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    A new tug of war for semiconductors: data centers vs. automakers
    The automotive semiconductor market has been navigating a period of unusual volatility. On one side, near-term demand pressures are easing. The slowdown in electric vehicle adoption is reducing average chip content per vehicle, since EVs typically contain significantly more semiconductors than internal combustion models. Tariffs are further dampening global vehicle demand. S&P Global Mobility estimates suggest up to 0.6 million fewer vehicles will be produced in 2026 because of trade barrier...
    Insights
    Reducing emissions from battery production will be key to true EV sustainability
    Electric vehicles are considered more environmentally friendly than internal combustion engine (ICE) vehicles due to their zero tailpipe emissions. However, new environmental, social and governance (ESG) standards are evaluating the sustainability of the entire value chain, not just the operational life of the product, and questioning how eco-friendly EVs really are. At the center of this discourse is the lithium-ion (Li-ion) battery, the most critical component that powers the vehicle. The c...
    Insights
    Dutch move on Nexperia triggers nervousness among auto suppliers and OEMs
    On Monday, Oct. 13, the Dutch government took a decisive step to assume control of Nexperia, the Nijmegen-based semiconductor manufacturer owned by mainland China’s Wingtech. Officials described the intervention as “highly exceptional,” citing governance shortcomings, national security risks and the need to safeguard critical technological capabilities for the Netherlands and Europe. Nexperia, headquartered in Nijmegen, the Netherlands, has been owned by Wingtech since 2018. Wingtech is...
    Insights
    ChipSync and Cortus collaborate to offer tailored SDV solutions in India
    ChipSync and Cortus are collaborating to develop electronic automotive and consumer solutions for the Indian market. ChipSync is an innovator in connected car technology in India, while Cortus specializes in reduced instruction set computing, version 5 (RISC-V) chips and AI inference chiplets. The partnership focuses on integrating Cortus' RISC-V automotive chips and AI chiplets with ChipSync's connected car software solutions, aiming to advance automotive and software-defined vehicle techn...
    News
    Novosense, UAES and Innoscience form alliance to advance power electronics in new-energy vehicles
    Novosense Microelectronics, United Automotive Electronic Systems (UAES) and Innoscience have entered into a strategic alliance to advance power electronics in new-energy vehicles (NEVs). The collaboration will focus on developing intelligent integrated gallium nitride (GaN) products to enhance GaN driving and protection features, thereby supporting higher power density and facilitating wider application in automotive systems. GaN, known for its superior material properties compared to traditi...
    News
    GlobalFoundries, Infineon, Silicon Box, STATS ChipPAC, Tier IV join Imec Automotive Chiplet Program
    Imec announced that GlobalFoundries has joined its Automotive Chiplet Program (ACP) as a foundry partner. Alongside GlobalFoundries, semiconductor and system companies such as Infineon, Silicon Box, STATS ChipPAC and Japanese autonomous driving technology developer Tier IV have also committed to the ACP. This expansion aims to enhance Imec's network and accelerate the development and adoption of advanced chiplet architecture tailored for the automotive industry's specific requirements. With t...
    News
    Renesas Electronics considers selling $2 billion Timing division amid industry interest
    Renesas Electronics Corp. is considering selling its Timing division, a move that could see the unit valued at nearly $2 billion. The Japanese semiconductor firm has engaged JPMorgan to explore this potential divestment, which is in its preliminary stages. There is expected interest from major players in the chip industry, such as Texas Instruments from the US and Germany's Infineon.  Renesas' Timing division specializes in integrated circuits responsible for managing clock, timing and s...
    News
    Dutch government takes control of Nexperia amid governance and security concerns
    The Dutch Department of Economic Affairs has assumed control of semiconductor manufacturer Nexperia due to concerns about the transfer of crucial technological knowledge to its Chinese parent company, Wingtech, according to an Oct. 14 report by Cybernews. The intervention was prompted by signals indicating serious governance shortcomings within Nexperia, which posed a threat to the technological capabilities and economic security of both the Netherlands and Europe. The Goods Availability Act was...
    News
    Keysight unveils AE6980T optical automotive Ethernet test solution at IEEE event in France
    Keysight Technologies has introduced the AE6980T nGBASE-AU Optical Automotive Ethernet Transmitter Test Solution, the first platform designed to qualify next-generation optical automotive Ethernet PHYs that align with the IEEE 802.3cz standard. This unveiling took place at the 2025 IEEE SA Ethernet & IP at Automotive Technology Day held in Toulouse, France. The IEEE 802.3cz standard pertains to multigigabit optical automotive Ethernet ranging from 2.5 G to 50 G over multimode fiber, offering...
    News
    DENSO launches innovative products to enhance EV efficiency
    DENSO has announced the development of new electrification products aimed at improving energy efficiency, driving performance and reducing charging times for electric vehicles. These innovations are designed to enhance the practicality of EVs and include an inverter to be featured in the new e-axle from BluE Nexus Corp., as well as a cell supervising circuit for measuring battery voltage and temperature, and a shunt current sensor for measuring current. These products will specifically be instal...
    News
    AutoTechInsight Weekly - 13 October 2025
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    News
    Zeekr launches updated 001 with ultrafast charging, improved powertrain
    Mainland Chinese electric-vehicle maker Zeekr has officially launched the updated Zeekr 001 shooting brake, showcasing significant specification upgrades while maintaining its exterior design. The updated model features an official starting price of 269,800 yuan (about $37,826), up from the predecessor's 259,000 yuan. With a limited-time trade-in subsidy of 10,000 yuan, the effective starting price becomes 259,800 yuan. The 2026 Zeekr 001 is developed on a 900-V high-voltage architecture, ...
    News
    Ferrari announces details of its first all-electric car Elettrica
    Ferrari unveiled its first all-electric car, the Ferrari Elettrica, during Capital Markets Day 2025. This marks a significant milestone in Ferrari's multi-energy strategy, which includes internal combustion engines (ICEs), hybrid electric vehicle (HEV) and plug-in hybrid electric vehicle powertrains, and now fully electric drive. The Ferrari Elettrica combines advanced technology and performance while maintaining Ferrari's traditional engineering and craftsmanship. The chassis and bodysh...
    News
    China rolls out stricter export restrictions for rare earth
    China has enforced stricter export controls on rare earth elements and other critical materials necessary for advanced technology manufacturing, as trade negotiations with the US continue. China processes approximately 90% of the world's rare earths, which are utilized in various products such as solar panels and smartphones. This strategic move comes ahead of an expected meeting between Chinese leader, President Xi Jinping, and US President Donald Trump. Beijing had previously restricted ...
    News
    Autoliv, HSAE agree to form JV for automotive safety electronics in mainland China
    Autoliv plans to establish a joint venture with Hangsheng Electric Co. Ltd. (HSAE), a company specializing in automotive electronics, to jointly develop and produce advanced safety electronics tailored to the evolving automotive market in mainland China. The JV is expected to be formally established in the first quarter of 2026, contingent upon receiving regulatory approvals from mainland Chinese authorities. HSAE will have a majority stake of 60% in the JV, with Autoliv owning the remaining 40%...
    News
    Microchip and AVIVA Links achieve Automotive SerDes Alliance Motion Link interoperability
    Microchip Technology and AVIVA Links have achieved the Automotive SerDes Alliance Motion Link (ASA-ML) interoperability milestone, marking a shift toward open standards in automotive connectivity. In October, AVIVA Links announced its acquisition by NXP Semiconductors, reflecting industry support for ASA-ML standards. ASA-ML is being increasingly adopted by original equipment manufacturers and tier 1 suppliers for in-vehicle networking due to its high-speed communication capabilities for cameras...
    News
    STMicroelectronics unveils L98GD8 driver for 48-V automotive systems with advanced features
    STMicroelectronics has introduced the L98GD8 driver, designed for 48-V automotive power systems, featuring eight configurable channels for driving metal-oxide-semiconductor field-effect transistors (MOSFETs) in various configurations. This driver can operate from a 58-V supply, offering diagnostics and protection to enhance safety and reliability. The 48-V powernet is beneficial for car manufacturers aiming to improve mild-hybrid systems by supporting integrated starter-generators (ISGs), enhanc...
    News
    Sumitomo Riko adopts Ansys' AI to enhance automotive component design and manufacturing
    Sumitomo Riko is integrating Ansys' AI technology to enhance efficiency in the design and manufacturing of automotive components. SimAI, which analyzes both new and legacy simulation data, is being used to create AI models that can quickly predict performance. The deployment of SimAI helps Sumitomo Riko accelerate complex computational tasks such as anti-vibration design, battery cooling, magnetic field analysis and mixing heat transfer analysis. As a global manufacturer of high-per...
    News
    Diodes introduces PI7C9X762Q automotive-compliant UART bridge for EV design
    Diodes Inc. has introduced the PI7C9X762Q, a high-performance automotive-compliant inter-integrated circuit/serial peripheral interface (I2C/SPI-bus-to-dual-channel) universal asynchronous receiver-transmitter (UART) bridge, designed to meet the needs of electric vehicle designs. The device is particularly suitable for smart cockpits, central controllers, input/output (I/O) module controllers, advanced driver assistance systems, telematics and zonal gateways due to its low-po...
    News
    Omnivision unveils 5-MP sensor for in-cabin monitoring with Nyxel technology
    Omnivision has introduced the OX05C, the first 5-megapixel (MP) back-side illuminated global shutter high-dynamic range sensor designed for in-cabin driver and occupant monitoring systems. This new sensor, part of its Nyxel near-infrared technology family, will be demonstrated at AutoSens Europe in Barcelona, Spain. The OX05C offers high-quality imaging with a pixel size of 2.2 micrometers (µm) and utilizes Nyxel technology for enhanced low-light performance at the 940-nanometer near in...
    News
    Vishay expands inductor and frequency control product lines with over 2,000 new SKUs
    Vishay Intertechnology has announced the successful expansion of its inductor and frequency control device product lines, which were initially announced in September 2024. This expansion has led to the release of over 2,000 new stock-keeping units (SKUs) across nearly 100 series, with more rollouts planned for 2025. The expanded product offerings improve sourcing options for customers, offering broader inductance and voltage ranges, enhanced noise suppression, and additional size variations suit...
    News
    Bosch integrates NVIDIA DRIVE AGX Thor into vehicle platforms for AI-driven advancements
    Bosch has initiated a strategic integration of the NVIDIA DRIVE AGX Thor platform into its upcoming compute and electronic control unit (ECU) architectures. This collaboration aims to advance Bosch's provision of AI-driven solutions for software-defined vehicles (SDVs), reflecting the rising trend among automakers toward centralized computing platforms that can manage both safety-critical tasks and AI workloads. Industry analysts predict that by 2030, over half of new vehicles sold will adopt...
    News
    Mainland Chinese automakers’ tie-ups with Huawei to speed up smart EV launches
    Mainland China’s state-run automakers have pinned hopes on their partnerships with Huawei to gain a solid foothold in the country’s highly competitive electric vehicle (EV) market. Under Huawei-backed Harmony Intelligent Mobility Alliance (HIMA), mainland Chinese automakers have introduced a diverse range of EVs featuring Huawei’s smart vehicle technologies over the past three years. In late September, SAIC became the fifth automaker to join the auto alliance, following the footsteps of Se...
    Insights
    Betamek collaborates with Jiangsu Yibang to advance EV charging solutions in ASEAN
    Betamek Bhd., an original design manufacturer and provider of electronics manufacturing services for the automotive industry, has announced a memorandum of understanding (MOU) with Jiangsu Yibang New Energy Technology Co. Ltd., a mainland Chinese company known for its expertise in new-energy vehicle charging protocol conversion technologies. Betamek, through its subsidiary Betamek Research Sdn. Bhd., aims to collaborate with Yibang in areas such as technical research and development, supply...
    News
    Volkswagen to integrate Xpeng's autonomous driving technology in China EVs by 2026
    Volkswagen plans to incorporate Xpeng's autonomous driving technology, XNGP, into its China electric vehicles starting in 2026, with the first model being a midsize sport utility vehicle developed jointly with Xpeng. Initially, autonomous driving development was assigned to Cariad China, Volkswagen's software division. In July 2023, Volkswagen acquired a 4.99% stake in Xpeng for €700 million. By early 2024, both companies confirmed their collaboration on two midsize SUVs expected to launch in ...
    News
    Quintauris collaborates with Everspin Technologies to enhance reliability of RISC-V platforms
    Quintauris, the company founded as a single source to enable compatible RISC-V–based products, and Everspin Technologies, a leader in magnetoresistive RAM (MRAM) and spin-transfer torque MRAM (STT-MRAM), announced a strategic collaboration to bring advanced memory solutions into the Quintauris ecosystem. The collaboration aims to strengthen the reliability and safety of RISC-V–based platforms, particularly for automotive, industrial and edge applications where data persistence, ...
    News
    Keysight Technologies enhances EV production testing with new EV2020B and EV2020BE platforms
    Keysight Technologies has enhanced its end-of-line (EOL) test portfolio with the introduction of the EV2020B EV Manufacturing Functional Test Platform and the EV2020BE EV Manufacturing Functional Test Platform for Electric Vehicle Supply Equipment (EVSE). These new solutions offer automakers and EVSE manufacturers a scalable and flexible production testing approach, aiming to accelerate time-to-market, reduce costs, and ensure compliance with evolving industry standards. According to a report...
    News
    Hesai Technology to reach lidar production milestone by 2025
    Hesai Technology announced that it will produce its 1-millionth lidar unit by 2025, making it the first lidar company to reach this production milestone annually, according to a press release on Oct. 3. The company said that its achievement showcases the company's ability to manufacture large-scale, high-quality lidar efficiently and aligns with Hesai's corporate vision to enable 1% of vehicles worldwide with 3D perception by 2025. Meanwhile, Keysight Technologies has expanded its end-of-line...
    News
    AutoTechInsight Weekly - 6 October 2025
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    News
    Codasip earns TÜV SÜD safety certification for L735 and L739 processor cores
    In a press release on Oct. 1, Codasip announced that its high-performance embedded processor cores, the Codasip L735 and Codasip L739, have gained TÜV SÜD certification for functional safety. The L735 has been certified to ASIL-B, while the L739 has attained certification to ASIL-D Automotive Safety Integrity Level as per ISO 26262 standards. These certifications affirm that the processor IPs fulfill stringent functional safety requirements crucial for automotive applications, making them read...
    News
    Forvia eyes more than €1 billion in annual revenue from India within the next five years
    Forvia is expanding its presence in the Indian automotive market with goal to generate more than €1 billion in revenue within the next five years, Autocar Professional reported Oct. 2. The French automotive supplier, which is growing at approximately 11% in India, plans to achieve this revenue target through an investment of approximately €218 million, focusing on local manufacturing and advanced technology. Martin Fischer, group CEO of Forvia, has emphasized India's growing importan...
    News
    TE Connectivity launches new electronic control unit connector portfolio for software-defined vehicles
    TE Connectivity (TE) has launched its Inside Device Connectivity portfolio to address the evolving requirements of automotive electronic control units (ECUs) and next-generation vehicle architectures, including software-defined vehicles (SDVs). The new lineup includes board-to-board, wire-to-board, flex-to-board and wire-to-wire connector solutions engineered for compact, high-performance applications within zonal architectures and key systems such as: Onboard charger (OBC), inverter...
    News
    Sony Semiconductor announces IMX775 CMOS camera sensor for advanced in-cabin automotive monitoring
    Sony Semiconductor Solutions announced the upcoming release of the IMX775 CMOS RGB-IR image sensor, featuring the smallest pixel size of 2.1 micron (µm). This sensor combines RGB and infrared (IR) imaging on a single chip, offering a resolution of approximately 5 effective megapixels, designed specifically for in-cabin monitoring cameras. This development comes amid increasing demands for advanced safety performance in automobiles, with laws mandating the monitoring of driver status and passeng...
    News
    Tobii and STMicroelectronics launch mass production of advanced in-cabin sensing technology
    Tobii and STMicroelectronics have commenced mass production of an advanced interior sensing system for a premium European carmaker, enhancing driver and passenger monitoring. This cost-effective solution uses a single camera that integrates Tobii's interior-sensing technology with STMicroelectronics' imaging sensors, offering high-quality imaging both in daytime and nighttime environments. Adrian Capata,  senior vice president of Tobii Autosense, highlighted the collaboration with STMi...
    News
    Innoviz Technologies secures ISO/IEC 17025:2017 certification enhancing lidar testing capabilities
    Innoviz Technologies announced that its hardware qualification testing laboratories have received the ISO/IEC 17025:2017 certification. This certification is an internationally acclaimed standard that confirms the competence of testing and calibration laboratories. This achievement distinguishes Innoviz as among the limited number of lidar companies with accredited in-house testing capabilities, which facilitates faster testing durations, parallel product development and an expedited time to mar...
    News
    Mercedes-Benz collaborates with Athos Silicon to enhance autonomous driving technology
    Mercedes-Benz has announced a strategic collaboration with Athos Silicon, a semiconductor company formed by former engineers from Mercedes-Benz Research & Development North America (MBRDNA). This partnership focuses on advancing the adoption of advanced chiplet architecture for next-generation autonomous driving platforms. The initiative showcases Mercedes-Benz's innovation in Silicon Valley, California, and commitment to developing strategic ecosystems. The company's research and develop...
    News
    GlobalFoundries partners with Egis to develop new direct time-of-flight sensors on 55-nm platform
    At its annual Technology Summit in Shanghai, GlobalFoundries (GF) announced a collaboration with Egis Technology to develop new direct time-of-flight (dToF) sensors on GF's 55-nanometer (nm) platform, as reported in a press release on Sept. 25. The innovation aims to support smart sensing technologies in smart mobile, internet of things, and automotive end markets. GF has introduced its first-generation front-side illuminated single-photon avalanche diode (FSI SPAD) device, which boasts super...
    News
    ROHM unveils new smart switches optimized for zonal controllers
    ROHM has introduced a new series of high-side smart switches, known as Intelligent Power Devices (IPDs), with advanced current-sensing capabilities and ON resistances ranging from 9 milliohm to 180 milliohm. These switches are designed to protect loads and subsystems from issues such as overcurrent, overvoltage and overtemperature, ensuring the reliable operation and protection of sensitive automotive components such as lighting, door locks and power windows. They also offer enhanced safety feat...
    News
    Schaeffler aims to become leading motion technology company; sets financial target to double EBIT margin to 6-8% by 2028
    On Sept. 16, Schaeffler hosted a Capital Markets Day in Frankfurt, Germany, the first after the acquisition of Vitesco Technologies. CEO Klaus Rosenfeld, along with other executives, outlined its strategic vision to become a leading motion technology company. The integration of Vitesco has bolstered Schaeffler's portfolio, especially in power electronics, electronic control units and sensors, aiming to solidify its position as a top global player across the ...
    Briefing
    Hyundai Mobis leads initiative to localize South Korea's automotive semiconductor industry
    Hyundai Mobis is spearheading a collaboration with over 20 companies and research institutions to enhance South Korea's automotive semiconductor industry. This initiative, the first private-sector-led K-automotive semiconductor cooperation, aims to foster domestic development and localize core semiconductors. The company hosted the inaugural Auto Semicon Korea (ASK) event on Sept. 29 at DoubleTree by Hilton Seoul Pangyo, attended by major companies such as Samsung Electronics, LX Semicon and SK ...
    News
    LG Chem develops liquid photo-imageable dielectric for advanced semiconductor packaging
    LG Chem has announced the completion of the development of a liquid photo-imageable dielectric (PID), a pivotal material for advanced semiconductor packaging. This development positions LG Chem to meet the increasing demand in AI and high-performance semiconductor sectors. PID is essential for creating ultrafine interconnects between semiconductor chips and substrates, thus enhancing device reliability and performance through improved circuit fidelity. LG Chem's liquid PID offers benefits such a...
    News
    AutoTechInsight Weekly - 29 September 2025
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    News
    Synopsys collaborates with TSMC to advance multidie solutions for AI chip innovation
    Synopsys has announced its ongoing collaboration with TSMC to deliver multidie solutions that support TSMC's advanced processes and packaging technologies, enhancing innovation in AI chip and multidie design. This collaboration has resulted in successful customer tape-outs with Synopsys' 3DIC Compiler exploration-to-signoff platform. Synopsys has also made available certified digital and analog flows with support from Synopsys.ai on TSMC's N2P and A16 processes, using the TSMC NanoFlex architect...
    News
    STMicroelectronics leads STARLight project to advance silicon photonics in Europe
    The STARLight project is a collaboration of industrial and academic partners aiming to establish Europe as a leader in 300-mm silicon photonics (SiPho) technology by creating a high-volume manufacturing line and developing advanced optical modules to support a comprehensive value chain. Running until 2028, the project focuses on developing application-driven solutions for industry sectors such as data centers, AI clusters, telecommunications and automotive markets. Led by STMicroelectr...
    News
    IAA Mobility 2025: Key E/E and semiconductor trends and announcements
    IAA Mobility 2025, held in Munich from Sept. 9-14, brought together global automakers, semiconductor leaders, tech innovators and mobility service providers under the theme “It’s All About Mobility.” The event marked a transition from a traditional auto show to a comprehensive mobility and technology platform, showcasing over 350 world premieres from more than 750 exhibitors across 37 countries. This evolution highlighted a strong focus on electrification, software-defined vehicles, semico...
    Insights
    Raytron enhances safety for Level 4 autonomous vehicles with thermal imaging and radar technology
    Raytron has introduced high-frame-rate automotive thermal cameras that enable companies such as Didi Autonomous Driving and GAC Aion to conduct Level 4 robo-taxi tests in the extreme heat of Turpan, China. In temperatures reaching 50°C, Raytron's thermal imaging system, equipped with AEC-Q100 certified sensors, operates reliably within a range from -40°C to 85°C. Its dual-layer encapsulation provides protection against sand and dust, delivering accurate environmental data where traditional ca...
    News
    Littelfuse launches high-voltage cartridge fuses for next-gen automotive electronics
    Littelfuse has introduced its 828 and 827 Series high-voltage cartridge fuses, which are compliant with AEC-Q200 standards. These fuses are designed for next-generation automotive electronics, with the 828 Series rated at 1,000 VDC and the 827 Series at 800 VDC. They provide a compact and reliable solution for circuit protection in electric vehicle systems, offering a 10-kiloampere (kA) interrupting rating, a wide operating temperature range from -55°C to 125°C, and various mounting configurat...
    News
    Wayve unveils Gen 3 robot platform powered by NVIDIA DRIVE AGX Thor for autonomous driving
    Wayve has announced the development of its Gen 3 robot platform, which will utilize NVIDIA DRIVE AGX Thor, an advanced automotive-grade AI computer. This new platform represents the next step for Wayve's global development fleet, supporting the advancement of its AI Driver software into more secure, capable and scalable automated driving systems. The Gen 3 platform aims to progress self-driving technology to Level 3 and Level 4, necessitating a flexible and powerful computing capability to ma...
    News
    SK Keyfoundry unveils advanced multilevel thick IMD process for capacitors
    SK Keyfoundry, a South Korean 8-inch pure-play foundry, has unveiled its multilevel thick intermetal dielectric (IMD) process for capacitors, boasting high breakdown voltage characteristics. These characteristics contribute to enhanced safety, reliability and lifespan while improving the noise immunity of semiconductor devices. The process facilitates the stacking of up to three IMD layers, achieving a total thickness of up to 18 micrometers (μm) in a metal-insulator-me...
    News
    Minda Corp. targets annual revenue to reach nearly $2 billion in FY 2029/30
    Minda Corp., the flagship company of India-based Spark Minda Group, has outlined ambitious revenue growth plans targeting revenue of over 175 billion rupees (nearly $2 billion) for the fiscal year 2029/30, a three-and-a-half-fold increase from its current revenue base, Autocar Professional reported Sept. 24. This growth is expected to be driven by increased contributions from the passenger vehicle segment, premium products evolution, electrification advancements and expanded export activities. ...
    News
    Volvo EX90 to receive significant upgrades for 2026 with enhanced safety and charging
    Volvo Cars has announced significant hardware and software upgrades to its EX90 model, including enhanced safety features and increased electrical capacity for the 2026 model year (MY) cars. The electric sport utility vehicle will benefit from an additional NVIDIA Drive AGX Orin processor, replacing the older NVIDIA Xavier chip, increasing its computational power to 500 trillion operations per second. This upgrade enables advanced safety capabilities through the car's lidar sensor, including ...
    News
    LG Innotek plans to invest $190 million in new production facility in Mexico
    LG Innotek is planning to establish a new production center in Querétaro, Mexico. According to the Querétaro state government, the South Korean supplier will invest $190 million in the facility, which will focus on the production of cameras, LEDs, motors and automotive components. The new factory will be situated in the Kaizen Industrial Park in Colón, Querétaro, and the initial phase is expected to employ 630 people. “They are going to invest about US$190 million. The first p...
    News
    BYD says it has backup plan if access to NVIDIA chips is cut off — report
    Mainland Chinese electric-car maker BYD has a contingency plan in place should it face restrictions on using NVIDIA chips in its vehicles, according to a report from CNBC on Sept. 23, citing Stella Li, the company's executive vice president. Although the mainland Chinese government has not directed BYD to discontinue using NVIDIA products, Li emphasized the importance of having a backup plan. She refrained from detailing this alternative but mentioned BYD's ability to swiftly navigate supply cha...
    News
    MIPI A-PHY reaches milestone of first SerDes standard to enter mass production with global automotive OEM
    The MIPI Alliance, an international organization dedicated to developing specifications for standardizing wired interfaces in mobile and other connected ecosystems, announced a significant milestone with the first installation of an automotive-grade SerDes chipset based on its MIPI A-PHY specification by a global automotive original equipment manufacturer. The event marks A-PHY as the first industry-standardized automotive SerDes solution to enter mass production. Velinktech, a contribut...
    News
    STMicroelectronics joins FiRa Consortium board to advance ultra-wideband technology
    STMicroelectronics announced the appointment of Rias Al-Kadi, the general manager of its Range and Connectivity Division, to the board of directors of the FiRa Consortium. This consortium is an industry body focused on advancing secured fine ranging and positioning using ultra-wideband (UWB) technology. STMicroelectronics is invested in the development of the IEEE 802.15.4ab amendment, which builds on previous UWB advancements, aiming to enhance system performance and broaden UWB's scope of appl...
    News
    AutoTechInsight Weekly - 22 September 2025
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    News
    Nexperia unveils 100-V MOSFETs for efficient 48-V automotive applications
    Nexperia has introduced new 100-V metal-oxide-semiconductor field-effect transistors (MOSFETs), qualified for AEC-Q101 standards and housed in compact CCPAK1212 (12 mm x 12 mm) copper-clip packaging. These MOSFETs offer ultralow conduction losses with an on-resistance as low as 0.99 milliohm and support safe current levels exceeding 460 amperes. They are particularly suitable for thermally demanding 48-V automotive applications, such as onboard chargers, traction inverters and battery manag...
    News
    STMicroelectronics launches compact, cost-effective power-management integrated circuit for automotive applications
    STMicroelectronics has introduced SPSA068, a compact and cost-effective power-management integrated circuit (PMIC) designed specifically for automotive applications. This PMIC supports ISO 26262 functional safety up to ASIL-B and is qualified to AEC-Q100. It is intended for use with microcontrollers (MCUs) that operate from a single-supply voltage and features a comprehensive suite of components needed for MCU power management. These include a 1A battery-compatible buck voltage regulat...
    News
    Ams OSRAM introduces reliable capacitive sensor for automotive environments
    Ams OSRAM has introduced its AS8580 automotive capacitive sensor with a robust capacitive sensing approach based on IQ demodulation. This technology allows for separating the measured capacitance into parasitic resistive and capacitive parts, enhancing resilience against environmental disturbances and maintaining high sensitivity, making it suitable for both exterior and interior automotive applications. The AS8580 features a sensitivity of 1.9 fF/LSB, enabling accurate detection of touc...
    News
    Ecarx unveils Geely Galaxy M9 featuring advanced AI technologies and rapid presale success
    Ecarx Holdings Inc. has announced the launch of the Geely Galaxy M9, which utilizes its Pikes computing platform and Cloudpeak cross-domain software stack to provide an advanced AI cockpit experience. The Galaxy M9 received over 40,000 orders within 24 hours of its presales starting Aug. 23, indicating a significant demand for this flagship model. The vehicle is powered by the 5-nanometer Qualcomm Snapdragon SA8295P automotive-grade system-on-chip (SoC), enabling advanced gra...
    News
    Aumovio debuts on Frankfurt Stock Exchange as independent automotive technology company
    Aumovio, the former Automotive group sector business of Continental, started trading on the Frankfurt Stock Exchange (FTSE) as an independent automotive technology company on Sept. 18. The company’s shares debuted on FTSE under the ticker symbol AMV0 at €35.00 per share, forming a market capitalization of €3.5 billion. As previously announced, Continental’s shareholders received one share of Aumovio for every two Continental shares held. "Today's listing marks the start of a new ...
    News
    Forvia Hella launches series production of intelligent power distribution module
    Forvia Hella has commenced the series production of its intelligent Power Distribution Module (iPDM), a pioneering product ensuring a reliable and fail-operational power supply for vehicles, for a premium vehicle manufacturer. The iPDM module is designed as a key component for highly automated driving systems and incorporates electronic fuses (eFuses) for the first time in the automotive industry. Forvia Hella, with extensive experience in manufacturing electronic control units, has introduced t...
    News
    Lucid receives $300 million from Uber for robo-taxi initiative using Lucid's EV technology
    As reported in a press release on Sept. 16, Lucid Group has secured a $300 million investment from Uber Technologies. This strategic investment is part of Lucid's next-generation premium global robo-taxi program, announced in July, which will utilize Lucid's electric vehicle technology. The robo-taxi is set to be manufactured at Lucid's Arizona, US, facility and operate exclusively on Uber's ride-hailing platform. This partnership aims to support the development costs associated with the autonom...
    News
    Wind River and Hyundai Mobis collaborate on Mobis Development Studio for software-defined vehicles
    In a press release on Sept. 16, Wind River, an Aptiv company, announced the completion of Mobis Development Studio, a new integrated software development environment for software-defined vehicles (SDVs) created in collaboration with Hyundai Mobis. This system merges Hyundai Mobis' cloud-based vehicle development infrastructure with Wind River Studio Developer to expedite innovation in next-generation SDVs. Mobis Development Studio is a web-based platform that offers an intuitive user interface t...
    News
    Wittenstein collaborates with Qualcomm to integrate Safertos RTOS on Snapdragon Digital Chassis
    Wittenstein High Integrity Systems (WHIS) has announced its collaboration with Qualcomm Technologies to integrate the WHIS SAFERTOS with Qualcomm's Snapdragon Digital Chassis safety island. This integration aims to provide a high-performance, safety-critical solution for automotive applications. With the automotive industry rapidly transforming to incorporate advanced infotainment, advanced driver assistance systems, real-time data processing and enhanced safety measures, the need for ...
    News
    NHTSA initiates probe into 174,000 Model Y over door handle issue
    The US National Highway Traffic Safety Administration (NHTSA) has initiated an investigation into nearly 174,000 Tesla Model Y cars from the 2021 model year following reports of inoperative electronic door handles, Reuters reported Sept. 16. The US federal vehicle safety agency confirmed receiving complaints about the inability to open exterior doors, particularly when parents attempted to exit the vehicle to attend to their child or place their child in the rear seat before starting a journey. ...
    News
    AutoTechInsight Weekly - 15 September 2025
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    RoboSense announces lidar compatibility with NVIDIA DRIVE AGX for autonomous driving
    In a press release on Sept. 12, RoboSense announced the compatibility of its E1, EMX and EM4 automotive-grade digital lidars with the NVIDIA DRIVE AGX platform. As part of the NVIDIA DRIVE ecosystem, RoboSense's high-definition 3D perception data aims to shorten development and testing cycles for autonomous driving technologies and accelerate original equipment manufacturers' deployment of such systems.  The automotive industry's evolution toward Level 3/Level 4 autonomous driving r...
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    IAA Mobility: Axera unveils M57 system-on-chip ADAS solution for global market impact
    Axera, a Chinese AI chip developer, made its debut at IAA Mobility, unveiling an advanced driver assistance system solution featuring its M57 system-on-chip (SoC). This launch aims to influence the global ADAS market. Developed in collaboration with Stradvision, a company specializing in AI visual perception, this all-in-one front-view perception solution incorporates an 8-megapixel high-definition camera and Stradvision's 3D visual perception algorithms. It offers features such as static object...
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    Nexperia launches NMUX27518-Q100 multiplexer for automotive applications
    In a press release on Sept. 9, Nexperia has introduced the NMUX27518-Q100, a new addition to its portfolio of AEC-Q100 (grade 1) qualified devices, aimed at meeting the reliability requirements for challenging automotive applications. This bidirectional 6-channel 2:1 multiplexer is particularly suitable for memory expansion in safety-critical in-vehicle systems, such as the advanced driver assistance systems domain controller, automotive head units and telematics control units.  The...
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    Andes Technology unveils D23-SE core designed for automotive functional safety
    According to a press release on Sept. 3, Andes Technology has announced its new D23-SE core, a compact and secure processor specifically designed for functional safety applications in the automotive sector. Based on the existing D23 processor, the D23-SE is engineered to meet the stringent safety and performance requirements of ASIL-B and ASIL-D automotive systems. It introduces advanced safety mechanisms, such as dual-core lockstep (DCLS) and split-lock operation, which enable the processor to ...
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    Aston Martin to equip future models with Pirelli's Cyber Tire technology
    Pirelli has partnered Aston Martin to integrate Pirelli's Cyber Tire technology into future vehicles produced by the British ultraluxury performance car brand. Cyber Tire is noted as the first system globally capable of collecting data from sensors embedded in the tires, processing it with Pirelli's proprietary software and algorithms, and communicating it in real-time with the vehicle's electronic systems. This technology is enabled through a partnership with Bosch Engineering, allowing full...
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    IAA Mobility 2025: ZF presents latest solutions in chassis, safety and electric powertrain
    ZF is presenting its latest automotive solutions at the IAA Mobility 2025 held from Sept. 9 to 12 in Munich. The Germany-based company focuses on electric, connected and safe driving, offering production-ready drives, by-wire systems and software for developing software-defined electric vehicles. ZF is enhancing passenger car chassis with intelligent actuators and software expertise to meet global market demands. The company supplies steer-by-wire (SBW) and brake-by-wire (BBW) solutions ...
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    IAA Mobility 2025: Ecarx unveils advanced navigation and driving solutions
    Ecarx has introduced a next-generation in-vehicle navigation system and the latest version of its Skyland New intelligent driving solution during the IAA Mobility 2025 event in Munich. The new navigation system is integrated with HERE's navigation platform, which allows for rapid integration, multiscenario adaptability and compliance with international data regulations across over 200 countries and territories. Ecarx's navigation solution is utilized in models from brands such as Lotus, Lynk ...
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    Wolfspeed announces commercial launch of 200-mm silicon carbide materials portfolio
    As reported in a press release on Sept. 10, Wolfspeed announced the commercial launch of its 200-mm silicon carbide (SiC) materials products, which marks a significant step in the company's aim to transition the industry from silicon to SiC. Wolfspeed is also providing 200-mm SiC epitaxy for qualification, which, in combination with its 200-mm bare wafers, enhances scalability and quality for next-generation high-performance power devices. Cengiz Balkas, the chief business officer, said th...
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    IAA Mobility 2025: Volkswagen Group highlights semiconductor procurement strategy with Rivian
    At the 4th Semiconductor Summit during IAA Mobility in Munich, Volkswagen Group brought together industry leaders to outline its semiconductor procurement strategy, strengthen partnerships and foster deeper collaboration between the automotive and semiconductor sectors. A key highlight was the introduction of the group’s new-level procurement model with Rivian and Volkswagen Group Technologies, covering more than 50 semiconductor categories, including core components such as microcontroller...
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    Valens Semiconductor partners with Samsung for next-gen MIPI A-PHY automotive connectivity solutions
    In a press release on Sept. 9, Valens Semiconductor announced a partnership with Samsung to develop the next generation of MIPI A-PHY products, spurred by increasing demand from global original equipment manufacturers for high-speed sensor connectivity. Samsung has historically collaborated with Valens, having been an early investor in the company and a founding member of the HDBaseT Alliance alongside Valens, ProAV's largest interoperable ecosystem with over 200 member companies. The MIPI A-...
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    Seeing Machines develops advanced driver monitoring system technology to detect alcohol impairment in vehicles
    Seeing Machines has unveiled a new feature in its driver monitoring system (DMS) that can detect non-drowsy driver impairment, including alcohol-related impairment. Mike Lenné, chief safety officer of Seeing Machines, said that its technology, already in over 3.7 million cars and 60,000 trucks, has long been able to detect and prevent distracted and drowsy driving. Now, after extensive research and testing, it can also identify alcohol impairment to meet European New Car Assessment Pr...
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    IAA Mobility 2025: Rimac Technology unveils solid-state battery tech, next-generation electric axles
    Rimac Technology has unveiled its portfolio of advanced battery and powertrain technologies at IAA Mobility 2025 in Munich, including the next-generation solid-state solutions and a range of electric axles (e-axles). These technologies aim to reinforce Rimac Technology's position as a top tier 1 supplier, aiding in the automotive industry's electrification. Over the past years, Rimac has announced collaborations with automotive giants such as BMW Group, CEER Motors and Porsche, showcasing its...
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    Vector Informatik accelerates shift-left SDV development, launches scalable SDx Cloud platform
    Synopsys Inc.'s Silver virtual prototyping environment, which supports early software development and testing using virtual electronic control units (vECUs) across all unit types (electronic control units [ECUs], zonal control units [ZCUs] and central compute units [CCUs]), allows suppliers and original equipment manufacturers to integrate, test and debug software independently of hardware availability. By running embedded stacks on virtual hardware, Silver supports application, m...
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    IAA Mobility 2025: Bosch unveils software-driven mobility innovations
    Bosch is showcasing its prowess in both software and hardware at the IAA Mobility 2025 event in Munich. The company highlighted its capacity to offer tailored, intelligent solutions that are integral to software-driven mobility. Bosch's by-wire systems for braking and steering are significant for the development of software-defined vehicles and automated driving, with predicted sales revenue exceeding €7.0 billion by 2032. The focus on by-wire technology marks a shift in vehicle construction t...
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    Infineon introduces software suite for AURIX TC4x microcontroller family in automotive safety
    Infineon Technologies has introduced a comprehensive software portfolio for its latest AURIX TC4x microcontroller family, aimed at enhancing automotive safety applications, according to a press release dated Sept. 4. This portfolio features production-ready ASIL-D drivers for AUTomotive Open System ARchitecture Microcontroller Abstraction Layer (AUTOSAR MCAL) and safety software, designed to expedite time to market by reducing the workload associated with software partitioning, system-level safe...
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    STMicroelectronics extends availability of SPC58 automotive microcontrollers to 2041
    STMicroelectronics extended the longevity program for its SPC58 automotive microcontrollers (MCUs) from 15 years to 20 years. This guarantees the availability of these products until at least 2038. Among its general-purpose lines, the SPC58 H series, which includes up to 10MB of non-volatile memory for data and code storage, will be available until at least 2041. The company's portfolio includes five general-purpose product lines designed for smart gateways and body applications, such as lightin...
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    Schaeffler begins large-scale production of high-voltage inverter brick in mainland China
    Schaeffler has commenced large-scale production of its high-voltage inverter brick in Tianjin, mainland China, within one year, for a leading mainland Chinese automotive manufacturer. This milestone signifies a significant step in Schaeffler's electrification strategy. The inverter brick, powered by cutting-edge silicon carbide (SiC) technology from development partner ROHM, is adaptable and scalable, making it suitable for various battery-electric, plug-in and range-extender vehicles. The in...
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    AutoTechInsight Weekly - 8 September 2025
    Click the link above to download this week's issue
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    IAA Mobility 2025: BMW and Qualcomm unveil Snapdragon Ride Pilot for automated driving
    According to a press release on Sept. 5, Qualcomm Technologies and BMW Group have announced the Snapdragon Ride Pilot, a new automated driving system developed over three years of collaboration. This system utilizes Qualcomm Technologies' Snapdragon Ride system-on-chips (SoCs) and the Snapdragon Ride automated driving software stack, co-developed by the two companies. It is designed to meet high safety standards, supporting automated driving levels from entry-level New Car Assessment Progra...
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    Lear, Palantir expand collaboration for enhanced automotive manufacturing solutions
    Palantir Technologies has announced a five-year expansion of its collaboration with Lear Corporation, a US-based supplier of automotive Seas and E-Systems. Lear will enhance its utilization of Palantir's Foundry, Warp Speed manufacturing operating system and Artificial Intelligence Platform (AIP) across its worldwide manufacturing facilities.  Palantir‘s solutions assist Lear in proactively managing tariff exposure, streamlining administrative processes and dynamically balancing manufa...
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    Renesas introduces RH850/U2A MCAL package for automotive applications with IAR toolchain support
    In a press release Sept. 4, IAR announced that Renesas has introduced a RH850/U2A MCAL package, available for mass production, supporting the IAR toolchain for RH850 (v2.21.2 FS). This package is tailored for the RH850/U2A microcontroller family, which caters to automotive applications requiring high performance, functional safety and low power consumption, such as advanced driver assistance systems, body control and electric vehicle platforms. The MCAL package, qualified for ASIL D MP, is based...
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    ProteanTecs releases local voltage and thermal sensor
    ProteanTecs has announced the release of its silicon-proven LVTS (local voltage and thermal sensor) for the 2 nm process node, featuring a built-in fast over-temperature alert capability. This technology addresses the growing limitations of traditional thermal sensing methods by offering enhanced accuracy and integration, crucial for advanced electronics in high-performance applications such as AI, cloud computing, advanced driver assistance systems and telecommunications infrastructure. Traditi...
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    IAA Mobility 2025: Hyundai Mobis to showcase future mobility technologies
    Hyundai Mobis is participating in IAA Mobility 2025 Europe to showcase its future mobility vision and technological strategy. The company aims to demonstrate its technological competitiveness in Europe using its next-generation core technologies, which include electrification and electronics, with the goal of translating this into global core technology orders. Under the theme Deeper Look to Progress, Hyundai Mobis is presenting its technological innovations to advance future mobility to the Eur...
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    Synopsys enhances semiconductor design with expanded Synopsys.ai Copilot GenAI capabilities
    In a press release on Sept. 3, Synopsys announced the expansion of its Synopsys.ai Copilot generative AI capabilities for semiconductor design, enhancing speed and complexity handling in chip development. Synopsys aims to optimize silicon performance and improve efficiency, with early access customers experiencing significant gains in design quality and productivity. The AI capabilities are streamlining workflows, allowing tasks that took days to be done in hours and those that took hours to be ...
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    IAA Mobility 2025: Foxconn subsidiary FIH to unveil automotive electronics solutions
    FIH, a subsidiary of Hon Hai Technology Group (Foxconn), will unveil its latest automotive electronics innovations at the IAA Mobility 2025 in Munich from Sept. 9–12. Under the theme Driving the Future of Smart Mobility, FIH will present advanced high-performance computing (HPC) platforms, advanced driver assistance systems and telematics control units (TCUs) — highlighting its expertise in technology innovation and seamless system integration. “The global auto industry is rapidly ...
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    Forvia Hella and Tau Motors collaborate to develop innovative onboard charger for electrification
    Forvia Hella and Tau Motors have entered into a partnership to develop a new a virtually isolated onboard charger (viOBC) for electric vehicles. The new solution will enhance Forvia Hella's portfolio of electrification components and contribute to sustainable mobility. The viOBC prototype has successfully completed technological and commercial testing, with series production anticipated within the next two to three years. Jörg Weisgerber, managing director of Electronics at Forv...
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    IAA Mobility 2025: Aisin to showcase innovative technologies for vehicle electrification and intelligence
    Aisin Corp. is set to participate in the IAA Mobility 2025, which will be held in Munich from Sept. 9 to 14. The Japanese supplier's exhibition will focus on electrification and intelligence, aiming to contribute to a carbon-neutral society and enhance transportation safety, comfort and convenience. Aisin will showcase a variety of products, including the energy-efficient electric drive module — the eAxle — and the FR 1-motor hybrid transmission, both of which improve ...
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    IAA Mobility 2025: Bosch gears up to showcase innovative solutions for connected and intelligent transportation systems
    At the IAA Mobility 2025 event in Munich next week, Bosch will showcase its innovative solutions for connected and intelligent transportation systems. The Germany-based automotive supplier will present its solutions for advanced driver assistance systems that will support assisted driving and parking up to SAE Level 2 autonomy. Bosch offers ADAS solutions in three variants: Entry-level, mid-level and premium level. These variants differ in the scope of software function, the numbe...
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    Infineon Technologies expands OptiMOS 6 with new 150-V automotive MOSFET family
    As reported in a press release on Sept. 1, Infineon Technologies has expanded its OptiMOS 6 portfolio with the introduction of the automotive 150-V metal-oxide-semiconductor field-effect transistor (MOSFET) family. These devices are designed to cater to the rigorous demands of modern electric vehicles and are available in three advanced package options: TO-Leadless (TOLL), TO-Leaded with gullwing (TOLG) and TO-Leaded top-side cooling (TOLT). With the growing electrification of vehicles g...
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    BASiC Semiconductor and CASTC partner to advance automotive semiconductor technology
    On Aug. 23, BASiC Semiconductor, based in Shenzhen, China, signed a strategic cooperation agreement with China Automotive Chip (Shenzhen) Technology Co. Ltd. (CASTC) to progress automotive-grade semiconductor technology, according to a report published by World-Energy Media. The partnership aims to enhance the development and application of power semiconductors within the automotive industry. BASiC Semiconductor will utilize its expertise in silicon carbide (SiC) power device research and commer...
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    AutoTechInsight Weekly - 1 September 2025
    Click the link above to download this week's issue
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    ChipFlow partners with ChipFoundry to enhance custom ASIC development workflow
    ChipFlow has formed a partnership with ChipFoundry, uniting two open-source leaders in the chip design field to create a developer-focused and cost-effective workflow for custom application-specific integrated circuit (ASIC) development. This partnership integrates ChipFlow's open-source EDA toolchain with ChipFoundry's fabrication portal, offering a comprehensive design experience that is lightweight, license-free and highly accessible. The collaboration enables users to move from RTL...
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    Arasan Chip Systems releases ISO26262 ASIL-B certified MIPI DSI-2 Rx controller for system-on-chips
    In a press release on Aug. 26, Arasan Chip Systems announced the immediate availability of its ISO26262 ASIL-B Certified MIPI DSI-2 Rx Controller for mobile and automobile system-on-chips (SoCs). This certification confirms that the DSI-2 Rx Controller adheres to stringent safety standards, extending its application potential to industries such as defense and aviation that require fail-safe operation. Arasan's Total Display IP Solution includes a variety of components, such as the VESA DSC En...
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    DeepRoute.ai introduces VLA model to enhance smart driving with automakers
    Chinese self-driving startup DeepRoute.ai is offering a smart driving platform known as the vision-language-action (VLA) model to automakers, according to a report published by Nikkei Asia on Aug. 30. This advanced platform can read road signs and allow vehicles to understand spoken instructions from passengers, enhancing the user experience. DeepRoute.ai describes it as an advanced edition of AI-driven end-to-end (E2E) technology that can recognize surroundings, make decisions and control the v...
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