which is set to become an independent company, Aumovio, the company announced on the sidelines of Auto Shanghai 2025. According to the Germany-based supplier, the new name embodies a strong market position, rich heritage and technological expertise, all aimed at transforming the future of mobility through innovative solutions. Pending approval at the Continental annual shareholders' meeting on April 25, Aum...
    South Korea boosts semiconductor industry with $23.25 billion support package
    South Korea announced an increase in its support package for the country's critical semiconductor industry, raising the amount to 33 trillion won (about $23.25 billion), which marks a significant increase from the previously unveiled package of 26 trillion won, according to a report published by Reuters on April 15. This decision comes in the wake of growing policy uncertainty under the current US administration and increasing competition from mainland Chinese rivals. To address these chall...
    Auto Shanghai 2025: Continental to unveil automated driving and light projection tech
    In a press release on April 15, Continental announced that it will highlight its innovations aimed at transforming future mobility through software-defined vehicle technologies, focusing on safety, autonomy and sustainability at Auto Shanghai 2025. During a press conference scheduled for April 23, Philipp von Hirschheydt, an executive board member responsible for the Group Sector Automotive, will reveal the name of an independent Automotive company that will emerge from Continental's planned spi...
    Onsemi drops plans to acquire Allegro MicroSystems; withdraws offer
    ON Semiconductor (Onsemi) has shelved its plans to acquire Allegro MicroSystems and withdrawn its all-cash offer of $35.10 per share to buy all outstanding shares of Allegro. Instead, the US chipmaker will focus on existing opportunities to enhance stakeholder value. The company also plans to continue allocating funds to its share buyback program. “While we continue to believe that a combination with Onsemi would be beneficial to all stakeholders of both companies, after...
    Hyundai Mobis hosts fourth Mobis Mobility Day in Detroit
    Hyundai Mobis hosted its fourth annual Mobis Mobility Day in Detroit to underline its commitment to forging future mobility technology alliances in North America. The event, themed "Mobis in Global," was designed to showcase the company's business vision, investment achievements and its dedication to innovation within the global automotive industry, particularly focusing on software-defined vehicles (SDVs), electrification and automotive electronics. Unlike the first three editions of the Mob...
    Hyundai Mobis expands R&D center in Hyderabad to boost automotive software development
    Hyundai Mobis has announced the expansion of its Indian research and development center in Hyderabad, Telangana, striving to enhance its automotive software development capabilities. This move aims to consolidate two previously separate R&D centers into a singular, large-scale base, making it a strategic hub for software strategy with a focus on the growing importance of software in the automotive industry, particularly for electric vehicles and sport utility vehicles. The company seeks to s...
    Imec and Baden-Württemberg launch Advanced Chip Design Accelerator
    At the Hannover Trade Fair 2025, Imec, a research and innovation hub in nanoelectronics and digital technologies, announced a collaboration with the state government of Baden-Württemberg, Germany, to launch the Advanced Chip Design Accelerator (ACDA) in Baden-Württemberg. This new competence center aims to enhance Imec's Automotive Chiplet Program by developing chiplets, packaging, system integration, sensing and AI technology, thereby supporting the automotive industry in the introductio...
    Inova Semiconductors unveils new headquarters in Munich to support global expansion
    In January, Inova Semiconductors inaugurated its new headquarters located at Zielstattstrasse 32, 81379 Munich, marking a significant step in its five-year expansion strategy. The move to the larger office space is designed to support the company's plans for international growth, particularly in Asia and North America, and to accommodate its innovation in semiconductor technologies. With the goal of expanding its workforce to approximately 100 full-time positions in the coming years, the new hea...
    UL Solutions plans to develop a new advanced electromagnetic compatibility laboratory in Toyota City, Japan
    UL Solutions Inc., a global leader in applied safety science, plans to develop a new advanced automotive electromagnetic compatibility (EMC) laboratory in Toyota City, Japan, to provide testing to help manufacturers protect against electromagnetic interference that can cause critical systems in vehicles, such as braking and engine control, to malfunction, the company announced March 16. EMC testing continues to gain more importance as vehicles are being increasingly equipped with more complex...
    Thyssenkrupp to cut 1,800 jobs amid automotive sector challenges
    Thyssenkrupp, a German conglomerate, announced its plan to reduce its workforce by approximately 1,800 jobs due to ongoing difficulties within the automotive sector. The company attributed the decision to persistently challenging market conditions in the global automotive industry and highlighted a strategic move to freeze hiring as part of its efforts to navigate these challenges. Thyssenkrupp aims to implement these and other measures, including reducing investments, to achieve savings of m...
    Shanghai-based EV maker Nio initiates restructuring to focus on cost control
    Chinese electric-car maker Nio is implementing a new organizational restructuring to focus more on cost control, with William Li, the company’s founder, chairman and CEO, increasing his involvement in the supply chain management, according to a news report published by CnEVPost on March 10. The CnEVPost news report cites local media 36kr as the original source of this news. It said that the electric-vehicle maker has launched an internal management mechanism called Cell Business Uni...
    Infineon achieves ISO/SAE 21434 certification for AURIX TC4x and plans certification for TC3x family
    As reported in a press release on March 3, Infineon Technologies has received ISO/SAE 21434 certification for its AURIX TC4Dx microcontroller. The certification, granted by TÜV SGS, confirms compliance with stringent cybersecurity standards, ensuring secured development processes and risk management throughout a vehicle’s life cycle. Infineon is also pursuing ISO/SAE 21434 certification for its AURIX TC3x microcontroller family to help customers meet national and global cybersecurity reg...
    BYD engages with Italian component manufacturers to increase localization in Europe
    Chinese electric vehicle and battery manufacturer BYD has met with several Italian automotive component suppliers in Turin, Italy, to select new suppliers for its Europe-based manufacturing sites. The event, organized by BYD with the support of the Italian Association of the Automotive Industry (Associazione Nazionale Filiera Industria Automobilistica [ANFIA]), was aimed at establishing a common ground between the vehicle manufacturer and local supply chain stakeholders, along with ...
    Charting a course through automotive supply chain disruptions
    The automotive industry is grappling with a myriad of supply chain disruptions that have become increasingly common since the pandemic struck. In addition to Brexit complexities, rising material costs, natural disasters, geopolitical tensions and economic instability are forcing companies to rethink their logistics and sourcing strategies on the fly. While improvements are anticipated in the global car chip shortage, challenges persist. As Nimish Ashar, associate director of E/E & Semicon...
    Steering through regulations in the automotive sector
    As the automotive industry evolves, suppliers must prioritize regulatory compliance due to stricter environmental laws linked to climate change. Investing in new technologies is essential to avoid penalties and enhance competitiveness. We examine the regulatory challenges facing suppliers and share insights from industry executives in S&P Global Mobility’s 2025 Automotive Supplier Outlook. Regulatory pressures: A catalyst for change Automotive suppliers are facing numerous challenges...
    Facing the skills crisis in the European automotive sector
    The European automotive supply industry is currently grappling with a severe labor shortage, exacerbated by record attrition levels that have plagued it over the past few years. This alarming situation has led to job losses that surpass even the darkest days of the pandemic. Despite optimistic forecasts for new job creation, the reality reveals a staggering net loss of nearly 56,000 positions since 2020, with the worst yet to come, according to The European Association of Automotive Suppliers (C...
    TDK launches wire-wound inductors for high-current automotive power-over-coax applications
    TDK Corp. announced the expansion of the ADL4532VK series of wire-winding inductors for automotive power-over-coax (PoC). Mass production of these new components began in February 2025. Advanced driver assistance systems are designed to enhance vehicle safety by using automotive cameras and sensors that monitor the driving environment. These systems rely on multiple cameras, typically installed at the front, rear and sides of the vehicle, to capture real-time imagery for safe and secure drivi...
    SK hynix acquires TISAX certification to accelerate memory development
    As reported in a press release on Feb. 5, SK hynix has become the first company in the memory industry to acquire TISAX, the global information security certification for the automotive sector. This certification applies to all its domestic sites in Icheon, Bundang and Cheongju in South Korea, confirming its compliance with automotive security standards. The move supports SK hynix's efforts to develop high-performance memory solutions for AI-driven automotive technologies as the imp...
    Honda aims for global leadership in level 3 driving tech
    At the CES technology expo on Jan. 7, Honda announced its ambition to become a global leader in highway self-driving technology within this decade, introducing prototypes from its new 0 Series range of electric vehicles, which includes a midsize SUV and a sleek sedan, with production set for 2026. Honda plans to create seven models within the 0 Series, with the premium versions featuring advanced technology like lidar, essential for enabling Level 3 autonomous driving. Level 3 autonomy allows fo...
    DeepSeek's role in advancing perception in autonomous driving and AI in automotive industry
    DeepSeek, a Chinese AI startup, has unveiled advancements that are shaking up the global AI landscape, particularly in the automotive sector. By leveraging software to optimize its large language model performance, DeepSeek has created a technological workaround to the restrictions placed on Nvidia's chips, notably the H1000. This development signals a potential game changer for the deployment of Level 4 (L4) autonomous vehicles and robo-taxis, which heavily rely on cloud computing infrastructur...
    Aptiv announces intention to separate Electrical Distribution Systems business
    In a press release on Jan. 22, Aptiv announced that its board of directors has unanimously approved a plan to separate its Electrical Distribution Systems (EDS) business from Aptiv, creating two independent companies, each optimally positioned to serve their customers and create value for their shareholders. Benefits of the separation transaction As separate companies, Aptiv and EDS are each expected to benefit from: Strategies and operating initiatives that are focused on each company...
    Infineon consolidates sensor and RF operations into SURF unit
    In a press release on Jan. 16, Infineon Technologies announced the establishment of a new business unit aimed at consolidating its efforts in the sensors market by combining its Sensor and Radio Frequency (RF) operations into a single entity. This new unit, named Sensor Units & Radio Frequency (SURF), is set to be a part of the Power & Sensor Systems (PSS) division, incorporating the previously separate Automotive and Multi-market Sense & Control businesses. The integration, effec...
    CES 2025: Leopard Imaging showcases next-gen imaging solutions
    In a press release on Jan. 7, Leopard Imaging demonstrated its latest imaging solutions at Consumer Electronics Show (CES) 2025, reinforcing its partnership with Qualcomm Technologies and Microchip. This collaboration aims to advance the field of imaging technology for the automotive sector by leveraging the Qualcomm Snapdragon Ride Platform and Microchip's innovative technologies. The focus is on enhancing image signal processing (ISP) capabilities and AI acceleration to provide superior image ...
    CES 2025: LG Innotek to showcase future mobility innovations
    In a press release on Jan. 8, LG Innotek announced its participation in Consumer Electronics Show (CES) 2025, held in Las Vegas from Jan. 7 to 10. The company plans to showcase its innovations in future mobility at a 3,500-square-meter booth located at the entrance of the West Hall in the Las Vegas Convention Center (LVCC). The booth will feature a mockup of a future vehicle equipped with 15 types of components for vehicle sensing, communication and lighting, demonstrating the company's capabili...
    CES 2025: Sona Comstar to showcase innovative technology solutions
    Sona BLW Precision Forgings Ltd., popularly known as Sona Comstar, plans to showcase its innovative mobility solutions at Consumer Electronics Show (CES) 2025 in Las Vegas, the company said Jan. 6. The company plans to showcase advanced sensor solutions from its Serbian subsidiary Novelic, including the short-range radar, designed for park assist, 180-degree obstacle detection, kick-to-open functionality and tailgate protection, as well as the in-cabin monitoring radar, which offers features ...
    CES 2025: LeddarTech to unveil advanced ADAS technology
    At Consumer Electronics Show (CES) 2025 in Las Vegas, LeddarTech will be showcasing its LeddarVision Surround-View (LVS-2+) technology. LVS-2+ is designed to enhance advanced driver assistance systems for automotive original equipment manufacturers and tier 1 suppliers, aiming to meet stringent safety standards and consumer expectations. It offers a comprehensive solution by enabling a full-surround view of the vehicle's environment through 5V5R sensor fusion, improving the reliability, accuracy...
    CES 2025: Aeva to showcase new 4D Lidar for automated driving
    In a press release on Dec. 19, 2024, Aeva announced its participation in Consumer Electronics Show (CES) 2025, taking place Jan. 7–10, 2025, in Las Vegas. Aeva will introduce and demonstrate a new long-range high-resolution 4D Lidar sensor for automotive applications, provide a preview of Torc’s autonomous Freightliner Cascadia commercial vehicle equipped with Aeva 4D Lidar technology, and showcase a new in-cabin Lidar collaboration. Aeva’s next-generation long-range sens...
    Novares inaugurates a new plant in Czech Republic
    Novares has inaugurated its new plant located in the city of Cerhovice in Czech Republic on Dec. 18, marking a significant move by the French company to maintain its operations in the Czech market, following the destruction of the Zebrak premises a few months earlier. This move is part of the Group's strategy to stay close to its global customers, ensuring the delivery standards in terms of quality and availability are met. The plant is set to continue serving its existing customer base, whic...
    Continental announces plan to spin off Automotive business by end of 2025
    In a press release dated Dec. 9, German automotive tier 1 supplier Continental announced that its executive board has reached the decision to spin off its Automotive group sector. This decision follows a detailed evaluation process that began in early August. The plan is to seek approval from the supervisory board in March 2025 and then present the proposal for a spin-off to Continental AG's annual shareholders' meeting on April 25, 2025. If approved, the spin-off is anticipated to be complet...
    Hongqi unveils 5-nanometer vehicle-mounted chip, pure vision end-to-end smart driving
    Hongqi has unveiled its self-developed 5-nanometer (nm) vehicle-mounted chip and launched the Jiuzhang Intelligent Platform, according to a report published by Biauto on Nov. 14. The new chip, Hongqi No.1, is set to enhance the company's smart driving capabilities, enabling pure vision navigation across China. Additionally, Hongqi's Sinan Intelligent Driving system will feature urban Navigate on Autopilot (NOA) and is expected to achieve end-to-end integration by the end of 2024 improving vehicl...
    Kioxia Universal Flash Storage Ver. 4.0 earns automotive-grade SPICE CL2 certification
    As reported in a press release on Dec. 3, Kioxia has announced that its Universal Flash Storage (UFS) Version 4.0 embedded flash memory devices, aimed at automotive applications, have achieved the Automotive SPICE Capability Level 2 (CL2) certification. This makes Kioxia the first entity to receive such a distinction for automotive-grade UFS Ver. 4.0. Automotive SPICE, based on the ISO/IEC 33000 standards, is a framework designed for the assessment and enhancement of software development...
    Renault-backed Ampere opens new software center in Sophia Antipolis near Nice in France
    Renault’s subsidiary Ampere has opened its new software center in the European technology park at Sophia Antipolis, near Nice in France, the French carmaker announced Nov. 29. With the new software facility, the carmaker aims to accelerate the development of software-defined vehicles (SDVs). “With this site, Ampere is investing to give its teams in charge of automotive software the means to accelerate on Software Defined Vehicle (SDV) and to be at the cutting edge in terms of research,”...
    CES 2025: LeddarTech to showcase latest AI-driven automotive software in collaboration with Arm and TI
    As reported in a press release on Nov. 27, 2024, LeddarTech has announced its participation in Consumer Electronics Show (CES) 2025, taking place from Jan. 7 to 10, 2025, in Las Vegas. At this event, the company will showcase its LeddarVision technology, a patented AI-driven software that enhances advanced driver assistance systems, autonomous driving and parking applications through low-level sensor fusion and perception. LeddarTech will be located at booth 6752 in the LVCC West Hall,...
    Quectel to showcase GNSS modules at Auto EV India 2024
    According to a press release on Nov. 26, Quectel Wireless Solutions is set to participate in Auto EV India 2024, taking place at the KTPO Convention Centre in Bengaluru, India. At this event, Quectel aims to display its latest dead reckoning (DR) global navigation satellite system (GNSS) modules, catering specifically to the automotive and electric vehicle industries' growing needs. The company's lineup includes the L89H(D), an AIS140-compliant module with a dual-antenna design and an inert...
    Valeo to cut 1,000 jobs across Europe amid automotive sector challenges – report
    Valeo is set to eliminate approximately 1,000 jobs across Europe, with significant impacts in France where about 800 workers will be affected, according to a report published by Reuters on Nov. 27. This move includes the closure of two Valeo sites within France. The job cuts are not confined to France alone; Valeo will also reduce its workforce in Germany, Poland and the Czech Republic. This decision follows Valeo's announcement in October of a reduction in its annual sales forecast and comes am...
    Indie Semiconductor unveils safety integrated chip for automotive powertrains
    Indie Semiconductor, based in Aliso Viejo, California, has introduced a new system basis safety integrated chip (IC) for vehicle powertrain applications, in collaboration with a major European tier 1 automotive system integrator, as reported in a press release on Nov. 26. The IC is designed to enhance safety by monitoring and supervising powertrain operations critically. It has achieved the ASIL-D certification from SGS-TÜV Saar, the highest level of safety integrity according to the ISO 262...
    Denso collaborates with T-Hub to boost automotive innovation in India
    Denso has entered into collaboration with T-Hub, a startup incubator based in Hyderabad, India, to work with automotive startups on advanced mobility solutions, as reported by THG PUBLISHING on Nov. 6. The partnership, formalized through a memorandum of understanding (MOU) signing in the presence of Industries and IT Minister D. Sridhar Babu will see Denso engaging with India's innovative automotive startups via T-Hub's T-Connect platform. The collaboration aims to generate new ideas a...
    Silicon Motion achieves ISO 26262 ASIL-B Ready and ASPICE CL2 certification for automotive safety storage solutions
    Silicon Motion Technology Corp., a leading entity in the NAND Flash controller sector, announced its achievement of the ISO 26262 ASIL B Ready and ASPICE CL2 certifications on Nov. 5. Nelson Duann, senior vice president of Client & Automotive Storage Business, highlighted that these certifications demonstrate Silicon Motion's technological leadership and its dedication to meeting the increasing demands for reliable and safe storage solutions in the automotive sector, especially amid the...
    MIPI Alliance releases security framework for image sensor data protection
    The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, announced the release of the MIPI Camera Security Framework, which defines a flexible approach to add end-to-end security to automotive applications that leverage the MIPI Camera Serial Interface 2 (CSI-2) interface specification, as reported in a press release on Oct. 29. Because of the safety-critical role of image sensors in advanced driver assistance systems...
    Dongfeng bridges domestic gap with development of three automotive-grade chips
    According to a press release on Oct. 18, Dongfeng Motor is spearheading efforts to replace foreign automotive chips with domestically produced alternatives, focusing on microcontroller units (MCUs) and specialized chips. Zhang Fanwu, the chief engineer of Intelligentization at Dongfeng Motor Research and Development Institute, emphasized the importance of domestic chip production, stating that the more challenging a chip is to replace, the more crucial it is to develop a local substitute. Rec...
    Toyota Motor Europe launches second cohort of Toyota Open Labs innovation platform
    Toyota Motor Europe, along with its partners, has launched an open call for the second cohort of the Toyota Open Labs innovation platform, the company announced Oct. 25. The carmaker said that this initiative aims to connect startups with business units across the Toyota group and empower their ambitions to scale up and contribute to a sustainable future. According to Toyota, selected companies will get a chance to work with key business units on six strategic categories: a) Electric Ve...
    VeriSilicon’s DeWarp Processing IP DW200-FS secures ISO 26262 ASIL-B certification
    VeriSilicon recently announced that its DeWarp Processing Intellectual Property (IP), known as DW200-FS, has obtained the ISO 26262 ASIL-B certification for automotive functional safety from TÜV NORD, a globally recognized inspection and certification body. The DW200-FS IP boasts advanced technology that employs pixel mapping algorithms and a cache-based data prefetch architecture, which work together to offer high efficiency while reducing bandwidth consumption in image distortion processin...
    Xpeng unveils P7+ AI-defined electric sedan at the Paris Motor Show
    According to a press release on Oct. 14, at the Paris Motor Show 2024, Xpeng has introduced the P7+, AI-defined vehicle. Chairman Xiaopeng He emphasized Xpeng's dedication to the European market, highlighting the company's efforts in research and development to bring innovative intelligent technology solutions designed to offer drivers a safer, smarter, more sustainable and enjoyable driving experience.  Xpeng aims to integrate AI across all aspects of its vehicle models a...
    Indie Semiconductor announces iND880 camera video processor SoC design-win with global OEMs
    As reported in a press release on Oct. 15, indie Semiconductor, based in Aliso Viejo, Calif., has announced that its latest-generation iND880 camera video processor system-on-chip (SoC) family is achieving notable design-win momentum among global original equipment manufacturers. The company said that its iND880 distinguishes itself by leveraging indie's proprietary and patented image signal processor (ISP) technology, which addresses and overcomes the limitations typically faced by current v...
    ROHM to showcase advanced power and analog technologies at electronica 2024
    According to a press release on Oct. 10, ROHM Semiconductor has announced its participation in electronica 2024, the foremost trade fair and conference for electronic components, systems, applications and solutions, scheduled from Nov. 12 to 15 in Munich. At the event, ROHM intends to exhibit its progressive power and analog technologies that aim at improving power density, efficiency and reliability for automotive and industrial applications. These technologies are pivotal in meeting the gro...
    LeddarTech announces strategic license agreement with Solid State LiDAR Protection Inc.
    LeddarTech, an automotive software company that provides the patented AI-based, low-level sensor fusion and perception software technology, LeddarVision, for advanced driver assistance systems, autonomous driving and parking applications, has announced the conclusion of a strategic license agreement with Solid State LiDAR Protection Inc. This partnership grants Solid State LiDAR Protection the rights to produce and market LeddarTech’s advanced Lidar module and sensor products. Und...
    Li Auto expands chip R&D efforts in Hong Kong, aims for mass production of AI inference chips by 2026
    Li Auto is setting up a chip research and development office in Hong Kong, with plans to hire AI chip architects, Pandaily reported Oct. 9, quoting media outlet LatePost. The new office is envisioned as an international technology exchange center and falls under the Li Auto Chip Preliminary Research Department, aiming to recruit a team of about 10 people. These positions are considered equivalent to technical experts or senior experts at major domestic internet firms, indicating the high leve...
    Hurricane Helene disrupts high-purity quartz mining in North Carolina
    In North Carolina, US, the aftermath of Hurricane Helene has led to the shutdown of facilities operated by Sibelco Group and The Quartz Corp., both pivotal in mining high-purity quartz essential for semiconductor production, as reported by Automotive News on Oct. 2. These shutdowns, initiated on Sept. 26 due to the hurricane's severe flooding, have sparked concerns over potential impacts on the global semiconductor supply chain. This interruption is particularly significant, given the locatio...
    Renesas showcases advanced technologies and India-centric solutions at electronica India 2024
    According to a press release on Sept. 12, Renesas Electronics showcased its advanced solutions and technologies designed for the Indian market at electronica India 2024, held at the India Exposition Mart Ltd. (IEML) from Sept. 11 to 13. Renesas, as a principal partner of the event, presented a wide range of scalable and comprehensive solutions tailored for industrial, automotive and consumer applications, including: Edge-AI solutions for robotics, face recognition and real-time f...
    Mobileye ends development of in-house FMCW Lidar technology
    According to a press release on Sept. 9, Mobileye has terminated its in-house, next-generation frequency modulated continuous wave (FMCW) Lidar technology development for autonomous and highly automated driving systems. The decision results from a comprehensive review of the company's long-term technology strategy, during which Mobileye concluded that the procurement of next-generation FMCW Lidar is not crucial for its roadmap for eyes-off systems. Factors influencing this decision include...
    Samvardhana Motherson International plans to raise $715 million through share sale
    India’s leading automotive supplier Samvardhana Motherson International Limited (SAMIL) is planning to raise $715 million through share sale, Reuters reported on Sept. 4. The supplier will raise capital through a qualified institutional placement (QIP), which listed companies in India generally used to raise funds from large institutions. SAMIL plans to use the proceeds from the share sale to repay debt and fund some expansion and certain capital expenditure. SAMIL is a major supplier of wi...
    Indian government advances semiconductor manufacturing with new unit in Gujarat, India
    The Union Cabinet, led by Indian Prime Minister Narendra Modi, has approved the proposal of Kaynes Semicon Pvt. Ltd. to establish a new semiconductor manufacturing unit in Sanand, Gujarat, India, marking a significant step toward developing a robust semiconductor ecosystem in India, as reported by DD News on Sept. 2. The unit represents an investment of 33,000 million Indian rupees (about $393.23 million) and aims to produce 6 million chips daily for various applications such as industri...
    UCIe Consortium releases 2.0 specification supporting manageability system architecture and 3D packaging
    According to a press release on Aug. 1, the Universal Chiplet Interconnect Express (UCIe) Consortium has officially unveiled its 2.0 specification, marking a significant upgrade in its offerings. This new specification encompasses a comprehensive architectural framework designed to tackle the complexity inherent in the design, manageability and testing (DFx) of system-in-package (SiP) arrangements involving multiple chiplets. It introduces a series of enhancements including the addition ...
    SK Hynix presents extensive AI memory lineup at expanded FMS 2024
    According to a press release on Aug. 8, SK Hynix has showcased its full array of AI memory technologies at FMS: the Future of Memory and Storage (FMS) 2024. Previously known as Flash Memory Summit, the conference changed its name to reflect its broader focus on all types of memory and storage products amid growing interest in AI. SK Hynix’s booth at FMS 2024 consisted of four sections showcasing many of the products that were featured in the company’s keynote and session talks. One of the...
    Keysight, Ettifos and Autotalks make 3GPP Rel-16 sidelink radio interoperability connection
    According to a press release on Aug. 6, Keysight Technologies enabled the first 3rd Generation Partnership Project (3GPP) Release 16 (Rel-16) sidelink radio interoperability test between the Ettifos SIRIUS 5G-V2X sidelink platform and the Autotalks SECTON3 5G-V2X chipset through the Keysight PathWave Signal Generation for NR-V2X and X-app for 5G NR V2X Modulation Analysis Measurement Application. As demand for connected cars surges and autonomous driving gains momentum, the expansion of 5G fo...
    Aeva secures ISO 27001 certification for advanced sensing technologies
    Aeva, specializing in advanced sensing and perception technologies, has recently announced its achievement of the ISO/IEC 27001:2022 certification. This certification marks a significant step for the company, highlighting its dedication to information security management within the automotive and other industries, according to a press release on July 5. The ISO 27001 standard mandates that companies establish, execute and uphold an Information Security Management System (ISMS) that adequately...
    Tata Technologies engages with a global EV battery-maker for battery design and development program
    Tata Technologies has been selected by a global electric vehicle battery manufacturer to deliver the first battery design and development program for a customer’s EV engagement, the company announced July 18. The disclosure, which does not name the global EV battery-maker, came on the sidelines of the reporting of financial results for the June 2024 quarter. The company also disclosed that it has been selected by a European luxury-car maker for developing a cloud-based, holistic, virtu...
    Cyient to set up subsidiary for semiconductor business; stock rallies 7%
    Cyient has announced a strategic expansion in its semiconductor business through the creation of a fully owned subsidiary, in a report published by Business Standard on July 12. Following the announcement, shares of Cyient saw a significant increase of up to 7%. Krishna Bodanapu, vice chairman and managing director of Cyient Ltd., highlighted the initiative as a move to enhance the company's capabilities in Application Specific Integrated Circuit (ASIC) turnkey design and manufacturing. With ...
    KD inaugurates new optic tech lab and facility in Madrid
    KDPOF, now rebranded to KD, has inaugurated an optical interconnect laboratory, and assembly and test facility in Tres Cantos, Madrid. The initiative follows a €28 million funding received from the European Commission as part of an Important Projects of Common European Interest (IPCEI) program, as reported by eeNews Europe on July 10. The funding aims to establish a high-quality packaging factory for cutting-edge optoelectronic devices in Europe. Additionally, a new prototype laborat...
    Serve Robotics announces expanded Los Angeles delivery, extended Lidar supply agreement
    In a press release on June 27, Serve Robotics announced the expansion of its delivery services to Koreatown in Los Angeles. This move comes alongside an announcement that the company has expanded its Lidar supply agreement with Ouster, which involves equipping 2,000 robots with upgraded Lidar sensors to enhance performance. This expansion into Koreatown began with the onboarding of local merchants in partnership with Uber Eats, allowing residents to receive deliveries via Serve's robots. The ...
    Vishay Intertechnology to exhibit at Electronica China 2024
    In a press release on July 8, Vishay Intertechnology has announced its participation in Electronica China 2024, scheduled for July 8–10 at the New International Expo Center in Shanghai. The company aims to showcase its expansive range of passive and semiconductor solutions designed to cater to the burgeoning automotive and e-mobility sectors, emphasizing their utility in extreme operating conditions. At the event, Vishay will unveil its latest innovations, including the 1,200 V MaxSiC ...
    STMicroelectronics to showcase automotive technologies at Electronica China 2024
    As reported in a press release on July 5, STMicroelectronics is set to participate in Electronica China 2024 on July 8–10, showcasing an extensive array of solutions under the theme "Our technology starts with You." The company will exhibit over 50 interactive demos across various sectors including automotive, cloud, and other infrastructure. In the automotive sector, ST highlights its 30 years of experience by presenting comprehensive solutions for the future of smart e-mobility. The exhib...
    ADAS will evolve into an affordable and indispensable component of vehicles, says Tata Technologies' associate VP
    As reported by Autocar Professional on July 7, Sandeep Terwad, the associate vice president (VP) of Tata Technologies, has provided insights on the effect of software-led innovation in the automotive sector, highlighting the shift of vehicles into edge devices in the internet of things realm. Terwad underscored the evolution of advanced driver-assistance systems (ADAS) technologies from basic safety features to sophisticated AI-powered systems that enhance road safety and pave the way for autono...
    LG Innotek sets out new plan to grow its Sensor business to $1.4 billion by 2030
    According to a press release on July 3, LG Innotek has announced a new plan to accelerate the growth of its Vehicle Sensing Solution business by leveraging its optical technologies to drive innovation in the future mobility sector. A key pillar of the plan, identified as High Performance Lidar, will see the LG subsidiary pursue a targeted approach to the Lidar market. Here, it recently established a dedicated business division for Lidar, reporting directly to the CEO. The development and busi...
    CEA-Leti advances in automotive chiplet architecture development
    CEA-Leti is advancing in the development of a scalable chiplet architecture tailored for the automotive industry, alongside introducing new automated tools for design exploration, eeNews Automotive reported June 26. These innovations are in response to the evolving automotive sector that is leaning toward software-defined vehicles and zonal architectures, necessitating the integration of chiplets and novel design instruments. During a feasibility study initiated two years prior with a si...
    Cadence and Dream Chip unveil new automotive system-on-chip at Embedded World 2024
    At the recent Embedded World 2024 event in Nuremberg, Germany, Cadence and Dream Chip showcased Dream Chip's latest automotive system-on-chip (SoC), which integrates the Cadence Tensilica Vision P6 DSP IP and design IP controllers. This SoC was developed using the complete Cadence Verification solution along with a full-flow digital implementation process, including sign-off, as reported in a press release on June 18. The exhibition, which took place from April 9 to 11, featured the SoC'...
    Synopsys achieves certification of its AI-driven digital and analog flows and intellectual property on Samsung advanced SF2 GAA process
    In a press release on June 12, Synopsys has announced that its AI-driven digital design and analog design flows have been certified for Samsung Foundry's SF2 process, with multiple test-chip tapeouts validated for product readiness. The reference flows, which leverage Synopsys.ai, boost productivity, enhance performance, power and area (PPA) and expedite analog design migration for Samsung Foundry's latest Gate-All-Around (GAA) process technologies. The Samsung SF2 process was improved using Syn...
    Race to cut costs on EVs will hit suppliers: Stellantis CEO
    Stellantis CEO Carlos Tavares believes that the ongoing global transition to electric vehicles is a game of severe cost-cutting, and automotive suppliers must figure out how to reduce costs and adapt to the new requirements or risk losing their business in the next five to 10 years, according to a news report published by The Detroit News on May 29. Tavares was speaking during a fireside chat at the Berstein Strategic Decisions Conference in New York City, the report said. Tavares said tha...
    Vishay Intertechnology announces AC05 and AC05-AT 5W cemented, axial-leaded wirewound resistors
    In a press release on May 29, Vishay Intertechnology announced that 5-W devices in its AC and AC-AT series of cemented, axial-leaded wirewound resistors are now available with a pick-and-place-friendly SMD lead-bending option, the WSZ lead form, that allows the devices to be used as surface-mount components. The Vishay Draloric AC05 WSZ and AEC-Q200-qualified AC05-AT WSZ are also offered in a non-inductive version AC05-NI WSZ for fast-switching circuits. Resistors with the WSZ lead form can b...
    Stanley Electric to dissolve and liquidate subsidiary in Japan
    Stanley Electric has decided to dissolve and liquidate one of its consolidated subsidiaries in Japan, the company said in a press release on May 16. The subsidiary, Stanley Ina Works, has been operating as a manufacturing base for more than 50 years for the Japanese supplier’s Electronic Components business and Applied Electronic business. It produces LCD and their applied products — electronic substrates products for LED car lights. The company has decided to dissolve and liquidate as pa...
    PCIM Europe 2024: Infineon to showcase latest semiconductor solutions
    At PCIM Europe 2024, Infineon Technologies will showcase its latest semiconductor, software and tooling solutions, according to a press release on May 28. Under the motto — Driving decarbonization and digitalization. Together. — Infineon will demonstrate its power electronics portfolio covering all relevant power technologies in silicon (Si), silicon carbide (SiC) and gallium nitride (GaN). Infineon's demonstration also includes eMobility, eTransportation and charging solutions....
    Arbe updates about new business development
    According to a press release on May 22, Arbe Robotics Ltd. revealed that a major Japanese automotive client is set to finalize a comprehensive data collection project utilizing Arbe's radar solution by 2024, aimed at advancing their advanced driver assistance systems/automated driving (ADAS/AD) architecture. Nvidia has integrated a range of digital sensors from top industry players, including Arbe's Perception Radar, into its Omniverse Cloud APIs. This collaboration is designed to foster a ro...
    Murata obtains ISO 26262 certification for functional safety in automotive applications
    Murata Manufacturing obtained the ISO 26262 development process certification for Functional Safety Automotive ISO 26262 from the German third-party certifier SGS-TÜV Saar GmbH in February. The official certification ceremony took place May 21 at the company’s headquarters in Kyoto, Japan, as reported in a press release May 21.  This certification validates that Murata’s development process for hardware and software, as well as systems integrating them, complies with Automotive Safe...
    X-Fab enhances 180 nanometer automotive-grade high-voltage CMOS foundry solution
    X-Fab Silicon Foundries SE (X-Fab), an analog/mixed-signal and specialty foundry, has introduced updates to its XP018 high-voltage complementary metal-oxide-semiconductor (CMOS) fabrication platform. The platform now includes new 40-V and 60-V high-voltage primitive devices that offer an extended safe operating area (SOA) for improved operational robustness, as reported in a press release on May 16. These second-generation devices also boast a significant reduction in RDSon figures, up t...
    Marquardt to focus on human-machine interfaces and hologram systems development
    According to a press release on May 14, Marquardt announced that it has registered almost 100 new patents and property rights in the 2023 financial year. The company's focus has been on creating human-machine interfaces (HMIs) that cater to the growing demand for autonomous vehicles with a new operating architecture. This move aligns with the ongoing technological shift toward autonomous cars. Marquardt is also actively working on the development of hologram systems that enhance perception wi...
    Solectrix to present automotive imaging solutions at ADAS & Autonomous Vehicle Expo 2024
    Solectrix, a provider of imaging solutions, has announced its participation in the upcoming ADAS & Autonomous Vehicle Expo, where it will showcase two innovative imaging products. The event, scheduled from June 4th to 6th, 2024, will provide an opportunity for Solectrix to demonstrate its technologies, according to a press release on May 7 . One of the highlights of Solectrix's presentation is the SXIVE Calibration SDK, which expands its comprehensive image processing ecosystem, SXIVE. Th...
    SK Keyfoundry announces enhanced 0.13 micrometer Bipolar-CMOS-DMOS process
    SK Keyfoundry, an 8-inch pure-play foundry in South Korea, announced that it is offering an enhanced 0.13 micrometer (㎛) Bipolar-CMOS-DMOS (BCD) process to enable automotive power fabless companies to design high-performance automotive semiconductor products, according to a press release on April 25. SK Keyfoundry's enhanced 0.13㎛ BCD process has met the requirements of AEC-Q100's Grade-0 reliability test standard for automotive electronic components, and is qualified to be a suitabl...
    AMS Osram plans to expand production and chip technologies in Austria by 2030
    AMS Osram is sustainably strengthening its development and production site in Premstätten, Austria. Aldo Kamper, CEO of AMS-Osram AG, together with Federal Minister Martin Kocher and the Governor of Styria Christopher Drexler presented plans to invest a total of €588 million in the development and production site in Premstätten by 2030, as reported in a press release on May 13. Within the framework of the European Chips Act, funding of up to €200 million has been app...
    Keysight secures approval to emerge as technical service provider for UNECE regulation
    As reported in a press release on May 8, Keysight Technologies' device security research lab, Riscure Security Solutions, has received formal approval from the Netherlands Vehicle Authority (RDW) to become a designated technical service provider for approval of the United Nations Economic Commission for Europe (UNECE) R155 and R156 regulations. Created by the World Forum for Harmonization of Vehicle Regulations (WP.29), the UNECE R155 and R156 regulations establish cybersecurity and software ...
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